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Quality, reliability & packaging data download

LP2992IM5-3.3/NOPB ACTIVE

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Rating

Catalog
RoHS Yes
RoHS Yes
RoHS Yes
REACH Yes
REACH Yes
REACH Yes
Device Marking LFEB
Lead finish/Ball material NiPdAu
Lead finish/Ball material Sn
Lead finish/Ball material Sn
MSL rating/Peak reflow Level-1-260C-UNLIM
MSL rating/Peak reflow Level-1-260C-UNLIM
MSL rating/Peak reflow Level-1-260C-UNLIM

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
1x1010 0.1 55 60 0.7 125 1000 183306 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.032282
96.667166
966672
0.179627
1796
Precious Metals
Gold
7440-57-5
0.000182
0.544992
5450
0.001013
10
Precious Metals
Palladium
7440-05-3
0.000931
2.787842
27878
0.005180
52
Sub-total
— —
0.033395
100
1000000
0.185820
1858
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.135824
74.999862
749999
0.755767
7558
Thermoplastics
Epoxy
85954-11-6
0.045275
25.000138
250001
0.251924
2519
Sub-total
— —
0.181099
100
1000000
1.007692
10077
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
5.334588
97.346496
973465
29.683323
296833
Copper and Its Alloys
Iron
7439-89-6
0.133767
2.441004
24410
0.744322
7443
Copper and Its Alloys
Phosphorus
7723-14-0
0.004521
0.082500
825
0.025156
252
Zinc and Its Alloys
Zinc
7440-66-6
0.007124
0.130000
1300
0.039640
396
Sub-total
— —
5.480000
100
1000000
30.492441
304924
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
0.042804
95.120000
951200
0.238175
2382
Precious Metals
Gold
7440-57-5
0.000351
0.780000
7800
0.001953
20
Precious Metals
Palladium
7440-05-3
0.001845
4.100000
41000
0.010266
103
Sub-total
— —
0.045000
100
1000000
0.250394
2504
Mold Compound
Other Inorganic Materials
Fused Silica
60676-86-0
10.482227
87.999997
880000
58.326403
583264
Other Organic Materials
Carbon Black
1333-86-4
0.035735
0.300001
3000
0.198841
1988
Other Organic Materials
Chlorine
7782-50-5
0.000119
0.000999
10
0.000662
7
Thermoplastics
Epoxy
85954-11-6
1.393541
11.699003
116990
7.754100
77541
Sub-total
— —
11.911622
100
1000000
66.280006
662800
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
0.320551
100.000000
1000000
1.783646
17836
Sub-total
— —
0.320551
100
1000000
1.783646
17836
Total
— —
17.971667
— —
100
1000000
Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.032628
97.533853
975339
0.181501
1815
Not Categorized
Proprietary Materials
—
0.000004
0.011957
120
0.000022
0
Precious Metals
Gold
7440-57-5
0.000017
0.050818
508
0.000095
1
Precious Metals
Palladium
7440-05-3
0.000803
2.400383
24004
0.004467
45
Precious Metals
Silver
7440-22-4
0.000001
0.002989
30
0.000006
0
Sub-total
— —
0.033453
100
1000000
0.186091
1861
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.144879
79.999890
799999
0.805925
8059
Thermoplastics
Epoxy
85954-11-6
0.03622
20.000110
200001
0.201483
2015
Sub-total
— —
0.181099
100
1000000
1.007408
10074
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
5.31834
97.050000
970500
29.584588
295846
Copper and Its Alloys
Iron
7439-89-6
0.14248
2.600000
26000
0.792580
7926
Copper and Its Alloys
Phosphorus
7723-14-0
0.00822
0.150000
1500
0.045726
457
Zinc and Its Alloys
Zinc
7440-66-6
0.01096
0.200000
2000
0.060968
610
Sub-total
— —
5.48000
100
1000000
30.483862
304839
Lead Frame Plating
Other Nonferrous Metals and Alloys
Tin
7440-31-5
0.05
100.000000
1000000
0.278137
2781
Sub-total
— —
0.05
100
1000000
0.278137
2781
Mold Compound
Other Inorganic Materials
Fused Silica
60676-86-0
10.482227
87.999997
880000
58.309993
583100
Other Organic Materials
Carbon Black
1333-86-4
0.035735
0.300001
3000
0.198785
1988
Other Organic Materials
Chlorine
7782-50-5
0.000119
0.000999
10
0.000662
7
Thermoplastics
Epoxy
85954-11-6
1.393541
11.699003
116990
7.751918
77519
Sub-total
— —
11.911622
100
1000000
66.261357
662614
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
0.320551
100.000000
1000000
1.783145
17831
Sub-total
— —
0.320551
100
1000000
1.783145
17831
Total
— —
17.976725
— —
100
1000000
Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.033297
97.533613
975336
0.185216
1852
Not Categorized
Proprietary Materials
—
0.000004
0.011717
117
0.000022
0
Precious Metals
Gold
7440-57-5
0.000018
0.052726
527
0.000100
1
Precious Metals
Palladium
7440-05-3
0.000819
2.399016
23990
0.004556
46
Precious Metals
Silver
7440-22-4
0.000001
0.002929
29
0.000006
0
Sub-total
— —
0.034139
100
1000000
0.189899
1899
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.135824
74.999862
749999
0.755526
7555
Thermoplastics
Epoxy
85954-11-6
0.045275
25.000138
250001
0.251844
2518
Sub-total
— —
0.181099
100
1000000
1.007370
10074
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
5.31834
97.050000
970500
29.583459
295835
Copper and Its Alloys
Iron
7439-89-6
0.14248
2.600000
26000
0.792550
7926
Copper and Its Alloys
Phosphorus
7723-14-0
0.00822
0.150000
1500
0.045724
457
Zinc and Its Alloys
Zinc
7440-66-6
0.01096
0.200000
2000
0.060965
610
Sub-total
— —
5.48000
100
1000000
30.482699
304827
Lead Frame Plating
Other Nonferrous Metals and Alloys
Tin
7440-31-5
0.05
100.000000
1000000
0.278127
2781
Sub-total
— —
0.05
100
1000000
0.278127
2781
Mold Compound
Other Inorganic Materials
Fused Silica
60676-86-0
10.482227
87.999997
880000
58.307767
583078
Other Organic Materials
Carbon Black
1333-86-4
0.035735
0.300001
3000
0.198777
1988
Other Organic Materials
Chlorine
7782-50-5
0.000119
0.000999
10
0.000662
7
Thermoplastics
Epoxy
85954-11-6
1.393541
11.699003
116990
7.751622
77516
Sub-total
— —
11.911622
100
1000000
66.258829
662588
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
0.320551
100.000000
1000000
1.783077
17831
Sub-total
— —
0.320551
100
1000000
1.783077
17831
Total
— —
17.977411
— —
100
1000000

Qualification summary

Stress Reference Min lot qty SS / lot Condition Duration Result Notes
HTOL JESD22-A108 3 77 Life test, 125C 1000 hours Pass Or equivalent JEDEC condition
HTSL JESD22-A103 3 25 High temp storage bake, 150C 1000 hours Pass Or equivalent JEDEC condition
AC/UHAST JESD22-A102/JESD22-A118 3 25 Unbiased HAST 130C / 85% RH 96 hours Pass Or equivalent JEDEC condition
THB/HAST JESD22-A101/JESD22-A110 3 25 HAST 130C/85%RH 96 hours Pass Or equivalent JEDEC condition
TC JESD22-A104 3 25 Temperature cycle -65/150C 500 cycles Pass Or equivalent JEDEC condition
SD J-STD-002 3 22 Per specification >95% lead coverage Pass —
HBM JS-001 1 3 ESD - HBM Classification See data sheet —
CDM JS-002 1 3 ESD - CDM Classification See data sheet —
LU JESD78 1 3 Latch-up Per JESD78 Pass As applicable per JESD78
MSL J-STD-020 — — Per J-STD-020 Classification See data sheet —

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
Power BICMOS High temperature gate bias 150C, 1000 Hours or Equivalent JEDEC Condition 924 924 Pass
Power BICMOS High temperature reverse bias 125C, 1000 Hours or Equivalent JEDEC Condition 1386 1386 Pass
Power BICMOS Life test 125C, 1000 Hours or Equivalent JEDEC Condition 28135 456997 Pass
Assembly process reliability data
Package Family Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
SOP/SOT Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 6691 118282 Pass
SOP/SOT High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 4501 92013 Pass
SOP/SOT Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 11931 221908 Pass
SOP/SOT Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 8091 177318 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.