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Quality, reliability & packaging data download

LM26CIM5-RPA/NOPB ACTIVE

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Rating

Catalog
RoHS Yes
REACH Yes
Device Marking TRPA
Lead finish/Ball material Sn
MSL rating/Peak reflow Level-1-260C-UNLIM

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
4.14x108 2.4 55 60 0.7 125 1000 4835 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.012948
100.000000
1000000
0.071407
714
Sub-total
— —
0.012948
100
1000000
0.071407
714
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.133769
74.999860
749999
0.737726
7377
Thermoplastics
Epoxy
85954-11-6
0.04459
25.000140
250001
0.245910
2459
Sub-total
— —
0.178359
100
1000000
0.983636
9836
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
5.436408
96.509995
965100
29.981379
299814
Copper and Its Alloys
Iron
7439-89-6
0.134065
2.379993
23800
0.739358
7394
Copper and Its Alloys
Phosphorus
7723-14-0
0.00169
0.030002
300
0.009320
93
Precious Metals
Silver
7440-22-4
0.054077
0.960004
9600
0.298231
2982
Zinc and Its Alloys
Zinc
7440-66-6
0.00676
0.120007
1200
0.037281
373
Sub-total
— —
5.633000
100
1000000
31.065569
310656
Lead Frame Plating
Other Nonferrous Metals and Alloys
Tin
7440-31-5
0.7
100.000000
1000000
3.860447
38604
Sub-total
— —
0.7
100
1000000
3.860447
38604
Mold Compound
Other Inorganic Materials
Silica
7631-86-9
9.76178
88.700000
887000
53.835478
538355
Other Nonferrous Metals and Alloys
Metal Hydroxide
Trade Secret
0.330162
3.000003
30000
1.820818
18208
Other Organic Materials
Carbon Black
1333-86-4
0.033016
0.299998
3000
0.182081
1821
Thermoplastics
Epoxy
85954-11-6
0.880431
7.999999
80000
4.855510
48555
Sub-total
— —
11.005389
100
1000000
60.693888
606939
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
0.602919
100.000000
1000000
3.325053
33251
Sub-total
— —
0.602919
100
1000000
3.325053
33251
Total
— —
18.132615
— —
100
1000000

Qualification summary

Stress Reference Min lot qty SS / lot Condition Duration Result Notes
HTOL JESD22-A108 3 77 Life test, 125C 1000 hours Pass Or equivalent JEDEC condition
HTSL JESD22-A103 3 25 High temp storage bake, 150C 1000 hours Pass Or equivalent JEDEC condition
AC/UHAST JESD22-A102/JESD22-A118 3 25 Unbiased HAST 130C / 85% RH 96 hours Pass Or equivalent JEDEC condition
THB/HAST JESD22-A101/JESD22-A110 3 25 HAST 130C/85%RH 96 hours Pass Or equivalent JEDEC condition
TC JESD22-A104 3 25 Temperature cycle -65/150C 500 cycles Pass Or equivalent JEDEC condition
SD J-STD-002 3 22 Per specification >95% lead coverage Pass —
HBM JS-001 1 3 ESD - HBM Classification See data sheet —
CDM JS-002 1 3 ESD - CDM Classification See data sheet —
LU JESD78 1 3 Latch-up Per JESD78 Pass As applicable per JESD78
MSL J-STD-020 — — Per J-STD-020 Classification See data sheet —

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
High-Precision CMOS Life test 125C, 1000 Hours or Equivalent JEDEC Condition 2926 64347 Pass
Assembly process reliability data
Package Family Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
SOP/SOT Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 6691 118821 Pass
SOP/SOT High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 4501 92225 Pass
SOP/SOT Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 11931 222678 Pass
SOP/SOT Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 8091 177857 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.