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Quality, reliability & packaging data download

LMKDB1108Z100RKPR ACTIVE

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Rating

Catalog
RoHS Yes
REACH Yes
Device Marking LMKDB, 108Z100
Lead finish/Ball material NIPDAU
MSL rating/Peak reflow Level-1-260C-UNLIM

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
3.3x108 3.0 55 60 0.7 125 1000 3854 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.201844
97.535094
975351
0.246675
2467
Nickel and Its Alloys
Nickel
7440-02-0
0.000001
0.000483
5
0.000001
0
Not Categorized
Proprietary Materials
—
0.000023
0.011114
111
0.000028
0
Precious Metals
Gold
7440-57-5
0.000106
0.051221
512
0.000130
1
Precious Metals
Palladium
7440-05-3
0.004965
2.399188
23992
0.006068
61
Precious Metals
Silver
7440-22-4
0.000006
0.002899
29
0.000007
0
Sub-total
— —
0.206945
100
1000000
0.252909
2529
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.6889
80.000000
800000
0.841911
8419
Thermoplastics
Epoxy
85954-11-6
0.172225
20.000000
200000
0.210478
2105
Sub-total
— —
0.861125
100
1000000
1.052389
10524
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
43.49392
97.520000
975200
53.154334
531543
Copper and Its Alloys
Iron
7439-89-6
1.0258
2.300000
23000
1.253640
12536
Copper and Its Alloys
Phosphorus
7723-14-0
0.01338
0.030000
300
0.016352
164
Zinc and Its Alloys
Zinc
7440-66-6
0.0669
0.150000
1500
0.081759
818
Sub-total
— —
44.60000
100
1000000
54.506085
545061
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
1.293632
95.120000
951200
1.580960
15810
Precious Metals
Gold
7440-57-5
0.010608
0.780000
7800
0.012964
130
Precious Metals
Palladium
7440-05-3
0.05576
4.100000
41000
0.068145
681
Sub-total
— —
1.360000
100
1000000
1.662069
16621
Mold Compound
Other Inorganic Materials
Fused Silica
60676-86-0
28.90821
90.000001
900000
35.328999
353290
Other Organic Materials
Carbon Black
1333-86-4
0.160601
0.499999
5000
0.196272
1963
Thermoplastics
Epoxy
85954-11-6
3.051422
9.500000
95000
3.729172
37292
Sub-total
— —
32.120233
100
1000000
39.254443
392544
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
2.677423
100.000000
1000000
3.272104
32721
Sub-total
— —
2.677423
100
1000000
3.272104
32721
Total
— —
81.825726
— —
100
1000000

Qualification summary

Stress Reference Min lot qty SS / lot Condition Duration Result Notes
HTOL JESD22-A108 3 77 Life test, 125C 1000 hours Pass Or equivalent JEDEC condition
HTSL JESD22-A103 3 25 High temp storage bake, 150C 1000 hours Pass Or equivalent JEDEC condition
AC/UHAST JESD22-A102/JESD22-A118 3 25 Unbiased HAST 130C / 85% RH 96 hours Pass Or equivalent JEDEC condition
THB/HAST JESD22-A101/JESD22-A110 3 25 HAST 130C/85%RH 96 hours Pass Or equivalent JEDEC condition
TC JESD22-A104 3 25 Temperature cycle -65/150C 500 cycles Pass Or equivalent JEDEC condition
SD J-STD-002 3 22 Per specification >95% lead coverage Pass —
HBM JS-001 1 3 ESD - HBM Classification See data sheet —
CDM JS-002 1 3 ESD - CDM Classification See data sheet —
LU JESD78 1 3 Latch-up Per JESD78 Pass As applicable per JESD78
MSL J-STD-020 — — Per J-STD-020 Classification See data sheet —

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (2Q2023 - 1Q2024) Sample Size Cumulative Sample Size Disposition
130nm CMOS Life test 125C, 1000 Hours or Equivalent JEDEC Condition 77 20205 Pass
Assembly process reliability data
Package Family Reliability Test Rolling Year (2Q2023 - 1Q2024) Sample Size Cumulative Sample Size Disposition
QFN Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 12530 145993 Pass
QFN High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 15261 136459 Pass
QFN Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 42510 348451 Pass
QFN Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 24797 261412 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.