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AM26LS33AMWB ACTIVE

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Rating

Military
RoHS No
REACH Affected
Device Marking 5962-7802004MF, AM26LS33AMWB, A
Lead finish/Ball material SnPb
MSL rating/Peak reflow Level-NC-NC-NC

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
1.6x109 0.6 55 60 0.7 125 1000 41301 1 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Base
Not Categorized
Cobalt Oxide
1308-06-1
0.56655
0.300000
3000
0.121695
1217
Not Categorized
Other (Ceramic w/out Declarable Substance)
—
6.60975
3.500000
35000
1.419775
14198
Other Inorganic Materials
Aluminum Oxide
1344-28-1
164.86605
87.300000
873000
35.413246
354132
Other Inorganic Materials
Silicon Dioxide
7631-86-9
4.9101
2.600000
26000
1.054690
10547
Other Inorganic Materials
Titanium Oxide
13463-67-7
3.0216
1.600000
16000
0.649040
6490
Other Nonferrous Metals and Alloys
Chromium Oxide
1308-38-9
2.6439
1.400000
14000
0.567910
5679
Other Nonferrous Metals and Alloys
Manganese Dioxide
1313-13-9
6.23205
3.300000
33000
1.338645
13386
Sub-total
— —
188.85000
100
1000000
40.565001
405650
Bond Wire
Aluminum and Its Alloys
Aluminum
7429-90-5
0.061184
99.131562
991316
0.013142
131
Copper and Its Alloys
Copper
7440-50-8
0.000001
0.001620
16
0.000000
0
Copper and Its Alloys
Iron
7439-89-6
0.000002
0.003240
32
0.000000
0
Other Inorganic Materials
Silicon
7440-21-3
0.000532
0.861957
8620
0.000114
1
Precious Metals
Silver
7440-22-4
0.000001
0.001620
16
0.000000
0
Sub-total
— —
0.061720
100
1000000
0.013257
133
Die Attach Adhesive
Other Nonferrous Metals and Alloys
Lead Borate Glass
65997-18-4
0.034035
14.999934
149999
0.007311
73
Other Plastics and Rubber
Other Filler
—
0.011345
4.999978
50000
0.002437
24
Precious Metals
Silver
7440-22-4
0.181521
80.000088
800001
0.038991
390
Sub-total
— —
0.226901
100
1000000
0.048738
487
Lead Frame
Copper and Its Alloys
Iron
7439-89-6
24.418
58.000000
580000
5.244989
52450
Nickel and Its Alloys
Nickel
7440-02-0
17.682
42.000000
420000
3.798096
37981
Sub-total
— —
42.100
100
1000000
9.043085
90431
Lead Frame Plating
Other Nonferrous Metals and Alloys
Lead
7439-92-1
0.1554
37.000000
370000
0.033380
334
Other Nonferrous Metals and Alloys
Tin
7440-31-5
0.2646
63.000000
630000
0.056836
568
Sub-total
— —
0.4200
100
1000000
0.090216
902
Lid
Not Categorized
Cobalt Oxide
1308-06-1
0.35595
0.300000
3000
0.076458
765
Not Categorized
Other (Ceramic w/out Declarable Substance)
—
4.15275
3.500000
35000
0.892011
8920
Other Inorganic Materials
Aluminum Oxide
1344-28-1
103.58145
87.300000
873000
22.249307
222493
Other Inorganic Materials
Silicon Dioxide
7631-86-9
3.0849
2.600000
26000
0.662637
6626
Other Inorganic Materials
Titanium Oxide
13463-67-7
1.8984
1.600000
16000
0.407777
4078
Other Nonferrous Metals and Alloys
Chromium Oxide
1308-38-9
1.6611
1.400000
14000
0.356804
3568
Other Nonferrous Metals and Alloys
Manganese Dioxide
1313-13-9
3.91545
3.300000
33000
0.841039
8410
Sub-total
— —
118.65000
100
1000000
25.486033
254860
Lid - Seal
Glass Frit
Iron Cobalt Chromite Black Spinel
68186-97-0
0.564
0.500000
5000
0.121147
1211
Glass Frit
Other (Glass w/out Declarable Substance)
NA
5.076
4.500000
45000
1.090325
10903
Glass Frit
Silicate Acid, Zinc Salt (4:3)
96906-37-5
16.92
15.000000
150000
3.634418
36344
Glass Frit
Zinc Stannate
12036-37-2
28.2
25.000000
250000
6.057363
60574
Other Nonferrous Metals and Alloys
Boron Oxide
1303-86-2
5.64
5.000000
50000
1.211473
12115
Other Nonferrous Metals and Alloys
Lead Monoxide
1317-36-8
56.4
50.000000
500000
12.114726
121147
Sub-total
— —
112.800
100
1000000
24.229452
242295
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
2.440491
100.000000
1000000
0.524218
5242
Sub-total
— —
2.440491
100
1000000
0.524218
5242
Total
— —
465.549112
— —
100
1000000

Qualification summary

No results found

Ongoing reliability monitoring

No results found

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.