產品詳細資料

Processor External MPU Type Module, Transceiver Protocols Wi-Fi 2.4 GHz, Wi-Fi 5 GHz Throughput (max) (MBits) 100 Security Networking security (WPA3) Features 2x2 MIMO, 802.11abgn, AP, Mesh over Wi-Fi based on 802.11s, STA, Wi-Fi direct mode Certifications CE, FCC, ISED, MIC Operating temperature range (°C) -40 to 85 Rating Catalog
Processor External MPU Type Module, Transceiver Protocols Wi-Fi 2.4 GHz, Wi-Fi 5 GHz Throughput (max) (MBits) 100 Security Networking security (WPA3) Features 2x2 MIMO, 802.11abgn, AP, Mesh over Wi-Fi based on 802.11s, STA, Wi-Fi direct mode Certifications CE, FCC, ISED, MIC Operating temperature range (°C) -40 to 85 Rating Catalog
QFM (MOC) 100 178.22 mm² 13.3 x 13.4
  • General
    • Integrates RF, power amplifiers (PAs), clock, RF switches, filters, passives, and power management
    • Quick hardware design with TI module collateral and reference designs
    • Operating temperature: –40°C to +85°C industrial temperature grade
    • Small form factor: 13.3 × 13.4 × 2 mm
    • 100-pin MOC package
    • FCC, IC, ETSI/CE, and TELEC certified with PCB, dipole, chip, and PIFA antennas
  • Wi-Fi
    • WLAN baseband processor and RF transceiver support of IEEE Std 802.11a, 802.11b, 802.11g, and 802.11n
    • 20- and 40-MHz SISO and 20-MHz 2 × 2 MIMO at 2.4 GHz for high throughput: 80 Mbps (TCP), 100 Mbps (UDP)
    • 2.4-GHz MRC support for extended range and 5-GHz diversity capable
    • Fully calibrated: production calibration not required
    • 4-bit SDIO host interface support
    • Wi-Fi direct concurrent operation (multichannel, multirole)
  • Bluetooth and Bluetooth low energy ( WL1837MOD only)
    • Bluetooth 5.1 secure connection compliant and CSA2 support (declaration ID: D052427 )
    • Host controller interface (HCI) transport for Bluetooth over UART
    • Dedicated audio processor support of SBC encoding + A2DP
    • Dual-mode Bluetooth and Bluetooth low energy
    • TI’s Bluetooth and Bluetooth low energy certified stack
  • Key benefits
    • Reduces design overhead
    • Differentiated use cases by configuring WiLink™ 8 simultaneously in two roles (STA and AP) to connect directly with other Wi-Fi devices on different RF channel (Wi-Fi networks)
    • Best-in-class Wi-Fi with high-performance audio and video streaming reference applications with up to 1.4× the range versus one antenna
    • Different provisioning methods for in-home devices connectivity to Wi-Fi in one step
    • Lowest Wi-Fi power consumption in connected idle (< 800 µA)
    • Configurable wake on WLAN filters to only wake up the system
    • Wi-Fi and Bluetooth single antenna coexistence
  • General
    • Integrates RF, power amplifiers (PAs), clock, RF switches, filters, passives, and power management
    • Quick hardware design with TI module collateral and reference designs
    • Operating temperature: –40°C to +85°C industrial temperature grade
    • Small form factor: 13.3 × 13.4 × 2 mm
    • 100-pin MOC package
    • FCC, IC, ETSI/CE, and TELEC certified with PCB, dipole, chip, and PIFA antennas
  • Wi-Fi
    • WLAN baseband processor and RF transceiver support of IEEE Std 802.11a, 802.11b, 802.11g, and 802.11n
    • 20- and 40-MHz SISO and 20-MHz 2 × 2 MIMO at 2.4 GHz for high throughput: 80 Mbps (TCP), 100 Mbps (UDP)
    • 2.4-GHz MRC support for extended range and 5-GHz diversity capable
    • Fully calibrated: production calibration not required
    • 4-bit SDIO host interface support
    • Wi-Fi direct concurrent operation (multichannel, multirole)
  • Bluetooth and Bluetooth low energy ( WL1837MOD only)
    • Bluetooth 5.1 secure connection compliant and CSA2 support (declaration ID: D052427 )
    • Host controller interface (HCI) transport for Bluetooth over UART
    • Dedicated audio processor support of SBC encoding + A2DP
    • Dual-mode Bluetooth and Bluetooth low energy
    • TI’s Bluetooth and Bluetooth low energy certified stack
  • Key benefits
    • Reduces design overhead
    • Differentiated use cases by configuring WiLink™ 8 simultaneously in two roles (STA and AP) to connect directly with other Wi-Fi devices on different RF channel (Wi-Fi networks)
    • Best-in-class Wi-Fi with high-performance audio and video streaming reference applications with up to 1.4× the range versus one antenna
    • Different provisioning methods for in-home devices connectivity to Wi-Fi in one step
    • Lowest Wi-Fi power consumption in connected idle (< 800 µA)
    • Configurable wake on WLAN filters to only wake up the system
    • Wi-Fi and Bluetooth single antenna coexistence

The certified WiLink™ 8 module from TI offers high throughput and extended range along with Wi-Fi ® and Bluetooth ® coexistence (WL1837MOD only) in a power-optimized design. The WL18x7MOD is a Wi-Fi, dual-band, 2.4- and 5-GHz module solution with two antennas supporting industrial temperature grade. The device is FCC, IC, ETSI/CE, and TELEC certified for AP (with DFS support) and client. TI offers drivers for high-level operating systems, such as Linux and Android™. Additional drivers, such as WinCE and RTOS, which includes QNX, Nucleus, ThreadX, and FreeRTOS, are supported through third parties.

The certified WiLink™ 8 module from TI offers high throughput and extended range along with Wi-Fi ® and Bluetooth ® coexistence (WL1837MOD only) in a power-optimized design. The WL18x7MOD is a Wi-Fi, dual-band, 2.4- and 5-GHz module solution with two antennas supporting industrial temperature grade. The device is FCC, IC, ETSI/CE, and TELEC certified for AP (with DFS support) and client. TI offers drivers for high-level operating systems, such as Linux and Android™. Additional drivers, such as WinCE and RTOS, which includes QNX, Nucleus, ThreadX, and FreeRTOS, are supported through third parties.

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技術文件

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類型 標題 日期
* Data sheet WL18x7MODWiLink™ 8Dual-Band IndustrialModule –Wi-Fi®,Bluetooth ®, andBluetoothLow Energy (LE) datasheet (Rev. K) PDF | HTML 2023年 11月 1日
* Radiation & reliability report WL1807MOD Reliability Data - Reliability Estimate 2017年 7月 27日
User guide WL1837MODCOM8I WLAN MIMO and BT Module EVB for TI Sitara Platform (Rev. E) PDF | HTML 2023年 11月 7日
Cybersecurity advisory Buffer Overflow in WL18xx MCP Driver (Rev. A) PDF | HTML 2023年 8月 22日
Cybersecurity advisory WiLink WL18xx PN Reuse Issue PDF | HTML 2023年 8月 2日
Application note CE Regulations for SRDs Operating in License-Free 2.4GHz/5GHz Bands-WiFi Devices (Rev. A) PDF | HTML 2022年 10月 20日
Application note Antenna Impedance Measurement and Matching PDF | HTML 2022年 3月 22日
White paper Advantages and Challenges of Multi-Role Multi-Channel versus Single-Channel PDF | HTML 2022年 3月 8日
User guide WiLink8 Getting Started Guide (Rev. B) PDF | HTML 2021年 12月 20日
Certificate WL18MODGI (Test Grade 07: WL1807MODGIMOC) EC DoC (Rev. A) 2021年 3月 3日
White paper WiLink8 Use Case Guide PDF | HTML 2020年 12月 30日
User guide WiLink8 Driver Debug PDF | HTML 2020年 12月 7日
User guide WiLink8 Linux Advanced Demos PDF | HTML 2020年 12月 7日
User guide WiLink8 R8.8 Linux Wi-Fi Driver Release Build User's Guide (Rev. A) PDF | HTML 2020年 10月 27日
Product overview Sitara™ processors + WiLink™ 8 Wi-Fi® + Bluetooth® combo connectivity (Rev. A) 2019年 7月 30日
User guide WL18xx Module Hardware Integration Guide (Rev. B) PDF | HTML 2019年 7月 9日
Design guide WL18xx Design Checklist 2019年 6月 27日
More literature Streamline the challenges of RF design with certified wireless modules 2017年 1月 25日
Application note Certification Testing Guidelines for WFA System Interoperability Test Plans MCP 2016年 12月 28日
Application note Certification Testing Guidelines for WFA System Interoperability Test Plans NLCP 2016年 12月 28日
Application note WiLink 8.0TM WLAN IP Mesh Application Report 2016年 6月 1日
User guide WiLinkT™ 8 WLAN Features User's Guide (Rev. A) PDF | HTML 2016年 5月 26日
White paper Wi-Fi® mesh networks: Discover new wireless paths 2016年 5月 24日
White paper Streaming Audio: Follow the signal chain white paper 2016年 4月 14日
Application note Certification Testing Guidelines for WFA System Interoperability Test Plans 2016年 2月 15日
More literature WiLink 8 Wi-Fi + Bluetooth/BLE Modules (Rev. B) 2016年 2月 3日
Application note Precise Time Synchronization Over WLAN (Rev. A) 2015年 12月 18日
Application note WL18xx .INI File (Rev. A) 2015年 12月 3日
White paper Wi-Fi® audio: capabilities and challenges 2015年 12月 2日
Application note WL18xx Level-shifting I/O (Rev. A) 2015年 8月 19日
Technical article Understanding wireless connectivity in industrial IoT applications PDF | HTML 2015年 8月 4日
Application note WiLink 8 Solutions WiLink8 - wlconf Manual 2015年 7月 1日
Application note WL18xx 5GHZ Antenna Diversity 2015年 6月 29日
User guide WL1837MODCOM8I WLAN MIMO and BT Module EVB for TI Sitara Platform (Rev. A) 2014年 12月 29日
White paper Complete solutions for next-generation wireless connected audio 2014年 1月 2日

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

TMDSEVM437X — AM437x 評估模組

The AM437x Evaluation Module (EVM), TMDXEVM437X, enables developers to immediately start evaluating the AM437x processor family (AM4372, AM4376,AM4377, AM4378) and begin building applications and accelerate development for HMI, industrial and networking applications. The TMDSEVM437X development (...)

使用指南: PDF
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開發板

TMDSEVM572X — AM572x 評估模組

The AM572x evaluation module provides an affordable platform to quickly start evaluation of Sitara™ Arm® Cortex®-A15 AM57x processors (AM5728AM5726AM5718AM5716) and accelerate development for HMI, machine vision, networking, medical imaging and many other industrial applications. It is a (...)

使用指南: PDF
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開發板

TMDXEVM3358 — AM335x 評估模組

The AM335x Evaluation Module (EVM) enables developers to immediately start evaluating the AM335x processor family (AM3351, AM3352, AM3354, AM3356, AM3358) and begin building applications for factory automation, building automation, grid infrastructure, and more.

使用指南: PDF
TI.com 無法提供
開發板

WL18XXCOM82SDMMC — WL18XXCOM82SDMMC

The WiLink SDIO board is a SDMMC adapter board and is an easy to use connector between a WiLink COM8 Evaluation module [WL1837MODCOM8i and WL1835MODCOM8B] and a generic SD/MMC card slot on a host processor EVM. The adapter card enables the WiLink Wi-Fi module to operate over SDIO. It also provides (...)

使用指南: PDF
TI.com 無法提供
子卡

WL1835MODCOM8B — WiLink™ 8 模組 2.4 GHz WiFi® + Bluetooth® COM8 評估模組

TI WiLink™ 8 module family

The WL1835MODCOM8 is one of the two evaluation boards for the TI WiLink 8 combo module family. For designs requiring performance in the 5 GHz band and extended temperature range, see the WL1837MODCOM8I.

The WL1835MODCOM8 Kit for Sitara EVMs easily enables customers to add (...)

使用指南: PDF | HTML
TI.com 無法提供
子卡

WL1837MODCOM8I — WiLink™ 8 雙頻 2.4 和 5 GHz Wi-Fi® + 藍牙® COM8 評估模組

TI WiLink™ 8 module family The WL1837MODCOM8I is one of the two evaluation boards for the TI WiLink™ 8 combo module family. For designs requiring performance in the 2.4 GHz band only, see the WL1835MODCOM8.

The WL1837MODCOM8I, which is compatible with many processors including TI’s (...)

使用指南: PDF | HTML
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開發套件

AM62-EVSE-DEV-PLATFORM — 具 HMI 且以 AM625 為基礎的智慧型連線 EV 充電站開發平台

以 AM625 為基礎的電動車維修設備 (EVSE) 開發平台是一系列硬體、軟體和文件,讓工程師能開始設計具人機介面 (HMI) 的智慧連線 EV 充電站。類比前端硬體的設計可將電動車連接至電網並安全充電。通訊硬體為 AM625 MPU 裝置的評估模組或第三方開發套件,並配備專供與類比前端介接的擴充板。軟體則包含開始充電工作階段的低階驅動程式和操作系統。可立即生產的系統模組 (SOM) 與圖形二進位可加速硬體與軟體開發,以縮短開發上市時間。

軟體開發套件 (SDK)

PROCESSOR-SDK-LINUX-AM335X Linux Processor SDK for AM335x

Processor SDK (Software Development Kit) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos.  All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly (...)

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支援產品和硬體

產品
Wi-Fi 產品
WL1807MOD WiLink™ 8 工業雙頻組合、2x2 MIMO Wi-Fi 模組 WL1831 WiLink™8 單頻帶工業 Wi-Fi®、藍牙®和低功耗藍牙收發器 WL1837MOD WiLink ™ 8 工業雙頻、2x2 MIMO Wi-Fi®、Bluetooth® 和 Bluetooth 智慧模組
Arm 式處理器
AM3351 Sitara 處理器:Arm Cortex-A8、1Gb 乙太網路、顯示 AM3352 Sitara 處理器:Arm Cortex-A8、1Gb 乙太網路、顯示器、CAN AM3354 Sitara 處理器:Arm Cortex-A8、3D 圖形、CAN AM3356 Sitara 處理器:ARM Cortex-A8、PRU-ICSS、CAN AM3357 Sitara 處理器:ARM Cortex-A8、EtherCAT、PRU-ICSS、CAN AM3358 Sitara 處理器:ARM Cortex-A8、3D 繪圖、PRU-ICSS、CAN AM3359 Sitara 處理器:ARM Cortex-A8、EtherCAT、3D、PRU-ICSS、CAN
硬體開發
TMDSICE3359 AM3359 工業通訊引擎 TMDSSK3358 AM335x 入門套件 TMDXEVM3358 AM335x 評估模組
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軟體開發套件 (SDK)

PROCESSOR-SDK-LINUX-RT-AM335X Linux-RT Processor SDK for AM335x

Processor SDK (Software Development Kit) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos.  All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly (...)

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產品
Wi-Fi 產品
WL1807MOD WiLink™ 8 工業雙頻組合、2x2 MIMO Wi-Fi 模組 WL1831 WiLink™8 單頻帶工業 Wi-Fi®、藍牙®和低功耗藍牙收發器 WL1837MOD WiLink ™ 8 工業雙頻、2x2 MIMO Wi-Fi®、Bluetooth® 和 Bluetooth 智慧模組
Arm 式處理器
AM3351 Sitara 處理器:Arm Cortex-A8、1Gb 乙太網路、顯示 AM3352 Sitara 處理器:Arm Cortex-A8、1Gb 乙太網路、顯示器、CAN AM3354 Sitara 處理器:Arm Cortex-A8、3D 圖形、CAN AM3356 Sitara 處理器:ARM Cortex-A8、PRU-ICSS、CAN AM3357 Sitara 處理器:ARM Cortex-A8、EtherCAT、PRU-ICSS、CAN AM3358 Sitara 處理器:ARM Cortex-A8、3D 繪圖、PRU-ICSS、CAN AM3359 Sitara 處理器:ARM Cortex-A8、EtherCAT、3D、PRU-ICSS、CAN
硬體開發
TMDSICE3359 AM3359 工業通訊引擎 TMDXEVM3358 AM335x 評估模組
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軟體開發套件 (SDK)

PROCESSOR-SDK-RTOS-AM335X TI-RTOS Processor SDK for AM335x and AMIC110 devices (No design support from TI available. Refer to Overview- RTOS Highlights for details.)

Processor SDK (Software Development Kit) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos.  All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly (...)

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支援產品和硬體

產品
Wi-Fi 產品
WL1807MOD WiLink™ 8 工業雙頻組合、2x2 MIMO Wi-Fi 模組 WL1831 WiLink™8 單頻帶工業 Wi-Fi®、藍牙®和低功耗藍牙收發器 WL1837MOD WiLink ™ 8 工業雙頻、2x2 MIMO Wi-Fi®、Bluetooth® 和 Bluetooth 智慧模組
Arm 式處理器
AM3351 Sitara 處理器:Arm Cortex-A8、1Gb 乙太網路、顯示 AM3352 Sitara 處理器:Arm Cortex-A8、1Gb 乙太網路、顯示器、CAN AM3354 Sitara 處理器:Arm Cortex-A8、3D 圖形、CAN AM3356 Sitara 處理器:ARM Cortex-A8、PRU-ICSS、CAN AM3357 Sitara 處理器:ARM Cortex-A8、EtherCAT、PRU-ICSS、CAN AM3358 Sitara 處理器:ARM Cortex-A8、3D 繪圖、PRU-ICSS、CAN AM3359 Sitara 處理器:ARM Cortex-A8、EtherCAT、3D、PRU-ICSS、CAN AMIC110 Sitara 處理器:ARM Cortex-A8、10+ 乙太網路通訊協定
硬體開發
TMDSICE3359 AM3359 工業通訊引擎 TMDSSK3358 AM335x 入門套件 TMDXEVM3358 AM335x 評估模組 TMDXICE110 AMIC110 工業通訊引擎 (ICE)
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應用軟體及架構

WILINK-BT_WIFI-WIRELESS_TOOLS — 適用於 WL18XX 模組的 WiLink™ 無線工具

此套件包括以下應用程式:
  • WLAN 即時調整工具 (RTTT)
  • Bluetooth® 記錄器
  • WLAN gLogger
  • 連結品質監測器 (LQM)
  • HCITester 工具
    • BTSout
    • BTSTransform
    • ScriptPad

應用程式提供使用主機偵錯及監控 WiLink™ WLAN/Bluetooth/Bluetooth 低耗能韌體、執行 RF 驗證測試、執行法規認證測試的預先測試,以及偵錯硬體與軟體平台整合問題時所需的所有功能。

WLAN 和 Bluetooth 的無線偵錯和校準工具需要四個 UART 連接埠。將這些連接埠驅動至 PC 的最有效方式是使用 UART 至 USB 轉換器。TI 建議使用 (...)

使用指南: PDF | HTML
應用軟體及架構

WILINK-WIFI_MESH_VISUALIZATION_TOOL — 適用於 WL18XX 模組的 WiLink™ Mesh 視覺化工具

Wireless Mesh Explorer is a Microsoft® Windows® based software tool for exploring and displaying mesh networks based on the Texas Instruments WiLink8.0 chipset.
使用指南: PDF
驅動程式或資料庫

WILINK8-WIFI-MCP8 — WiLink™ 8 專有 Wi-Fi 驅動程式 – QNX、WinCE、Nucleus RTOS 基準

The MCP package contains the install package, pre-compiled object and source of the proprietary Wi-Fi Driver - QNX, Nucleus, WinCE as well as ThreadX, FreeRTOS, µC, MQX ,RTX and uITRON RTOS baseline image to easily integrate the TI WiLink Wi-Fi drivers. The integration is supported through (...)

使用指南: PDF | HTML
驅動程式或資料庫

WILINK8-WIFI-NLCP WiLink8 NLCP Wi-Fi driver package for Linux OS

WiLink™ 8 NLCP package consists of build scripts to update WiLink™ 8 Linux driver, firmware binary, wpa supplicant, hostapd etc. For more details please refer to the release notes and user’s guide

Software block overview:

WL18xx Linux driver uses the open source components along with the interface (...)

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產品
Wi-Fi 產品
WL1801 WiLink™8 單頻帶工業 Wi-Fi® 收發器 WL1801MOD WiLink™ 8 單一頻帶 Wi-Fi® 模組 WL1805MOD WiLink™ 8 單一頻帶、2x2 MIMO Wi-Fi® 模組 WL1807MOD WiLink™ 8 工業雙頻組合、2x2 MIMO Wi-Fi 模組 WL1831 WiLink™8 單頻帶工業 Wi-Fi®、藍牙®和低功耗藍牙收發器 WL1831MOD WiLink™ 8 工業雙頻 Wi-Fi、Bluetooth 和 Bluetooth Smart (低功耗) 模組 WL1835MOD WiLink ™ 8 單一頻帶組合 2x2 MIMO Wi-Fi®、Bluetooth® 和 Bluetooth Smart 模組 WL1837MOD WiLink ™ 8 工業雙頻、2x2 MIMO Wi-Fi®、Bluetooth® 和 Bluetooth 智慧模組
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認證

WL18XX-CERTIFICATION — WiLink™ 8 的無線電認證

Are you looking for WiLink™ 8 module certification support? WL18XX-CERTIFCATION provides the relevant information and support for successful certification of your product. Within this page you will find the latest certification reports of our Modules as well as our evaluation boards.
認證

WL18XX-REPORTS Reports: WL18XX Regulatory Certification Reports

Are you looking for WiLink™ 8 module certification support? WL18XX-CERTIFCATION provides the relevant information and support for successful certification of your product. Within this page you will find the latest certification reports of our Modules as well as our evaluation boards.
支援產品和硬體

支援產品和硬體

產品
Wi-Fi 產品
WL1801MOD WiLink™ 8 單一頻帶 Wi-Fi® 模組 WL1805MOD WiLink™ 8 單一頻帶、2x2 MIMO Wi-Fi® 模組 WL1807MOD WiLink™ 8 工業雙頻組合、2x2 MIMO Wi-Fi 模組 WL1831MOD WiLink™ 8 工業雙頻 Wi-Fi、Bluetooth 和 Bluetooth Smart (低功耗) 模組 WL1835MOD WiLink ™ 8 單一頻帶組合 2x2 MIMO Wi-Fi®、Bluetooth® 和 Bluetooth Smart 模組 WL1837MOD WiLink ™ 8 工業雙頻、2x2 MIMO Wi-Fi®、Bluetooth® 和 Bluetooth 智慧模組
硬體開發
WL1835MODCOM8B WiLink™ 8 模組 2.4 GHz WiFi® + Bluetooth® COM8 評估模組 WL1837MODCOM8I WiLink™ 8 雙頻 2.4 和 5 GHz Wi-Fi® + 藍牙® COM8 評估模組
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設計工具

WILINK-DESIGN-REVIEWS — 適用於 WL18xx 裝置的硬體設計審查

To get started with the WiLink™ hardware design review process:
  • Step 1: Before requesting a review, it is important that to review the technical documentation and design & development resources available on the corresponding product page (see WL18xx product page links below).
  • Step 2: Download and (...)
使用指南: PDF | HTML
參考設計

TIDC-WL1837MOD-AUDIO-MULTIROOM-CAPE — TI WiLink™8 Wi-Fi®/Bluetooth®/低功耗藍牙音效多空間 Cape 參考設計

The TI WiLink™ 8 WL1837MOD audio cape is a wireless multi-room audio reference design used with BeagleBone Black (featuring TI Sitara™ AM335x). The WiLink 8 device's WLAN capability to capture and register precise arrival time of the connected AP's beacon is used to achieve ultra-precise (...)
Design guide: PDF
電路圖: PDF
參考設計

TIDC-WL1835MODCOM8B — WiLink™ 1835 模組上的 2.4 GHz WiFi® + Bluetooth® 認證天線設計

The WiLink 1835 Module Antenna Design is a reference design that combines the functionalities of the WiLink 8 module with a built-in antenna on a single board, implementing the module in the way it's been certified. Through this, customers are able to evaluate the performance of the module through (...)
電路圖: PDF
封裝 引腳 下載
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訂購與品質

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  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 資格摘要
  • 進行中可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

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