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Quality, reliability & packaging data download

CD74ACT86MDREP ACTIVE

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Quality data will change based on assembly site

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Rating

HiRel Enhanced Product
RoHS Yes
REACH Yes
Device Marking ACT86MEP
Lead finish/Ball material NiPdAu
MSL rating/Peak reflow Level-1-260C-UNLIM

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
9.3x108 1.1 55 60 0.7 125 1000 10859 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Other Nonferrous Metals and Alloys
Yttrium
7440-65-5
0.000001
0.000786
8
0.000001
0
Precious Metals
Gold
7440-57-5
0.127166
99.998427
999984
0.065241
652
Precious Metals
Silver
7440-22-4
0.000001
0.000786
8
0.000001
0
Sub-total
— —
0.127168
100
1000000
0.065242
652
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.193579
79.999917
799999
0.099313
993
Thermoplastics
Epoxy
85954-11-6
0.048395
20.000083
200001
0.024828
248
Sub-total
— —
0.241974
100
1000000
0.124141
1241
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
97.375
97.375000
973750
49.956719
499567
Copper and Its Alloys
Iron
7439-89-6
2.6
2.600000
26000
1.333889
13339
Copper and Its Alloys
Phosphorus
7723-14-0
0.015
0.015000
150
0.007696
77
Other Nonferrous Metals and Alloys
Lead
7439-92-1
0.01
0.010000
100
0.005130
51
Sub-total
— —
100.000
100
1000000
51.303435
513034
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
4.37552
95.120000
951200
2.244792
22448
Precious Metals
Gold
7440-57-5
0.03588
0.780000
7800
0.018408
184
Precious Metals
Palladium
7440-05-3
0.1886
4.100000
41000
0.096758
968
Sub-total
— —
4.60000
100
1000000
2.359958
23600
Mold Compound
Not Categorized
Phenolic Resin
9003-35-4
3.120548
3.500000
35000
1.600948
16009
Other Inorganic Materials
Fused Silica
60676-86-0
76.23054
85.500000
855000
39.108885
391089
Other Organic Materials
Carbon Black
1333-86-4
0.445793
0.500000
5000
0.228707
2287
Thermoplastics
Epoxy
85954-11-6
9.361645
10.500000
105000
4.802845
48028
Sub-total
— —
89.158526
100
1000000
45.741386
457414
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
0.791056
100.000000
1000000
0.405839
4058
Sub-total
— —
0.791056
100
1000000
0.405839
4058
Total
— —
194.918724
— —
100
1000000

Qualification summary

Stress Reference Min lot qty SS / lot Condition Duration Result
HTOL JESD22-A108 3 77 Life test, 125C 1000 hours Pass
HTSL JESD22-A103 3 25 High temp storage bake 150C 1000 hours Pass
AC/UHAST JESD22-A102/JESD22-A118 3 25 Autoclave 121C or unbiased HAST 130C / 85% RH 96 hours Pass
THB/HAST JESD22-A101/JESD22-A110 3 25 THB 85C/85%RH or HAST 130C/110C/85%RH 1000 hours or 96 hours Pass
TC JESD22-A104 3 25 Temperature cycle -65/150C 500 cycles Pass
SD J-STD-002 3 22 Per specification >95% lead coverage Pass
HBM JS-001 1 3 ESD - HBM Classification See data sheet
CDM JESD22-C101 1 3 ESD - CDM Classification See data sheet
LU JESD78 1 3 Latch-up Per JESD78 Pass
MSL J-STD-020 — — Per J-STD-020 Classification See data sheet

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
CMOS Life test 125C, 1000 Hours or Equivalent JEDEC Condition 1232 54768 Pass
Assembly process reliability data
Package Family Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
SOIC Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 5061 85479 Pass
SOIC High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 5627 74925 Pass
SOIC Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 13223 189952 Pass
SOIC Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 7777 139298 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.