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Quality, reliability & packaging data download

DS160PR412RUAR ACTIVE

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Rating

Catalog
RoHS Yes
REACH Yes
Device Marking PR412
Lead finish/Ball material NiPdAu
MSL rating/Peak reflow Level-2-260C-1 YEAR

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
4.545x108 2.2 55 60 0.7 125 1000 10970 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.185603
97.534355
975344
0.196445
1964
Nickel and Its Alloys
Nickel
7440-02-0
0.000001
0.000525
5
0.000001
0
Not Categorized
Proprietary Materials
—
0.000021
0.011035
110
0.000022
0
Precious Metals
Gold
7440-57-5
0.000098
0.051499
515
0.000104
1
Precious Metals
Palladium
7440-05-3
0.004566
2.399432
23994
0.004833
48
Precious Metals
Silver
7440-22-4
0.000006
0.003153
32
0.000006
0
Sub-total
— —
0.190295
100
1000000
0.201411
2014
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.551176
80.000000
800000
0.583373
5834
Thermoplastics
Epoxy
85954-11-6
0.137794
20.000000
200000
0.145843
1458
Sub-total
— —
0.688970
100
1000000
0.729216
7292
Die Attach Adhesive 2
Precious Metals
Silver
7440-22-4
0.551176
80.000000
800000
0.583373
5834
Thermoplastics
Epoxy
85954-11-6
0.137794
20.000000
200000
0.145843
1458
Sub-total
— —
0.688970
100
1000000
0.729216
7292
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
55.5864
97.520000
975200
58.833454
588335
Copper and Its Alloys
Iron
7439-89-6
1.311
2.300000
23000
1.387581
13876
Copper and Its Alloys
Phosphorus
7723-14-0
0.0171
0.030000
300
0.018099
181
Zinc and Its Alloys
Zinc
7440-66-6
0.0855
0.150000
1500
0.090494
905
Sub-total
— —
57.0000
100
1000000
60.329628
603296
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
1.626552
95.120000
951200
1.721566
17216
Precious Metals
Gold
7440-57-5
0.013338
0.780000
7800
0.014117
141
Precious Metals
Palladium
7440-05-3
0.07011
4.100000
41000
0.074205
742
Sub-total
— —
1.710000
100
1000000
1.809889
18099
Mold Compound
Other Inorganic Materials
Fused Silica
60676-86-0
27.415469
87.999997
880000
29.016931
290169
Other Organic Materials
Carbon Black
1333-86-4
0.093462
0.300001
3000
0.098922
989
Other Organic Materials
Chlorine
7782-50-5
0.000312
0.001001
10
0.000330
3
Thermoplastics
Epoxy
85954-11-6
3.6447
11.699001
116990
3.857603
38576
Sub-total
— —
31.153943
100
1000000
32.973786
329738
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
1.524381
100.000000
1000000
1.613427
16134
Sub-total
— —
1.524381
100
1000000
1.613427
16134
Semiconductor Device 2
Ceramics / Glass
Doped Silicon
7440-21-3
1.524381
100.000000
1000000
1.613427
16134
Sub-total
— —
1.524381
100
1000000
1.613427
16134
Total
— —
94.480940
— —
100
1000000

Qualification summary

Stress Reference Min lot qty SS / lot Condition Duration Result Notes
HTOL JESD22-A108 3 77 Life test, 125C 1000 hours Pass Or equivalent JEDEC condition
HTSL JESD22-A103 3 25 High temp storage bake, 150C 1000 hours Pass Or equivalent JEDEC condition
AC/UHAST JESD22-A102/JESD22-A118 3 25 Unbiased HAST 130C / 85% RH 96 hours Pass Or equivalent JEDEC condition
THB/HAST JESD22-A101/JESD22-A110 3 25 HAST 130C/85%RH 96 hours Pass Or equivalent JEDEC condition
TC JESD22-A104 3 25 Temperature cycle -65/150C 500 cycles Pass Or equivalent JEDEC condition
SD J-STD-002 3 22 Per specification >95% lead coverage Pass —
HBM JS-001 1 3 ESD - HBM Classification See data sheet —
CDM JS-002 1 3 ESD - CDM Classification See data sheet —
LU JESD78 1 3 Latch-up Per JESD78 Pass As applicable per JESD78
MSL J-STD-020 — — Per J-STD-020 Classification See data sheet —

Ongoing reliability monitoring

No results found

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.