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CD74ACT05E ACTIVE

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Rating

Catalog
RoHS Yes
RoHS Yes
REACH Yes
REACH Yes
Device Marking CD74ACT05E
Lead finish/Ball material NiPdAu
Lead finish/Ball material NiPdAu
MSL rating/Peak reflow Level-NC-NC-NC
MSL rating/Peak reflow Level-NC-NC-NC

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
3.77x107 26.5 55 60 0.7 125 1000 440 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.101871
99.998037
999980
0.006458
65
Precious Metals
Silver
7440-22-4
0.000002
0.001963
20
0.000000
0
Sub-total
— —
0.101873
100
1000000
0.006458
65
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.362235
79.999956
800000
0.022962
230
Thermoplastics
Epoxy
85954-11-6
0.090559
20.000044
200000
0.005741
57
Sub-total
— —
0.452794
100
1000000
0.028703
287
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
381.125055
97.050000
970500
24.159507
241595
Copper and Its Alloys
Iron
7439-89-6
10.21046
2.600000
26000
0.647241
6472
Copper and Its Alloys
Phosphorus
7723-14-0
0.589065
0.150000
1500
0.037341
373
Zinc and Its Alloys
Zinc
7440-66-6
0.78542
0.200000
2000
0.049788
498
Sub-total
— —
392.710000
100
1000000
24.893876
248939
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
1.33168
95.120000
951200
0.084415
844
Precious Metals
Gold
7440-57-5
0.01092
0.780000
7800
0.000692
7
Precious Metals
Palladium
7440-05-3
0.0574
4.100000
41000
0.003639
36
Sub-total
— —
1.40000
100
1000000
0.088746
887
Mold Compound
Not Categorized
Phenolic Resin
9003-35-4
41.348648
3.500000
35000
2.621090
26211
Other Inorganic Materials
Fused Silica
60676-86-0
1010.088413
85.500000
855000
64.029478
640295
Other Organic Materials
Carbon Black
1333-86-4
5.90695
0.500000
5000
0.374441
3744
Thermoplastics
Epoxy
85954-11-6
124.045945
10.500000
105000
7.863269
78633
Sub-total
— —
1181.389956
100
1000000
74.888278
748883
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
1.481931
100.000000
1000000
0.093940
939
Sub-total
— —
1.481931
100
1000000
0.093940
939
Total
— —
1577.536554
— —
100
1000000
Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.094077
99.990434
999904
0.005964
60
Not Categorized
Proprietary Materials
—
0.000007
0.007440
74
0.000000
0
Precious Metals
Silver
7440-22-4
0.000002
0.002126
21
0.000000
0
Sub-total
— —
0.094086
100
1000000
0.005964
60
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.362235
79.999956
800000
0.022962
230
Thermoplastics
Epoxy
85954-11-6
0.090559
20.000044
200000
0.005741
57
Sub-total
— —
0.452794
100
1000000
0.028703
287
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
381.125055
97.050000
970500
24.159626
241596
Copper and Its Alloys
Iron
7439-89-6
10.21046
2.600000
26000
0.647244
6472
Copper and Its Alloys
Phosphorus
7723-14-0
0.589065
0.150000
1500
0.037341
373
Zinc and Its Alloys
Zinc
7440-66-6
0.78542
0.200000
2000
0.049788
498
Sub-total
— —
392.710000
100
1000000
24.893999
248940
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
1.33168
95.120000
951200
0.084416
844
Precious Metals
Gold
7440-57-5
0.01092
0.780000
7800
0.000692
7
Precious Metals
Palladium
7440-05-3
0.0574
4.100000
41000
0.003639
36
Sub-total
— —
1.40000
100
1000000
0.088746
887
Mold Compound
Not Categorized
Phenolic Resin
9003-35-4
41.348648
3.500000
35000
2.621103
26211
Other Inorganic Materials
Fused Silica
60676-86-0
1010.088413
85.500000
855000
64.029794
640298
Other Organic Materials
Carbon Black
1333-86-4
5.90695
0.500000
5000
0.374443
3744
Thermoplastics
Epoxy
85954-11-6
124.045945
10.500000
105000
7.863308
78633
Sub-total
— —
1181.389956
100
1000000
74.888647
748886
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
1.481931
100.000000
1000000
0.093940
939
Sub-total
— —
1.481931
100
1000000
0.093940
939
Total
— —
1577.528767
— —
100
1000000

Qualification summary

Stress Reference Min lot qty SS / lot Condition Duration Result Notes
HTOL JESD22-A108 3 77 Life test, 125C 1000 hours Pass Or equivalent JEDEC condition
HTSL JESD22-A103 3 25 High temp storage bake, 150C 1000 hours Pass Or equivalent JEDEC condition
AC/UHAST JESD22-A102/JESD22-A118 3 25 Unbiased HAST 130C / 85% RH 96 hours Pass Or equivalent JEDEC condition
THB/HAST JESD22-A101/JESD22-A110 3 25 HAST 130C/85%RH 96 hours Pass Or equivalent JEDEC condition
TC JESD22-A104 3 25 Temperature cycle -65/150C 500 cycles Pass Or equivalent JEDEC condition
SD J-STD-002 3 22 Per specification >95% lead coverage Pass —
HBM JS-001 1 3 ESD - HBM Classification See data sheet —
CDM JS-002 1 3 ESD - CDM Classification See data sheet —
LU JESD78 1 3 Latch-up Per JESD78 Pass As applicable per JESD78
MSL J-STD-020 — — Per J-STD-020 Classification See data sheet —

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
CMOS Life test 125C, 1000 Hours or Equivalent JEDEC Condition 1232 54768 Pass
Assembly process reliability data
Package Family Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
PDIP Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 0 6916 Pass
PDIP High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 0 7567 Pass
PDIP Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 462 16583 Pass
PDIP Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 0 15442 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.