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CD74ACT05PWR ACTIVE

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Rating

Catalog
RoHS Yes
RoHS Yes
REACH Yes
REACH Yes
Device Marking AD05
Lead finish/Ball material Sn
Lead finish/Ball material NiPdAu
MSL rating/Peak reflow Level-1-260C-UNLIM
MSL rating/Peak reflow Level-1-260C-UNLIM

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
8.71x109 0.1 55 60 0.7 125 1000 101758 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.029561
95.158539
951585
0.045664
457
Precious Metals
Gold
7440-57-5
0.000231
0.743602
7436
0.000357
4
Precious Metals
Palladium
7440-05-3
0.001273
4.097859
40979
0.001966
20
Sub-total
— —
0.031065
100
1000000
0.047988
480
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.041948
80.000000
800000
0.064799
648
Thermoplastics
Epoxy
85954-11-6
0.010487
20.000000
200000
0.016200
162
Sub-total
— —
0.052435
100
1000000
0.080999
810
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
16.683485
97.427499
974275
25.771805
257718
Copper and Its Alloys
Iron
7439-89-6
0.402414
2.350000
23500
0.621629
6216
Copper and Its Alloys
Phosphorus
7723-14-0
0.014127
0.082498
825
0.021823
218
Other Nonferrous Metals and Alloys
Lead
7439-92-1
0.002569
0.015002
150
0.003968
40
Zinc and Its Alloys
Zinc
7440-66-6
0.021405
0.125000
1250
0.033065
331
Sub-total
— —
17.124000
100
1000000
26.452290
264523
Lead Frame Plating
Other Nonferrous Metals and Alloys
Tin
7440-31-5
1.1893
100.000000
1000000
1.837171
18372
Sub-total
— —
1.1893
100
1000000
1.837171
18372
Mold Compound
Other Inorganic Materials
Fused Silica
60676-86-0
39.991654
86.600000
866000
61.777088
617771
Other Organic Materials
Carbon Black
1333-86-4
0.06927
0.150001
1500
0.107005
1070
Thermoplastics
Epoxy
85954-11-6
6.118815
13.249999
132500
9.452036
94520
Sub-total
— —
46.179739
100
1000000
71.336129
713361
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
0.158876
100.000000
1000000
0.245424
2454
Sub-total
— —
0.158876
100
1000000
0.245424
2454
Total
— —
64.735415
— —
100
1000000
Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.048127
97.537595
975376
0.064554
646
Not Categorized
Proprietary Materials
—
0.000005
0.010133
101
0.000007
0
Precious Metals
Gold
7440-57-5
0.000025
0.050667
507
0.000034
0
Precious Metals
Palladium
7440-05-3
0.001184
2.399578
23996
0.001588
16
Precious Metals
Silver
7440-22-4
0.000001
0.002027
20
0.000001
0
Sub-total
— —
0.049342
100
1000000
0.066184
662
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.038879
79.999588
799996
0.052150
521
Thermoplastics
Epoxy
85954-11-6
0.00972
20.000412
200004
0.013038
130
Sub-total
— —
0.048599
100
1000000
0.065187
652
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
28.619871
97.346500
973465
38.388769
383888
Copper and Its Alloys
Iron
7439-89-6
0.717654
2.441000
24410
0.962613
9626
Copper and Its Alloys
Phosphorus
7723-14-0
0.024255
0.082500
825
0.032534
325
Zinc and Its Alloys
Zinc
7440-66-6
0.03822
0.130000
1300
0.051266
513
Sub-total
— —
29.400000
100
1000000
39.435182
394352
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
0.097022
95.119608
951196
0.130139
1301
Precious Metals
Gold
7440-57-5
0.000796
0.780392
7804
0.001068
11
Precious Metals
Palladium
7440-05-3
0.004182
4.100000
41000
0.005609
56
Sub-total
— —
0.102000
100
1000000
0.136816
1368
Mold Compound
Other Inorganic Materials
Silica
7631-86-9
38.113147
85.000001
850000
51.122411
511224
Other Organic Materials
Carbon Black
1333-86-4
0.224195
0.500000
5000
0.300720
3007
Thermoplastics
Epoxy
85954-11-6
6.501654
14.499999
145000
8.720881
87209
Sub-total
— —
44.838996
100
1000000
60.144012
601440
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
0.113781
100.000000
1000000
0.152618
1526
Sub-total
— —
0.113781
100
1000000
0.152618
1526
Total
— —
74.552718
— —
100
1000000

Qualification summary

Stress Reference Min lot qty SS / lot Condition Duration Result Notes
HTOL JESD22-A108 3 77 Life test, 125C 1000 hours Pass Or equivalent JEDEC condition
HTSL JESD22-A103 3 25 High temp storage bake, 150C 1000 hours Pass Or equivalent JEDEC condition
AC/UHAST JESD22-A102/JESD22-A118 3 25 Unbiased HAST 130C / 85% RH 96 hours Pass Or equivalent JEDEC condition
THB/HAST JESD22-A101/JESD22-A110 3 25 HAST 130C/85%RH 96 hours Pass Or equivalent JEDEC condition
TC JESD22-A104 3 25 Temperature cycle -65/150C 500 cycles Pass Or equivalent JEDEC condition
SD J-STD-002 3 22 Per specification >95% lead coverage Pass —
HBM JS-001 1 3 ESD - HBM Classification See data sheet —
CDM JS-002 1 3 ESD - CDM Classification See data sheet —
LU JESD78 1 3 Latch-up Per JESD78 Pass As applicable per JESD78
MSL J-STD-020 — — Per J-STD-020 Classification See data sheet —

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
Power BICMOS High temperature gate bias 150C, 1000 Hours or Equivalent JEDEC Condition 924 924 Pass
Power BICMOS High temperature reverse bias 125C, 1000 Hours or Equivalent JEDEC Condition 1386 1386 Pass
Power BICMOS Life test 125C, 1000 Hours or Equivalent JEDEC Condition 28135 458306 Pass
Assembly process reliability data
Package Family Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
TSSOP Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 2387 48648 Pass
TSSOP High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 2187 38360 Pass
TSSOP Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 5852 105153 Pass
TSSOP Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 4389 85262 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.