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Quality, reliability & packaging data download

CDCDB2000ENPPR ACTIVE

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Rating

Catalog
RoHS Yes
REACH Yes
Device Marking CDCDB, 2000
Lead finish/Ball material NiPdAu
MSL rating/Peak reflow Level-3-260C-168 HR

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
3.3x108 3.0 55 60 0.7 125 1000 3854 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.373003
95.629044
956290
0.412068
4121
Precious Metals
Gold
7440-57-5
0.004146
1.062935
10629
0.004580
46
Precious Metals
Palladium
7440-05-3
0.012897
3.306482
33065
0.014248
142
Precious Metals
Silver
7440-22-4
0.000006
0.001538
15
0.000007
0
Sub-total
— —
0.390052
100
1000000
0.430902
4309
Die Attach Adhesive
Other Plastics and Rubber
Other Filler
—
0.004979
0.500028
5000
0.005500
55
Precious Metals
Silver
7440-22-4
0.811531
81.499964
815000
0.896523
8965
Thermoplastics
Acrylates Copolymer
25133-97-5
0.179234
18.000008
180000
0.198005
1980
Sub-total
— —
0.995744
100
1000000
1.100029
11000
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
34.748
99.280000
992800
38.387168
383872
Other Nonferrous Metals and Alloys
Chromium
7440-47-3
0.0875
0.250000
2500
0.096664
967
Other Nonferrous Metals and Alloys
Tin
7440-31-5
0.0875
0.250000
2500
0.096664
967
Zinc and Its Alloys
Zinc
7440-66-6
0.077
0.220000
2200
0.085064
851
Sub-total
— —
35.0000
100
1000000
38.665560
386656
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
0.19024
95.120000
951200
0.210164
2102
Precious Metals
Gold
7440-57-5
0.00156
0.780000
7800
0.001723
17
Precious Metals
Palladium
7440-05-3
0.0082
4.100000
41000
0.009059
91
Sub-total
— —
0.20000
100
1000000
0.220946
2209
Mold Compound
Other Inorganic Materials
Fused Silica
60676-86-0
43.65985
86.299998
863000
48.232359
482324
Other Nonferrous Metals and Alloys
Metal Hydroxide
Trade Secret
0.758862
1.500000
15000
0.838338
8383
Other Organic Materials
Carbon Black
1333-86-4
0.101182
0.200001
2000
0.111779
1118
Thermoplastics
Epoxy
85954-11-6
6.070895
12.000001
120000
6.706702
67067
Sub-total
— —
50.590789
100
1000000
55.889177
558892
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
3.343247
100.000000
1000000
3.693386
36934
Sub-total
— —
3.343247
100
1000000
3.693386
36934
Total
— —
90.519832
— —
100
1000000

Qualification summary

No results found

Ongoing reliability monitoring

No results found

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.