Home  >  Quality & reliability  >  Quality, reliability & packaging data download

Quality, reliability & packaging data download

BQ20Z40PW-R1 NOT RECOMMENDED FOR NEW DESIGNS

By using this tool to “search” or “download”, you agree to TI’s terms of use, privacy policy (including cookie policy), and important notice.

Search more parts

Filter between the data types to view or download

Quality data will change based on assembly site

Download .xls Download PDF

Rating

—
RoHS Yes
RoHS Yes
REACH Yes
REACH Yes
Device Marking 20Z40
Lead finish/Ball material NiPdAu
Lead finish/Ball material NiPdAu
MSL rating/Peak reflow Level-1-260C-UNLIM
MSL rating/Peak reflow Level-1-260C-UNLIM

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
3.54x108 2.8 55 60 0.7 125 1000 4138 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.097162
99.998971
999990
0.129055
1291
Precious Metals
Silver
7440-22-4
0.000001
0.001029
10
0.000001
0
Sub-total
— —
0.097163
100
1000000
0.129056
1291
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
1.004066
79.999968
800000
1.333645
13336
Thermoplastics
Epoxy
85954-11-6
0.251017
20.000032
200000
0.333412
3334
Sub-total
— —
1.255083
100
1000000
1.667057
16671
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
27.85926
97.410000
974100
37.003903
370039
Copper and Its Alloys
Iron
7439-89-6
0.6864
2.400000
24000
0.911707
9117
Copper and Its Alloys
Phosphorus
7723-14-0
0.00858
0.030000
300
0.011396
114
Other Nonferrous Metals and Alloys
Lead
7439-92-1
0.00858
0.030000
300
0.011396
114
Other Nonferrous Metals and Alloys
Tin
7440-31-5
0.00858
0.030000
300
0.011396
114
Zinc and Its Alloys
Zinc
7440-66-6
0.0286
0.100000
1000
0.037988
380
Sub-total
— —
28.60000
100
1000000
37.987787
379878
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
0.437552
95.120000
951200
0.581176
5812
Precious Metals
Gold
7440-57-5
0.003588
0.780000
7800
0.004766
48
Precious Metals
Palladium
7440-05-3
0.01886
4.100000
41000
0.025051
251
Sub-total
— —
0.460000
100
1000000
0.610992
6110
Mold Compound
Other Inorganic Materials
Fused Silica
60676-86-0
35.063934
86.000001
860000
46.573470
465735
Other Organic Materials
Carbon Black
1333-86-4
0.122316
0.300000
3000
0.162466
1625
Thermoplastics
Epoxy
85954-11-6
5.585766
13.700000
137000
7.419262
74193
Sub-total
— —
40.772016
100
1000000
54.155198
541552
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
4.103093
100.000000
1000000
5.449910
54499
Sub-total
— —
4.103093
100
1000000
5.449910
54499
Total
— —
75.287355
— —
100
1000000
Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.109537
99.998174
999982
0.117102
1171
Precious Metals
Silver
7440-22-4
0.000002
0.001826
18
0.000002
0
Sub-total
— —
0.109539
100
1000000
0.117104
1171
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
1.004066
79.999968
800000
1.073409
10734
Thermoplastics
Epoxy
85954-11-6
0.251017
20.000032
200000
0.268353
2684
Sub-total
— —
1.255083
100
1000000
1.341761
13418
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
43.620495
97.585000
975850
46.633003
466330
Copper and Its Alloys
Iron
7439-89-6
1.0281
2.300000
23000
1.099102
10991
Copper and Its Alloys
Phosphorus
7723-14-0
0.006705
0.015000
150
0.007168
72
Zinc and Its Alloys
Zinc
7440-66-6
0.0447
0.100000
1000
0.047787
478
Sub-total
— —
44.700000
100
1000000
47.787061
477871
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
0.044897
95.120763
951208
0.047998
480
Precious Metals
Gold
7440-57-5
0.000368
0.779661
7797
0.000393
4
Precious Metals
Palladium
7440-05-3
0.001935
4.099576
40996
0.002069
21
Sub-total
— —
0.047200
100
1000000
0.050460
505
Mold Compound
Other Inorganic Materials
Silica
7631-86-9
36.826293
85.000001
850000
39.369582
393696
Other Organic Materials
Carbon Black
1333-86-4
0.216625
0.499999
5000
0.231586
2316
Thermoplastics
Epoxy
85954-11-6
6.282132
14.499999
145000
6.715987
67160
Sub-total
— —
43.325050
100
1000000
46.317154
463172
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
4.103093
100.000000
1000000
4.386460
43865
Sub-total
— —
4.103093
100
1000000
4.386460
43865
Total
— —
93.539965
— —
100
1000000

Qualification summary

Stress Reference Min lot qty SS / lot Condition Duration Result Notes
HTOL JESD22-A108 3 77 Life test, 125C 1000 hours Pass Or equivalent JEDEC condition
HTSL JESD22-A103 3 25 High temp storage bake, 150C 1000 hours Pass Or equivalent JEDEC condition
AC/UHAST JESD22-A102/JESD22-A118 3 25 Unbiased HAST 130C / 85% RH 96 hours Pass Or equivalent JEDEC condition
THB/HAST JESD22-A101/JESD22-A110 3 25 HAST 130C/85%RH 96 hours Pass Or equivalent JEDEC condition
TC JESD22-A104 3 25 Temperature cycle -65/150C 500 cycles Pass Or equivalent JEDEC condition
SD J-STD-002 3 22 Per specification >95% lead coverage Pass —
HBM JS-001 1 3 ESD - HBM Classification See data sheet —
CDM JS-002 1 3 ESD - CDM Classification See data sheet —
LU JESD78 1 3 Latch-up Per JESD78 Pass As applicable per JESD78
MSL J-STD-020 — — Per J-STD-020 Classification See data sheet —

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
CMOS Life test 125C, 1000 Hours or Equivalent JEDEC Condition 1232 54768 Pass
Assembly process reliability data
Package Family Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
TSSOP Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 2387 48648 Pass
TSSOP High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 2187 38360 Pass
TSSOP Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 5852 105153 Pass
TSSOP Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 4389 85262 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

Close

Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.