Home  >  Quality & reliability  >  Quality, reliability & packaging data download

Quality, reliability & packaging data download

BQ30Z554DBT-R1 ACTIVE

By using this tool to “search” or “download”, you agree to TI’s terms of use, privacy policy (including cookie policy), and important notice.

Search more parts

Filter between the data types to view or download

Quality data will change based on assembly site

Download .xls Download PDF

Rating

Catalog
RoHS Yes
REACH Yes
Device Marking BQ30Z554
Lead finish/Ball material NiPdAu
MSL rating/Peak reflow Level-2-260C-1 YEAR

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
3.333x108 3 55 60 0.7 125 1000 4138 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.179299
99.997769
999978
0.188229
1882
Copper and Its Alloys
Iron
7439-89-6
0.000001
0.000558
6
0.000001
0
Precious Metals
Silver
7440-22-4
0.000003
0.001673
17
0.000003
0
Sub-total
— —
0.179303
100
1000000
0.188233
1882
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.660095
79.999976
800000
0.692970
6930
Thermoplastics
Epoxy
85954-11-6
0.165024
20.000024
200000
0.173243
1732
Sub-total
— —
0.825119
100
1000000
0.866212
8662
Die Attach Adhesive 2
Precious Metals
Silver
7440-22-4
0.98838
80.000000
800000
1.037604
10376
Thermoplastics
Epoxy
85954-11-6
0.247095
20.000000
200000
0.259401
2594
Sub-total
— —
1.235475
100
1000000
1.297005
12970
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
37.89249
97.410000
974100
39.779652
397797
Copper and Its Alloys
Iron
7439-89-6
0.9336
2.400000
24000
0.980096
9801
Copper and Its Alloys
Phosphorus
7723-14-0
0.01167
0.030000
300
0.012251
123
Other Nonferrous Metals and Alloys
Lead
7439-92-1
0.01167
0.030000
300
0.012251
123
Other Nonferrous Metals and Alloys
Tin
7440-31-5
0.01167
0.030000
300
0.012251
123
Zinc and Its Alloys
Zinc
7440-66-6
0.0389
0.100000
1000
0.040837
408
Sub-total
— —
38.90000
100
1000000
40.837339
408373
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
0.66584
95.120000
951200
0.699001
6990
Precious Metals
Gold
7440-57-5
0.00546
0.780000
7800
0.005732
57
Precious Metals
Palladium
7440-05-3
0.0287
4.100000
41000
0.030129
301
Sub-total
— —
0.70000
100
1000000
0.734862
7349
Mold Compound
Other Inorganic Materials
Fused Silica
60676-86-0
39.405002
85.000000
850000
41.367492
413675
Other Organic Materials
Carbon Black
1333-86-4
0.231794
0.500000
5000
0.243338
2433
Thermoplastics
Epoxy
85954-11-6
6.72203
14.500000
145000
7.056808
70568
Sub-total
— —
46.358826
100
1000000
48.667638
486676
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
2.825914
100.000000
1000000
2.966653
29667
Sub-total
— —
2.825914
100
1000000
2.966653
29667
Semiconductor Device 2
Ceramics / Glass
Doped Silicon
7440-21-3
4.231324
100.000000
1000000
4.442057
44421
Sub-total
— —
4.231324
100
1000000
4.442057
44421
Total
— —
95.255961
— —
100
1000000

Qualification summary

Stress Reference Min lot qty SS / lot Condition Duration Result Notes
HTOL JESD22-A108 3 77 Life test, 125C 1000 hours Pass Or equivalent JEDEC condition
HTSL JESD22-A103 3 25 High temp storage bake, 150C 1000 hours Pass Or equivalent JEDEC condition
AC/UHAST JESD22-A102/JESD22-A118 3 25 Unbiased HAST 130C / 85% RH 96 hours Pass Or equivalent JEDEC condition
THB/HAST JESD22-A101/JESD22-A110 3 25 HAST 130C/85%RH 96 hours Pass Or equivalent JEDEC condition
TC JESD22-A104 3 25 Temperature cycle -65/150C 500 cycles Pass Or equivalent JEDEC condition
SD J-STD-002 3 22 Per specification >95% lead coverage Pass —
HBM JS-001 1 3 ESD - HBM Classification See data sheet —
CDM JS-002 1 3 ESD - CDM Classification See data sheet —
LU JESD78 1 3 Latch-up Per JESD78 Pass As applicable per JESD78
MSL J-STD-020 — — Per J-STD-020 Classification See data sheet —

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (3Q2025 - 2Q2026) Sample Size Cumulative Sample Size Disposition
CMOS Life test 125C, 1000 Hours or Equivalent JEDEC Condition 1232 54768 Pass
Fab Process Reliability Test Rolling Year (3Q2025 - 2Q2026) Sample Size Cumulative Sample Size Disposition
Power BICMOS High temperature gate bias 150C, 1000 Hours or Equivalent JEDEC Condition 924 924 Pass
Power BICMOS High temperature reverse bias 125C, 1000 Hours or Equivalent JEDEC Condition 1386 1386 Pass
Power BICMOS Life test 125C, 1000 Hours or Equivalent JEDEC Condition 28776 454841 Pass
Assembly process reliability data
Package Family Reliability Test Rolling Year (3Q2025 - 2Q2026) Sample Size Cumulative Sample Size Disposition
TSSOP Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 2541 48571 Pass
TSSOP High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 2277 38315 Pass
TSSOP Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 6083 105076 Pass
TSSOP Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 4697 85185 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

Close

Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.