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CD4518BE ACTIVE

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Rating

Catalog
RoHS Yes
RoHS Yes
REACH Yes
REACH Yes
Device Marking CD4518BE
Lead finish/Ball material NiPdAu
Lead finish/Ball material NiPdAu
MSL rating/Peak reflow Level-NC-NC-NC
MSL rating/Peak reflow Level-NC-NC-NC

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
3.71x108 2.8 55 60 0.7 125 1000 4333 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.099324
99.997986
999980
0.007584
76
Precious Metals
Silver
7440-22-4
0.000002
0.002014
20
0.000000
0
Sub-total
— —
0.099326
100
1000000
0.007584
76
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.36081
80.000089
800001
0.027548
275
Thermoplastics
Epoxy
85954-11-6
0.090202
19.999911
199999
0.006887
69
Sub-total
— —
0.451012
100
1000000
0.034435
344
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
401.898608
97.050000
970500
30.685431
306854
Copper and Its Alloys
Iron
7439-89-6
10.76699
2.600000
26000
0.822072
8221
Copper and Its Alloys
Phosphorus
7723-14-0
0.621173
0.150000
1500
0.047427
474
Zinc and Its Alloys
Zinc
7440-66-6
0.82823
0.200000
2000
0.063236
632
Sub-total
— —
414.115001
100
1000000
31.618167
316182
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
1.360216
95.120000
951200
0.103854
1039
Precious Metals
Gold
7440-57-5
0.011154
0.780000
7800
0.000852
9
Precious Metals
Palladium
7440-05-3
0.05863
4.100000
41000
0.004476
45
Sub-total
— —
1.430000
100
1000000
0.109182
1092
Mold Compound
Not Categorized
Phenolic Resin
9003-35-4
31.225814
3.500000
35000
2.384128
23841
Other Inorganic Materials
Fused Silica
60676-86-0
762.802019
85.500000
855000
58.240830
582408
Other Organic Materials
Carbon Black
1333-86-4
4.460831
0.500000
5000
0.340590
3406
Thermoplastics
Epoxy
85954-11-6
93.677441
10.500000
105000
7.152383
71524
Sub-total
— —
892.166105
100
1000000
68.117930
681179
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
1.476099
100.000000
1000000
0.112702
1127
Sub-total
— —
1.476099
100
1000000
0.112702
1127
Total
— —
1309.737543
— —
100
1000000
Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.100786
99.999008
999990
0.007613
76
Precious Metals
Silver
7440-22-4
0.000001
0.000992
10
0.000000
0
Sub-total
— —
0.100787
100
1000000
0.007613
76
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.36081
80.000089
800001
0.027255
273
Thermoplastics
Epoxy
85954-11-6
0.090202
19.999911
199999
0.006814
68
Sub-total
— —
0.451012
100
1000000
0.034069
341
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
415.50987
97.050000
970500
31.387093
313871
Copper and Its Alloys
Iron
7439-89-6
11.13164
2.600000
26000
0.840870
8409
Copper and Its Alloys
Phosphorus
7723-14-0
0.64221
0.150000
1500
0.048512
485
Zinc and Its Alloys
Zinc
7440-66-6
0.85628
0.200000
2000
0.064682
647
Sub-total
— —
428.14000
100
1000000
32.341157
323412
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
1.417288
95.120000
951200
0.107060
1071
Precious Metals
Gold
7440-57-5
0.011622
0.780000
7800
0.000878
9
Precious Metals
Palladium
7440-05-3
0.06109
4.100000
41000
0.004615
46
Sub-total
— —
1.490000
100
1000000
0.112553
1126
Mold Compound
Not Categorized
Phenolic Resin
9003-35-4
31.225814
3.500000
35000
2.358759
23588
Other Inorganic Materials
Fused Silica
60676-86-0
762.802019
85.500000
855000
57.621105
576211
Other Organic Materials
Carbon Black
1333-86-4
4.460831
0.500000
5000
0.336966
3370
Thermoplastics
Epoxy
85954-11-6
93.677441
10.500000
105000
7.076276
70763
Sub-total
— —
892.166105
100
1000000
67.393105
673931
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
1.476099
100.000000
1000000
0.111503
1115
Sub-total
— —
1.476099
100
1000000
0.111503
1115
Total
— —
1323.824003
— —
100
1000000

Qualification summary

Stress Reference Min lot qty SS / lot Condition Duration Result Notes
HTOL JESD22-A108 3 77 Life test, 125C 1000 hours Pass Or equivalent JEDEC condition
HTSL JESD22-A103 3 25 High temp storage bake, 150C 1000 hours Pass Or equivalent JEDEC condition
AC/UHAST JESD22-A102/JESD22-A118 3 25 Unbiased HAST 130C / 85% RH 96 hours Pass Or equivalent JEDEC condition
THB/HAST JESD22-A101/JESD22-A110 3 25 HAST 130C/85%RH 96 hours Pass Or equivalent JEDEC condition
TC JESD22-A104 3 25 Temperature cycle -65/150C 500 cycles Pass Or equivalent JEDEC condition
SD J-STD-002 3 22 Per specification >95% lead coverage Pass —
HBM JS-001 1 3 ESD - HBM Classification See data sheet —
CDM JS-002 1 3 ESD - CDM Classification See data sheet —
LU JESD78 1 3 Latch-up Per JESD78 Pass As applicable per JESD78
MSL J-STD-020 — — Per J-STD-020 Classification See data sheet —

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
CMOS Life test 125C, 1000 Hours or Equivalent JEDEC Condition 1232 54768 Pass
Assembly process reliability data
Package Family Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
PDIP Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 0 6916 Pass
PDIP High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 0 7567 Pass
PDIP Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 462 16583 Pass
PDIP Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 0 15442 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.