100-pin (MOC) package image

WL1807MODGIMOCT 現行

WiLink™ 8 工業雙頻組合、2x2 MIMO Wi-Fi 模組

現行 custom-reels 客製 可提供客製捲盤

定價

數量 價格
+

額外包裝數量 | 包裝類型選項 這些產品完全相同,但包裝類型不同

WL1807MODGIMOCR 現行 custom-reels 客製 可提供客製捲盤
包裝數量 | 運送包裝 1,200 | LARGE T&R
庫存
數量 | 價格 1ku | +

品質資訊

等級 Catalog
RoHS
REACH
MSL 等級 / 迴焊峰值
品質、可靠性
及包裝資訊

內含資訊:

  • RoHS
  • REACH
  • 產品標記
  • 引腳鍍層 / 焊球材質
  • MSL 等級 / 迴焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中可靠性監測
檢視或下載
其他製造資訊

內含資訊:

  • 晶圓廠位置
  • 組裝地點
檢視

出口分類

*僅供參考

  • 美國 ECCN:5A992C

封裝資訊

封裝 | 引腳 QFM (MOC) | 100
作業溫度範圍 (°C) -40 to 85
包裝數量 | 運送包裝 250 | SMALL T&R

WL1807MOD 的特色

  • General
    • Integrates RF, power amplifiers (PAs), clock, RF switches, filters, passives, and power management
    • Quick hardware design with TI module collateral and reference designs
    • Operating temperature: –40°C to +85°C industrial temperature grade
    • Small form factor: 13.3 × 13.4 × 2 mm
    • 100-pin MOC package
    • FCC, IC, ETSI/CE, and TELEC certified with PCB, dipole, chip, and PIFA antennas
  • Wi-Fi
    • WLAN baseband processor and RF transceiver support of IEEE Std 802.11a, 802.11b, 802.11g, and 802.11n
    • 20- and 40-MHz SISO and 20-MHz 2 × 2 MIMO at 2.4 GHz for high throughput: 80 Mbps (TCP), 100 Mbps (UDP)
    • 2.4-GHz MRC support for extended range and 5-GHz diversity capable
    • Fully calibrated: production calibration not required
    • 4-bit SDIO host interface support
    • Wi-Fi direct concurrent operation (multichannel, multirole)
  • Bluetooth and Bluetooth low energy ( WL1837MOD only)
    • Bluetooth 5.1 secure connection compliant and CSA2 support (declaration ID: D052427 )
    • Host controller interface (HCI) transport for Bluetooth over UART
    • Dedicated audio processor support of SBC encoding + A2DP
    • Dual-mode Bluetooth and Bluetooth low energy
    • TI’s Bluetooth and Bluetooth low energy certified stack
  • Key benefits
    • Reduces design overhead
    • Differentiated use cases by configuring WiLink™ 8 simultaneously in two roles (STA and AP) to connect directly with other Wi-Fi devices on different RF channel (Wi-Fi networks)
    • Best-in-class Wi-Fi with high-performance audio and video streaming reference applications with up to 1.4× the range versus one antenna
    • Different provisioning methods for in-home devices connectivity to Wi-Fi in one step
    • Lowest Wi-Fi power consumption in connected idle (< 800 µA)
    • Configurable wake on WLAN filters to only wake up the system
    • Wi-Fi and Bluetooth single antenna coexistence

WL1807MOD 的說明

The certified WiLink™ 8 module from TI offers high throughput and extended range along with Wi-Fi ® and Bluetooth ® coexistence (WL1837MOD only) in a power-optimized design. The WL18x7MOD is a Wi-Fi, dual-band, 2.4- and 5-GHz module solution with two antennas supporting industrial temperature grade. The device is FCC, IC, ETSI/CE, and TELEC certified for AP (with DFS support) and client. TI offers drivers for high-level operating systems, such as Linux and Android™. Additional drivers, such as WinCE and RTOS, which includes QNX, Nucleus, ThreadX, and FreeRTOS, are supported through third parties.

定價

數量 價格
+

額外包裝數量 | 包裝類型選項 這些產品完全相同,但包裝類型不同

WL1807MODGIMOCR 現行 custom-reels 客製 可提供客製捲盤
包裝數量 | 運送包裝 1,200 | LARGE T&R
庫存
數量 | 價格 1ku | +

包裝類型選項

您可依零件數量選擇不同包裝類型選項,包含完整捲盤、客製化捲盤、剪切捲帶、承載管或盤。

客製化捲盤是從一個捲盤上剪切下來的連續剪切捲帶,以維持批次和日期代碼可追溯性,依要求剪切至確切數量。依照業界標準,銅墊片會在剪切捲帶兩側連接 18 英吋前後導帶,以直接送至自動組裝機器。針對客製化捲盤訂單,TI 將酌收捲帶封裝費用。

剪切捲帶是從捲盤剪切下來的一段捲帶。TI 可能使用多條剪切捲帶或承載盒,以滿足訂單要求數量。

TI 常以盒裝或管裝、盤裝方式運送承載管裝置,視現有庫存而定。所有捲帶、管或樣本盒之封裝,皆符合公司內部靜電放電與防潮保護包裝要求。

進一步了解

可提供批次和日期代碼選擇

在購物車中加入數量,並開始結帳流程以檢視可用選項,從現有庫存中選擇批次或日期代碼。

進一步了解