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DAC8564IBPW ACTIVE

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Rating

Catalog
RoHS Yes
REACH Yes
Device Marking DAC, B, 8564
Lead finish/Ball material NiPdAu
MSL rating/Peak reflow Level-1-260C-UNLIM

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
6.16x109 0.2 55 60 0.7 125 1000 71906 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.091607
99.998908
999989
0.098458
985
Precious Metals
Silver
7440-22-4
0.000001
0.001092
11
0.000001
0
Sub-total
— —
0.091608
100
1000000
0.098459
985
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
1.253754
80.000026
800000
1.347517
13475
Thermoplastics
Epoxy
85954-11-6
0.313438
19.999974
200000
0.336879
3369
Sub-total
— —
1.567192
100
1000000
1.684395
16844
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
53.205722
97.049999
970500
57.184738
571847
Copper and Its Alloys
Iron
7439-89-6
1.425398
2.600000
26000
1.531997
15320
Copper and Its Alloys
Phosphorus
7723-14-0
0.082235
0.150001
1500
0.088385
884
Zinc and Its Alloys
Zinc
7440-66-6
0.109646
0.200000
2000
0.117846
1178
Sub-total
— —
54.823001
100
1000000
58.922966
589230
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
0.181679
95.119895
951199
0.195266
1953
Precious Metals
Gold
7440-57-5
0.00149
0.780105
7801
0.001601
16
Precious Metals
Palladium
7440-05-3
0.007831
4.100000
41000
0.008417
84
Sub-total
— —
0.191000
100
1000000
0.205284
2053
Mold Compound
Other Inorganic Materials
Fused Silica
60676-86-0
26.766126
85.000000
850000
28.767844
287678
Other Organic Materials
Carbon Black
1333-86-4
0.157448
0.500001
5000
0.169223
1692
Thermoplastics
Epoxy
85954-11-6
4.565986
14.499999
145000
4.907455
49075
Sub-total
— —
31.489560
100
1000000
33.844522
338445
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
4.879461
100.000000
1000000
5.244374
52444
Sub-total
— —
4.879461
100
1000000
5.244374
52444
Total
— —
93.041822
— —
100
1000000

Qualification summary

Stress Reference Min lot qty SS / lot Condition Duration Result Notes
HTOL JESD22-A108 3 77 Life test, 125C 1000 hours Pass Or equivalent JEDEC condition
HTSL JESD22-A103 3 25 High temp storage bake, 150C 1000 hours Pass Or equivalent JEDEC condition
AC/UHAST JESD22-A102/JESD22-A118 3 25 Unbiased HAST 130C / 85% RH 96 hours Pass Or equivalent JEDEC condition
THB/HAST JESD22-A101/JESD22-A110 3 25 HAST 130C/85%RH 96 hours Pass Or equivalent JEDEC condition
TC JESD22-A104 3 25 Temperature cycle -65/150C 500 cycles Pass Or equivalent JEDEC condition
SD J-STD-002 3 22 Per specification >95% lead coverage Pass —
HBM JS-001 1 3 ESD - HBM Classification See data sheet —
CDM JS-002 1 3 ESD - CDM Classification See data sheet —
LU JESD78 1 3 Latch-up Per JESD78 Pass As applicable per JESD78
MSL J-STD-020 — — Per J-STD-020 Classification See data sheet —

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (2Q2025 - 1Q2026) Sample Size Cumulative Sample Size Disposition
High-Precision CMOS Life test 125C, 1000 Hours or Equivalent JEDEC Condition 2313 63192 Pass
Assembly process reliability data
Package Family Reliability Test Rolling Year (2Q2025 - 1Q2026) Sample Size Cumulative Sample Size Disposition
TSSOP Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 2156 47955 Pass
TSSOP High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 2486 37439 Pass
TSSOP Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 7084 103613 Pass
TSSOP Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 5082 83568 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.