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Quality, reliability & packaging data download

ESDS312DBVR ACTIVE

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Quality data will change based on assembly site

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Rating

Catalog
RoHS Yes
REACH Yes
Device Marking 1R4B
Lead finish/Ball material Sn
MSL rating/Peak reflow Level-1-260C-UNLIM

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
4.545x108 2.2 55 60 0.7 125 1000 10793 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.011958
97.030185
970302
0.062509
625
Precious Metals
Gold
7440-57-5
0.000038
0.308341
3083
0.000199
2
Precious Metals
Palladium
7440-05-3
0.000328
2.661474
26615
0.001715
17
Sub-total
— —
0.012324
100
1000000
0.064422
644
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.028672
80.000000
800000
0.149880
1499
Thermoplastics
Epoxy
85954-11-6
0.007168
20.000000
200000
0.037470
375
Sub-total
— —
0.035840
100
1000000
0.187349
1873
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
6.678338
96.787493
967875
34.910246
349102
Copper and Its Alloys
Iron
7439-89-6
0.16215
2.350000
23500
0.847621
8476
Copper and Its Alloys
Phosphorus
7723-14-0
0.005693
0.082507
825
0.029760
298
Other Nonferrous Metals and Alloys
Lead
7439-92-1
0.000345
0.005000
50
0.001803
18
Precious Metals
Silver
7440-22-4
0.04485
0.650000
6500
0.234448
2344
Zinc and Its Alloys
Zinc
7440-66-6
0.008625
0.125000
1250
0.045086
451
Sub-total
— —
6.900001
100
1000000
36.068963
360690
Lead Frame Plating
Other Nonferrous Metals and Alloys
Tin
7440-31-5
0.12
100.000000
1000000
0.627286
6273
Sub-total
— —
0.12
100
1000000
0.627286
6273
Mold Compound
Other Inorganic Materials
Fused Silica
60676-86-0
10.381408
86.850000
868500
54.267619
542676
Other Organic Materials
Carbon Black
1333-86-4
0.01793
0.150001
1500
0.093727
937
Other Organic Materials
Proprietary Non Halide Flame Retardant
Trade Secret
0.059766
0.499997
5000
0.312420
3124
Thermoplastics
Epoxy
85954-11-6
1.494158
12.500002
125000
7.810539
78105
Sub-total
— —
11.953262
100
1000000
62.484305
624843
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
0.108596
100.000000
1000000
0.567673
5677
Sub-total
— —
0.108596
100
1000000
0.567673
5677
Total
— —
19.130023
— —
100
1000000

Qualification summary

Stress Reference Min lot qty SS / lot Condition Duration Result Notes
HTOL JESD22-A108 3 77 Life test, 125C 1000 hours Pass Or equivalent JEDEC condition
HTSL JESD22-A103 3 25 High temp storage bake, 150C 1000 hours Pass Or equivalent JEDEC condition
AC/UHAST JESD22-A102/JESD22-A118 3 25 Unbiased HAST 130C / 85% RH 96 hours Pass Or equivalent JEDEC condition
THB/HAST JESD22-A101/JESD22-A110 3 25 HAST 130C/85%RH 96 hours Pass Or equivalent JEDEC condition
TC JESD22-A104 3 25 Temperature cycle -65/150C 500 cycles Pass Or equivalent JEDEC condition
SD J-STD-002 3 22 Per specification >95% lead coverage Pass —
HBM JS-001 1 3 ESD - HBM Classification See data sheet —
CDM JS-002 1 3 ESD - CDM Classification See data sheet —
LU JESD78 1 3 Latch-up Per JESD78 Pass As applicable per JESD78
MSL J-STD-020 — — Per J-STD-020 Classification See data sheet —

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (2Q2025 - 1Q2026) Sample Size Cumulative Sample Size Disposition
VDIODE High temperature reverse bias 125C, 1000 Hours or Equivalent JEDEC Condition 693 2926 Pass
VDIODE Life test 125C, 1000 Hours or Equivalent JEDEC Condition 693 8099 Pass
Assembly process reliability data
Package Family Reliability Test Rolling Year (2Q2025 - 1Q2026) Sample Size Cumulative Sample Size Disposition
SOP/SOT Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 8070 115656 Pass
SOP/SOT High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 6141 90666 Pass
SOP/SOT Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 18991 216515 Pass
SOP/SOT Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 11781 173770 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.