Home  >  Quality & reliability  >  Quality, reliability & packaging data download

Quality, reliability & packaging data download

AM26LS33ACDR ACTIVE

By using this tool to “search” or “download”, you agree to TI’s terms of use, privacy policy (including cookie policy), and important notice.

Search more parts

Filter between the data types to view or download

Quality data will change based on assembly site

Download .xls Download PDF

Rating

Catalog
RoHS Yes
RoHS Yes
REACH Yes
REACH Yes
Device Marking 26LS33AC
Lead finish/Ball material NiPdAu
Lead finish/Ball material NiPdAu
MSL rating/Peak reflow Level-1-260C-UNLIM
MSL rating/Peak reflow Level-1-260C-UNLIM

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
8.71x109 0.1 55 60 0.7 125 1000 101758 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.099023
99.997980
999980
0.055283
553
Precious Metals
Silver
7440-22-4
0.000002
0.002020
20
0.000001
0
Sub-total
— —
0.099025
100
1000000
0.055284
553
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.573262
80.000056
800001
0.320040
3200
Thermoplastics
Epoxy
85954-11-6
0.143315
19.999944
199999
0.080010
800
Sub-total
— —
0.716577
100
1000000
0.400050
4001
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
52.9893
97.050000
970500
29.582839
295828
Copper and Its Alloys
Iron
7439-89-6
1.4196
2.600000
26000
0.792534
7925
Copper and Its Alloys
Phosphorus
7723-14-0
0.0819
0.150000
1500
0.045723
457
Zinc and Its Alloys
Zinc
7440-66-6
0.1092
0.200000
2000
0.060964
610
Sub-total
— —
54.6000
100
1000000
30.482060
304821
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
0.19024
95.120000
951200
0.106207
1062
Precious Metals
Gold
7440-57-5
0.00156
0.780000
7800
0.000871
9
Precious Metals
Palladium
7440-05-3
0.0082
4.100000
41000
0.004578
46
Sub-total
— —
0.20000
100
1000000
0.111656
1117
Mold Compound
Not Categorized
Phenolic Resin
9003-35-4
4.240631
3.500000
35000
2.367457
23675
Other Inorganic Materials
Fused Silica
60676-86-0
103.592565
85.500001
855000
57.833604
578336
Other Organic Materials
Carbon Black
1333-86-4
0.605804
0.500000
5000
0.338208
3382
Thermoplastics
Epoxy
85954-11-6
12.721894
10.500000
105000
7.102372
71024
Sub-total
— —
121.160894
100
1000000
67.641642
676416
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
2.345256
100.000000
1000000
1.309308
13093
Sub-total
— —
2.345256
100
1000000
1.309308
13093
Total
— —
179.121752
— —
100
1000000
Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.124193
97.585372
975854
0.071560
716
Nickel and Its Alloys
Nickel
7440-02-0
0.000001
0.000786
8
0.000001
0
Not Categorized
Proprietary Materials
—
0.000014
0.011001
110
0.000008
0
Precious Metals
Palladium
7440-05-3
0.003054
2.399698
23997
0.001760
18
Precious Metals
Silver
7440-22-4
0.000004
0.003143
31
0.000002
0
Sub-total
— —
0.127266
100
1000000
0.073331
733
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.317409
80.000050
800001
0.182891
1829
Thermoplastics
Epoxy
85954-11-6
0.079352
19.999950
199999
0.045723
457
Sub-total
— —
0.396761
100
1000000
0.228614
2286
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
47.84565
97.050000
970500
27.568697
275687
Copper and Its Alloys
Iron
7439-89-6
1.2818
2.600000
26000
0.738574
7386
Copper and Its Alloys
Phosphorus
7723-14-0
0.07395
0.150000
1500
0.042610
426
Zinc and Its Alloys
Zinc
7440-66-6
0.0986
0.200000
2000
0.056813
568
Sub-total
— —
49.30000
100
1000000
28.406694
284067
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
0.19024
95.120000
951200
0.109616
1096
Precious Metals
Gold
7440-57-5
0.00156
0.780000
7800
0.000899
9
Precious Metals
Palladium
7440-05-3
0.0082
4.100000
41000
0.004725
47
Sub-total
— —
0.20000
100
1000000
0.115240
1152
Mold Compound
Not Categorized
Phenolic Resin
9003-35-4
4.277982
3.500000
35000
2.464976
24650
Other Inorganic Materials
Fused Silica
60676-86-0
104.505001
85.500001
855000
60.215855
602159
Other Organic Materials
Carbon Black
1333-86-4
0.61114
0.500000
5000
0.352139
3521
Thermoplastics
Epoxy
85954-11-6
12.833947
10.500000
105000
7.394929
73949
Sub-total
— —
122.228070
100
1000000
70.427899
704279
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
1.298543
100.000000
1000000
0.748221
7482
Sub-total
— —
1.298543
100
1000000
0.748221
7482
Total
— —
173.550640
— —
100
1000000

Qualification summary

Stress Reference Min lot qty SS / lot Condition Duration Result Notes
HTOL JESD22-A108 3 77 Life test, 125C 1000 hours Pass Or equivalent JEDEC condition
HTSL JESD22-A103 3 25 High temp storage bake, 150C 1000 hours Pass Or equivalent JEDEC condition
AC/UHAST JESD22-A102/JESD22-A118 3 25 Unbiased HAST 130C / 85% RH 96 hours Pass Or equivalent JEDEC condition
THB/HAST JESD22-A101/JESD22-A110 3 25 HAST 130C/85%RH 96 hours Pass Or equivalent JEDEC condition
TC JESD22-A104 3 25 Temperature cycle -65/150C 500 cycles Pass Or equivalent JEDEC condition
SD J-STD-002 3 22 Per specification >95% lead coverage Pass —
HBM JS-001 1 3 ESD - HBM Classification See data sheet —
CDM JS-002 1 3 ESD - CDM Classification See data sheet —
LU JESD78 1 3 Latch-up Per JESD78 Pass As applicable per JESD78
MSL J-STD-020 — — Per J-STD-020 Classification See data sheet —

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
Power BICMOS High temperature gate bias 150C, 1000 Hours or Equivalent JEDEC Condition 924 924 Pass
Power BICMOS High temperature reverse bias 125C, 1000 Hours or Equivalent JEDEC Condition 1386 1386 Pass
Power BICMOS Life test 125C, 1000 Hours or Equivalent JEDEC Condition 28135 456997 Pass
Assembly process reliability data
Package Family Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
SOIC Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 5061 85402 Pass
SOIC High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 5627 73980 Pass
SOIC Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 13223 189567 Pass
SOIC Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 7777 138759 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

Close

Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.