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CD74ACT05M96 ACTIVE

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Rating

Catalog
RoHS Yes
RoHS Yes
REACH Yes
REACH Yes
Device Marking ACT05M
Lead finish/Ball material NiPdAu
Lead finish/Ball material NiPdAu
MSL rating/Peak reflow Level-1-260C-UNLIM
MSL rating/Peak reflow Level-1-260C-UNLIM

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
8.71x109 0.1 55 60 0.7 125 1000 101758 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.067821
97.535054
975351
0.046568
466
Not Categorized
Proprietary Materials
—
0.000008
0.011505
115
0.000005
0
Precious Metals
Gold
7440-57-5
0.000036
0.051772
518
0.000025
0
Precious Metals
Palladium
7440-05-3
0.001668
2.398792
23988
0.001145
11
Precious Metals
Silver
7440-22-4
0.000002
0.002876
29
0.000001
0
Sub-total
— —
0.069535
100
1000000
0.047745
477
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.038879
79.999588
799996
0.026696
267
Thermoplastics
Epoxy
85954-11-6
0.00972
20.000412
200004
0.006674
67
Sub-total
— —
0.048599
100
1000000
0.033370
334
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
47.1663
97.050000
970500
32.385958
323860
Copper and Its Alloys
Iron
7439-89-6
1.2636
2.600000
26000
0.867630
8676
Copper and Its Alloys
Phosphorus
7723-14-0
0.0729
0.150000
1500
0.050056
501
Zinc and Its Alloys
Zinc
7440-66-6
0.0972
0.200000
2000
0.066741
667
Sub-total
— —
48.6000
100
1000000
33.370385
333704
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
0.19024
95.120000
951200
0.130625
1306
Precious Metals
Gold
7440-57-5
0.00156
0.780000
7800
0.001071
11
Precious Metals
Palladium
7440-05-3
0.0082
4.100000
41000
0.005630
56
Sub-total
— —
0.20000
100
1000000
0.137327
1373
Mold Compound
Not Categorized
Phenolic Resin
9003-35-4
3.381217
3.500000
35000
2.321657
23217
Other Inorganic Materials
Fused Silica
60676-86-0
82.598304
85.500000
855000
56.714757
567148
Other Organic Materials
Carbon Black
1333-86-4
0.483031
0.500000
5000
0.331665
3317
Thermoplastics
Epoxy
85954-11-6
10.143651
10.500000
105000
6.964970
69650
Sub-total
— —
96.606203
100
1000000
66.333048
663330
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
0.113781
100.000000
1000000
0.078126
781
Sub-total
— —
0.113781
100
1000000
0.078126
781
Total
— —
145.638118
— —
100
1000000
Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.086309
99.998841
999988
0.057647
576
Precious Metals
Silver
7440-22-4
0.000001
0.001159
12
0.000001
0
Sub-total
— —
0.086310
100
1000000
0.057648
576
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.362235
79.999956
800000
0.241942
2419
Thermoplastics
Epoxy
85954-11-6
0.090559
20.000044
200000
0.060486
605
Sub-total
— —
0.452794
100
1000000
0.302428
3024
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
51.63279
99.870000
998700
34.486321
344863
Copper and Its Alloys
Iron
7439-89-6
0.0517
0.100000
1000
0.034531
345
Copper and Its Alloys
Phosphorus
7723-14-0
0.01551
0.030000
300
0.010359
104
Sub-total
— —
51.70000
100
1000000
34.531212
345312
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
0.741936
95.120000
951200
0.495550
4956
Precious Metals
Gold
7440-57-5
0.006084
0.780000
7800
0.004064
41
Precious Metals
Palladium
7440-05-3
0.03198
4.100000
41000
0.021360
214
Sub-total
— —
0.780000
100
1000000
0.520974
5210
Mold Compound
Not Categorized
Phenolic Resin
9003-35-4
3.332651
3.500000
35000
2.225928
22259
Other Inorganic Materials
Fused Silica
60676-86-0
81.411892
85.499999
855000
54.376234
543762
Other Organic Materials
Carbon Black
1333-86-4
0.476093
0.500000
5000
0.317990
3180
Thermoplastics
Epoxy
85954-11-6
9.997952
10.500000
105000
6.677783
66778
Sub-total
— —
95.218588
100
1000000
63.597935
635979
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
1.481931
100.000000
1000000
0.989804
9898
Sub-total
— —
1.481931
100
1000000
0.989804
9898
Total
— —
149.719623
— —
100
1000000

Qualification summary

Stress Reference Min lot qty SS / lot Condition Duration Result Notes
HTOL JESD22-A108 3 77 Life test, 125C 1000 hours Pass Or equivalent JEDEC condition
HTSL JESD22-A103 3 25 High temp storage bake, 150C 1000 hours Pass Or equivalent JEDEC condition
AC/UHAST JESD22-A102/JESD22-A118 3 25 Unbiased HAST 130C / 85% RH 96 hours Pass Or equivalent JEDEC condition
THB/HAST JESD22-A101/JESD22-A110 3 25 HAST 130C/85%RH 96 hours Pass Or equivalent JEDEC condition
TC JESD22-A104 3 25 Temperature cycle -65/150C 500 cycles Pass Or equivalent JEDEC condition
SD J-STD-002 3 22 Per specification >95% lead coverage Pass —
HBM JS-001 1 3 ESD - HBM Classification See data sheet —
CDM JS-002 1 3 ESD - CDM Classification See data sheet —
LU JESD78 1 3 Latch-up Per JESD78 Pass As applicable per JESD78
MSL J-STD-020 — — Per J-STD-020 Classification See data sheet —

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
Power BICMOS High temperature gate bias 150C, 1000 Hours or Equivalent JEDEC Condition 924 924 Pass
Power BICMOS High temperature reverse bias 125C, 1000 Hours or Equivalent JEDEC Condition 1386 1386 Pass
Power BICMOS Life test 125C, 1000 Hours or Equivalent JEDEC Condition 28135 458306 Pass
Assembly process reliability data
Package Family Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
SOIC Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 5061 85479 Pass
SOIC High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 5627 74925 Pass
SOIC Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 13223 189952 Pass
SOIC Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 7777 139298 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.