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Quality, reliability & packaging data download

ADS5500MPAPREP ACTIVE

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Rating

HiRel Enhanced Product
RoHS Yes
REACH Yes
Device Marking ADS5500MEP
Lead finish/Ball material NiPdAu
MSL rating/Peak reflow Level-3-260C-168 HR

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
1.38x109 0.7 55 60 0.7 125 1000 16105 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Iron
7439-89-6
0.000003
0.000211
2
0.000001
0
Magnesium and Its Alloys
Magnesium
7439-95-4
0.000001
0.000070
1
0.000000
0
Other Nonferrous Metals and Alloys
Beryllium
7440-41-7
0.000001
0.000070
1
0.000000
0
Other Nonferrous Metals and Alloys
Calcium
7440-70-2
0.000004
0.000281
3
0.000002
0
Other Nonferrous Metals and Alloys
Yttrium
7440-65-5
0.00001
0.000702
7
0.000004
0
Precious Metals
Gold
7440-57-5
1.423783
99.997612
999976
0.571568
5716
Precious Metals
Silver
7440-22-4
0.000015
0.001054
11
0.000006
0
Sub-total
— —
1.423817
100
1000000
0.571582
5716
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.986406
69.999972
700000
0.395986
3960
Thermoplastics
Epoxy
85954-11-6
0.422746
30.000028
300000
0.169709
1697
Sub-total
— —
1.409152
100
1000000
0.565695
5657
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
84.389535
97.425000
974250
33.877610
338776
Copper and Its Alloys
Iron
7439-89-6
2.07888
2.400000
24000
0.834552
8346
Copper and Its Alloys
Phosphorus
7723-14-0
0.012993
0.015000
150
0.005216
52
Other Nonferrous Metals and Alloys
Lead
7439-92-1
0.025986
0.030000
300
0.010432
104
Other Nonferrous Metals and Alloys
Tin
7440-31-5
0.025986
0.030000
300
0.010432
104
Zinc and Its Alloys
Zinc
7440-66-6
0.08662
0.100000
1000
0.034773
348
Sub-total
— —
86.620000
100
1000000
34.773015
347730
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
1.489579
95.119987
951200
0.597981
5980
Precious Metals
Gold
7440-57-5
0.012215
0.780013
7800
0.004904
49
Precious Metals
Palladium
7440-05-3
0.064206
4.100000
41000
0.025775
258
Sub-total
— —
1.566000
100
1000000
0.628660
6287
Mold Compound
Other Inorganic Materials
Fused Silica
60676-86-0
127.302845
85.000000
850000
51.104869
511049
Other Nonferrous Metals and Alloys
Metal Oxide
Trade Secret
1.797217
1.200000
12000
0.721481
7215
Other Organic Materials
Carbon Black
1333-86-4
0.449304
0.300000
3000
0.180370
1804
Other Organic Materials
Organic Phosphorus
1330-78-5
0.449304
0.300000
3000
0.180370
1804
Other Plastics and Rubber
Silicone
218163-11-2
4.493042
3.000000
30000
1.803701
18037
Thermoplastics
Epoxy
85954-11-6
15.276341
10.200000
102000
6.132584
61326
Sub-total
— —
149.768053
100
1000000
60.123375
601234
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
8.314186
100.000000
1000000
3.337674
33377
Sub-total
— —
8.314186
100
1000000
3.337674
33377
Total
— —
249.101208
— —
100
1000000

Qualification summary

Stress Reference Min Lot Qty Sample Size / Lot Condition Duration Result
TC JESD22-A104 3 25 Temperature Cycle -65/150C 500 Cycles PASS
AC/UHAST JESD22-A102/JESD22-A118 3 25 Autoclave 121C or Unbiased HAST 130C / 85% RH 96 Hours PASS
HTSL JESD22-A103 3 25 High Temp Storage Bake 150C 1000 Hours PASS
THB/HAST JESD22-A101/JESD22-A110 3 25 THB 85C/85%RH or HAST 130C/110C/85%RH 1000 Hours or 96 Hours PASS
CDM JESD22-C101 1 3 ESD - CDM Classification See datasheet
HBM JS-001 1 3 ESD - HBM Classification See datasheet
HTOL JESD22-A108 3 77 Life Test, 125C 1000 Hours PASS
LU JESD78 1 3 Latch-up Per JESD78 PASS
MSL JEDEC J-STD-020E — — Per JEDEC J-STD-020E Classification See datasheet

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Cumulative Sample Size Disposition
180nm CMOS Life test 125C, 1000 Hours or Equivalent JEDEC Condition 10040 Pass
Assembly process reliability data
Package Family Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
QFP (with Thermal Pad) Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 1694 39205 Pass
QFP (with Thermal Pad) High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 1926 33965 Pass
QFP (with Thermal Pad) Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 4468 77402 Pass
QFP (with Thermal Pad) Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 2482 57725 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.