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CD4028BF ACTIVE

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Rating

Military
RoHS No
REACH Affected
Device Marking CD4028BF
Lead finish/Ball material SnPb
MSL rating/Peak reflow Level-NC-NC-NC

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
3.71x108 2.8 55 60 0.7 125 1000 4333 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Base
Not Categorized
Cobalt Oxide
1308-06-1
7.8
0.300000
3000
0.161934
1619
Not Categorized
Other (Ceramic w/out Declarable Substance)
—
91
3.500000
35000
1.889225
18892
Other Inorganic Materials
Aluminum Oxide
1344-28-1
2269.8
87.300000
873000
47.122671
471227
Other Inorganic Materials
Silicon Dioxide
7631-86-9
67.6
2.600000
26000
1.403424
14034
Other Inorganic Materials
Titanium Oxide
13463-67-7
41.6
1.600000
16000
0.863646
8636
Other Nonferrous Metals and Alloys
Chromium Oxide
1308-38-9
36.4
1.400000
14000
0.755690
7557
Other Nonferrous Metals and Alloys
Manganese Dioxide
1313-13-9
85.8
3.300000
33000
1.781269
17813
Sub-total
— —
2600.0
100
1000000
53.977859
539779
Bond Wire
Aluminum and Its Alloys
Aluminum
7429-90-5
0.119584
99.130420
991304
0.002483
25
Copper and Its Alloys
Copper
7440-50-8
0.000002
0.001658
17
0.000000
0
Copper and Its Alloys
Iron
7439-89-6
0.000004
0.003316
33
0.000000
0
Other Inorganic Materials
Silicon
7440-21-3
0.00104
0.862119
8621
0.000022
0
Other Nonferrous Metals and Alloys
Calcium
7440-70-2
0.000001
0.000829
8
0.000000
0
Precious Metals
Silver
7440-22-4
0.000002
0.001658
17
0.000000
0
Sub-total
— —
0.120633
100
1000000
0.002504
25
Die Attach Adhesive
Other Nonferrous Metals and Alloys
Lead Borate Glass
65997-18-4
0.025382
15.000207
150002
0.000527
5
Other Plastics and Rubber
Other Filler
—
0.008461
5.000266
50003
0.000176
2
Precious Metals
Silver
7440-22-4
0.135368
79.999527
799995
0.002810
28
Sub-total
— —
0.169211
100
1000000
0.003513
35
Lead Frame
Aluminum and Its Alloys
Aluminum
7429-90-5
1.22
0.100000
1000
0.025328
253
Copper and Its Alloys
Iron
7439-89-6
700.8778
57.449000
574490
14.550724
145507
Copper and Its Alloys
Phosphorus
7723-14-0
0.305
0.025000
250
0.006332
63
Nickel and Its Alloys
Nickel
7440-02-0
500.2
41.000000
410000
10.384510
103845
Other Inorganic Materials
Silicon
7440-21-3
3.66
0.300000
3000
0.075984
760
Other Inorganic Materials
Sulfur
7704-34-9
0.305
0.025000
250
0.006332
63
Other Nonferrous Metals and Alloys
Chromium
7440-47-3
3.05
0.250000
2500
0.063320
633
Other Nonferrous Metals and Alloys
Cobalt
7440-48-4
0.0122
0.001000
10
0.000253
3
Other Nonferrous Metals and Alloys
Manganese
7439-96-5
9.76
0.800000
8000
0.202625
2026
Other Plastics and Rubber
Carbon
7440-44-0
0.61
0.050000
500
0.012664
127
Sub-total
— —
1220.0000
100
1000000
25.328072
253281
Lead Frame Plating
Other Nonferrous Metals and Alloys
Lead
7439-92-1
4.514
37.000000
370000
0.093714
937
Other Nonferrous Metals and Alloys
Tin
7440-31-5
7.686
63.000000
630000
0.159567
1596
Sub-total
— —
12.200
100
1000000
0.253281
2533
Lid
Not Categorized
Cobalt Oxide
1308-06-1
1.88523
0.300000
3000
0.039139
391
Not Categorized
Other (Ceramic w/out Declarable Substance)
—
21.99435
3.500000
35000
0.456618
4566
Other Inorganic Materials
Aluminum Oxide
1344-28-1
548.60193
87.300000
873000
11.389368
113894
Other Inorganic Materials
Silicon Dioxide
7631-86-9
16.33866
2.600000
26000
0.339202
3392
Other Inorganic Materials
Titanium Oxide
13463-67-7
10.05456
1.600000
16000
0.208740
2087
Other Nonferrous Metals and Alloys
Chromium Oxide
1308-38-9
8.79774
1.400000
14000
0.182647
1826
Other Nonferrous Metals and Alloys
Manganese Dioxide
1313-13-9
20.73753
3.300000
33000
0.430526
4305
Sub-total
— —
628.41000
100
1000000
13.046241
130462
Lid - Seal
Glass Frit
Iron Cobalt Chromite Black Spinel
68186-97-0
1.77035
0.500000
5000
0.036754
368
Glass Frit
Other (Glass w/out Declarable Substance)
NA
15.93315
4.500000
45000
0.330784
3308
Glass Frit
Silicate Acid, Zinc Salt (4:3)
96906-37-5
53.1105
15.000000
150000
1.102612
11026
Glass Frit
Zinc Stannate
12036-37-2
88.5175
25.000000
250000
1.837687
18377
Other Nonferrous Metals and Alloys
Boron Oxide
1303-86-2
17.7035
5.000000
50000
0.367537
3675
Other Nonferrous Metals and Alloys
Lead Monoxide
1317-36-8
177.035
50.000000
500000
3.675373
36754
Sub-total
— —
354.07000
100
1000000
7.350746
73507
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
1.81998
100.000000
1000000
0.037784
378
Sub-total
— —
1.81998
100
1000000
0.037784
378
Total
— —
4816.789824
— —
100
1000000

Qualification summary

Stress Reference Min lot qty SS / lot Condition Duration Result Notes
HTOL JESD22-A108 3 77 Life test, 125C 1000 hours Pass Or equivalent JEDEC condition
HTSL JESD22-A103 3 25 High temp storage bake, 150C 1000 hours Pass Or equivalent JEDEC condition
AC/UHAST JESD22-A102/JESD22-A118 3 25 Unbiased HAST 130C / 85% RH 96 hours Pass Or equivalent JEDEC condition
THB/HAST JESD22-A101/JESD22-A110 3 25 HAST 130C/85%RH 96 hours Pass Or equivalent JEDEC condition
TC JESD22-A104 3 25 Temperature cycle -65/150C 500 cycles Pass Or equivalent JEDEC condition
SD J-STD-002 3 22 Per specification >95% lead coverage Pass —
HBM JS-001 1 3 ESD - HBM Classification See data sheet —
CDM JS-002 1 3 ESD - CDM Classification See data sheet —
LU JESD78 1 3 Latch-up Per JESD78 Pass As applicable per JESD78
MSL J-STD-020 — — Per J-STD-020 Classification See data sheet —

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
CMOS Life test 125C, 1000 Hours or Equivalent JEDEC Condition 1232 54768 Pass
Assembly process reliability data
Package Family Reliability Test Cumulative Sample Size Disposition
CDIP High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 77 Pass
CDIP Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 461 Pass
CDIP Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 77 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.