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Quality, reliability & packaging data download

LP8550TLX/NOPB ACTIVE

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Quality data will change based on assembly site

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Rating

Catalog
RoHS Yes
REACH Yes
Device Marking 8550
Lead finish/Ball material SnAgCu
MSL rating/Peak reflow Level-1-260C-UNLIM

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
4.14x108 2.4 55 60 0.7 125 1000 4835 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Back Side Coating
Other Inorganic Materials
Fused Silica
60676-86-0
0.35145
78.100000
781000
4.694112
46941
Other Organic Materials
Carbon Black
1333-86-4
0.0036
0.800000
8000
0.048083
481
Other Plastics and Rubber
Other Filler
—
0.0081
1.800000
18000
0.108187
1082
Thermoplastics
Epoxy
85954-11-6
0.08685
19.300000
193000
1.160005
11600
Sub-total
— —
0.45000
100
1000000
6.010387
60104
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
4.436745
100.000000
1000000
59.259007
592590
Sub-total
— —
4.436745
100
1000000
59.259007
592590
Solder Bump
Copper and Its Alloys
Copper
7440-50-8
0.013001
0.499982
5000
0.173647
1736
Nickel and Its Alloys
Nickel
7440-02-0
0.0013
0.049994
500
0.017363
174
Other Nonferrous Metals and Alloys
Tin
7440-31-5
2.554789
98.250006
982500
34.122822
341228
Precious Metals
Silver
7440-22-4
0.031204
1.200018
12000
0.416774
4168
Sub-total
— —
2.600294
100
1000000
34.730606
347306
Total
— —
7.487039
— —
100
1000000

Qualification summary

Stress Reference Min lot qty SS / lot Condition Duration Result Notes
HTOL JESD22-A108 3 77 Life test, 125C 1000 hours Pass Or equivalent JEDEC condition
HTSL JESD22-A103 3 25 High temp storage bake, 150C 1000 hours Pass Or equivalent JEDEC condition
AC/UHAST JESD22-A102/JESD22-A118 3 25 Unbiased HAST 130C / 85% RH 96 hours Pass Or equivalent JEDEC condition
THB/HAST JESD22-A101/JESD22-A110 3 25 HAST 130C/85%RH 96 hours Pass Or equivalent JEDEC condition
TC JESD22-A104 3 25 Temperature cycle -65/150C 500 cycles Pass Or equivalent JEDEC condition
SD J-STD-002 3 22 Per specification >95% lead coverage Pass —
HBM JS-001 1 3 ESD - HBM Classification See data sheet —
CDM JS-002 1 3 ESD - CDM Classification See data sheet —
LU JESD78 1 3 Latch-up Per JESD78 Pass As applicable per JESD78
MSL J-STD-020 — — Per J-STD-020 Classification See data sheet —

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
High-Precision CMOS Life test 125C, 1000 Hours or Equivalent JEDEC Condition 2926 64039 Pass
Assembly process reliability data
Package Family Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
DSBGA (WCSP) Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 2289 69476 Pass
DSBGA (WCSP) High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 2002 62180 Pass
DSBGA (WCSP) Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 4235 110029 Pass
DSBGA (WCSP) Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 2462 83172 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.