Home  >  Quality & reliability  >  Quality, reliability & packaging data download

Quality, reliability & packaging data download

DAC5686IPZP ACTIVE

By using this tool to “search” or “download”, you agree to TI’s terms of use, privacy policy (including cookie policy), and important notice.

Search more parts

Filter between the data types to view or download

Quality data will change based on assembly site

Download .xls Download PDF

Rating

Catalog
RoHS Yes
REACH Yes
Device Marking DAC5686IPZP
Lead finish/Ball material NiPdAu
MSL rating/Peak reflow Level-3-260C-168 HR

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
1.38x109 0.7 55 60 0.7 125 1000 16105 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Iron
7439-89-6
0.000005
0.000199
2
0.000001
0
Magnesium and Its Alloys
Magnesium
7439-95-4
0.000001
0.000040
0
0.000000
0
Other Nonferrous Metals and Alloys
Beryllium
7440-41-7
0.000002
0.000079
1
0.000000
0
Other Nonferrous Metals and Alloys
Calcium
7440-70-2
0.000006
0.000238
2
0.000001
0
Other Nonferrous Metals and Alloys
Yttrium
7440-65-5
0.000017
0.000675
7
0.000002
0
Precious Metals
Gold
7440-57-5
2.518274
99.997697
999977
0.304542
3045
Precious Metals
Silver
7440-22-4
0.000027
0.001072
11
0.000003
0
Sub-total
— —
2.518332
100
1000000
0.304549
3045
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
1.704088
69.999984
700000
0.206080
2061
Thermoplastics
Epoxy
85954-11-6
0.730324
30.000016
300000
0.088320
883
Sub-total
— —
2.434412
100
1000000
0.294401
2944
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
466.51264
97.450000
974500
56.416729
564167
Copper and Its Alloys
Iron
7439-89-6
11.48928
2.400000
24000
1.389432
13894
Copper and Its Alloys
Phosphorus
7723-14-0
0.143616
0.030000
300
0.017368
174
Zinc and Its Alloys
Zinc
7440-66-6
0.574464
0.120000
1200
0.069472
695
Sub-total
— —
478.720000
100
1000000
57.893000
578930
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
0.580232
95.120000
951200
0.070169
702
Precious Metals
Gold
7440-57-5
0.004758
0.780000
7800
0.000575
6
Precious Metals
Palladium
7440-05-3
0.02501
4.100000
41000
0.003025
30
Sub-total
— —
0.610000
100
1000000
0.073769
738
Mold Compound
Not Categorized
Phenolic Resin
9003-35-4
9.847761
3.000000
30000
1.190918
11909
Other Inorganic Materials
Fused Silica
60676-86-0
292.150248
89.000000
890000
35.330578
353306
Other Organic Materials
Carbon Black
1333-86-4
1.641294
0.500000
5000
0.198486
1985
Thermoplastics
Epoxy
85954-11-6
24.619403
7.500000
75000
2.977296
29773
Sub-total
— —
328.258706
100
1000000
39.697279
396973
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
14.363355
100.000000
1000000
1.737002
17370
Sub-total
— —
14.363355
100
1000000
1.737002
17370
Total
— —
826.904805
— —
100
1000000

Qualification summary

Stress Reference Min lot qty SS / lot Condition Duration Result Notes
HTOL JESD22-A108 3 77 Life test, 125C 1000 hours Pass Or equivalent JEDEC condition
HTSL JESD22-A103 3 25 High temp storage bake, 150C 1000 hours Pass Or equivalent JEDEC condition
AC/UHAST JESD22-A102/JESD22-A118 3 25 Unbiased HAST 130C / 85% RH 96 hours Pass Or equivalent JEDEC condition
THB/HAST JESD22-A101/JESD22-A110 3 25 HAST 130C/85%RH 96 hours Pass Or equivalent JEDEC condition
TC JESD22-A104 3 25 Temperature cycle -65/150C 500 cycles Pass Or equivalent JEDEC condition
SD J-STD-002 3 22 Per specification >95% lead coverage Pass —
HBM JS-001 1 3 ESD - HBM Classification See data sheet —
CDM JS-002 1 3 ESD - CDM Classification See data sheet —
LU JESD78 1 3 Latch-up Per JESD78 Pass As applicable per JESD78
MSL J-STD-020 — — Per J-STD-020 Classification See data sheet —

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Cumulative Sample Size Disposition
180nm CMOS Life test 125C, 1000 Hours or Equivalent JEDEC Condition 10040 Pass
Assembly process reliability data
Package Family Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
QFP (with Thermal Pad) Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 1694 38743 Pass
QFP (with Thermal Pad) High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 1926 33503 Pass
QFP (with Thermal Pad) Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 4468 76940 Pass
QFP (with Thermal Pad) Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 2482 57494 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

Close

Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.