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Quality, reliability & packaging data download

LMV331M5/NOPB ACTIVE

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Rating

Catalog
RoHS Yes
REACH Yes
Device Marking C12
Lead finish/Ball material Sn
MSL rating/Peak reflow Level-1-260C-UNLIM

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
3.22x108 3.1 55 60 0.7 125 1000 3766 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.01778
100.000000
1000000
0.098734
987
Sub-total
— —
0.01778
100
1000000
0.098734
987
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.024472
75.000766
750008
0.135896
1359
Thermoplastics
Epoxy
85954-11-6
0.008157
24.999234
249992
0.045297
453
Sub-total
— —
0.032629
100
1000000
0.181192
1812
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
5.436408
96.509995
965100
30.188960
301890
Copper and Its Alloys
Iron
7439-89-6
0.134065
2.379993
23800
0.744477
7445
Copper and Its Alloys
Phosphorus
7723-14-0
0.00169
0.030002
300
0.009385
94
Precious Metals
Silver
7440-22-4
0.054077
0.960004
9600
0.300295
3003
Zinc and Its Alloys
Zinc
7440-66-6
0.00676
0.120007
1200
0.037539
375
Sub-total
— —
5.633000
100
1000000
31.280657
312807
Lead Frame Plating
Other Nonferrous Metals and Alloys
Tin
7440-31-5
0.7
100.000000
1000000
3.887176
38872
Sub-total
— —
0.7
100
1000000
3.887176
38872
Mold Compound
Other Inorganic Materials
Silica
7631-86-9
10.213119
88.699997
887000
56.714551
567146
Other Nonferrous Metals and Alloys
Metal Hydroxide
Trade Secret
0.345427
3.000002
30000
1.918193
19182
Other Organic Materials
Carbon Black
1333-86-4
0.034543
0.300003
3000
0.191821
1918
Thermoplastics
Epoxy
85954-11-6
0.921138
7.999999
80000
5.115179
51152
Sub-total
— —
11.514227
100
1000000
63.939745
639397
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
0.110298
100.000000
1000000
0.612497
6125
Sub-total
— —
0.110298
100
1000000
0.612497
6125
Total
— —
18.007934
— —
100
1000000

Qualification summary

Stress Reference Min lot qty SS / lot Condition Duration Result Notes
HTOL JESD22-A108 3 77 Life test, 125C 1000 hours Pass Or equivalent JEDEC condition
HTSL JESD22-A103 3 25 High temp storage bake, 150C 1000 hours Pass Or equivalent JEDEC condition
AC/UHAST JESD22-A102/JESD22-A118 3 25 Unbiased HAST 130C / 85% RH 96 hours Pass Or equivalent JEDEC condition
THB/HAST JESD22-A101/JESD22-A110 3 25 HAST 130C/85%RH 96 hours Pass Or equivalent JEDEC condition
TC JESD22-A104 3 25 Temperature cycle -65/150C 500 cycles Pass Or equivalent JEDEC condition
SD J-STD-002 3 22 Per specification >95% lead coverage Pass —
HBM JS-001 1 3 ESD - HBM Classification See data sheet —
CDM JS-002 1 3 ESD - CDM Classification See data sheet —
LU JESD78 1 3 Latch-up Per JESD78 Pass As applicable per JESD78
MSL J-STD-020 — — Per J-STD-020 Classification See data sheet —

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
High-Precision CMOS Life test 125C, 1000 Hours or Equivalent JEDEC Condition 2926 64116 Pass
Assembly process reliability data
Package Family Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
SOP/SOT Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 6691 118282 Pass
SOP/SOT High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 4501 92013 Pass
SOP/SOT Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 11931 221908 Pass
SOP/SOT Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 8091 177318 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.