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Quality, reliability & packaging data download

OMAP3530ECUS ACTIVE

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Rating

Catalog
RoHS Yes
REACH Yes
Device Marking 3530ECUS
Lead finish/Ball material SnAgCu
MSL rating/Peak reflow Level-4-260C-72 HR

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
6.74x108 1.5 55 60 0.7 125 1000 7859 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Mold Compound
Other Inorganic Materials
Fused Silica
60676-86-0
250.004217
90.500000
905000
42.434225
424342
Other Organic Materials
Carbon Black
1333-86-4
1.381239
0.500000
5000
0.234443
2344
Thermoplastics
Epoxy
85954-11-6
24.862298
9.000000
90000
4.219978
42200
Sub-total
— —
276.247754
100
1000000
46.888647
468886
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
6.968532
100.000000
1000000
1.182797
11828
Sub-total
— —
6.968532
100
1000000
1.182797
11828
Solder Ball
Copper and Its Alloys
Copper
7440-50-8
0.521446
0.500000
5000
0.088507
885
Nickel and Its Alloys
Nickel
7440-02-0
0.052145
0.050000
500
0.008851
89
Other Nonferrous Metals and Alloys
Tin
7440-31-5
102.464051
98.249999
982500
17.391637
173916
Precious Metals
Silver
7440-22-4
1.251469
1.200000
12000
0.212417
2124
Sub-total
— —
104.289111
100
1000000
17.701412
177014
Solder Bump
Copper and Its Alloys
Copper
7440-50-8
0.000679
0.499647
4996
0.000115
1
Other Nonferrous Metals and Alloys
Tin
7440-31-5
0.129781
95.500235
955002
0.022028
220
Precious Metals
Silver
7440-22-4
0.005436
4.000118
40001
0.000923
9
Sub-total
— —
0.135896
100
1000000
0.023066
231
Substrate
Ceramics / Glass
Woven Glass Fiber
65997-17-3
42.467637
21.652800
216528
7.208203
72082
Copper and Its Alloys
Copper
7440-50-8
56.387375
28.750000
287500
9.570857
95709
Not Categorized
Proprietary Filler
—
18.065142
9.210800
92108
3.066269
30663
Other Inorganic Materials
Aluminum Oxide
1344-28-1
0.209859
0.107000
1070
0.035620
356
Other Inorganic Materials
Silicon Dioxide
7631-86-9
19.71891
10.054000
100540
3.346970
33470
Other Nonferrous Metals and Alloys
Barium Sulfate
7727-43-7
5.246478
2.675000
26750
0.890506
8905
Thermoplastics
Epoxy
85954-11-6
54.0346
27.550400
275504
9.171511
91715
Sub-total
— —
196.130001
100
1000000
33.289937
332899
Underfill
Other Inorganic Materials
Silica
7631-86-9
2.504363
46.499999
465000
0.425076
4251
Other Organic Materials
Proprietary Non Halide Flame Retardant
Trade Secret
0.161572
3.000004
30000
0.027424
274
Thermoplastics
Epoxy
85954-11-6
2.719792
50.499997
505000
0.461641
4616
Sub-total
— —
5.385727
100
1000000
0.914141
9141
Total
— —
589.157021
— —
100
1000000

Qualification summary

Stress Reference Min lot qty SS / lot Condition Duration Result Notes
HTOL JESD22-A108 3 77 Life test, 125C 1000 hours Pass Or equivalent JEDEC condition
HTSL JESD22-A103 3 25 High temp storage bake, 150C 1000 hours Pass Or equivalent JEDEC condition
AC/UHAST JESD22-A102/JESD22-A118 3 25 Unbiased HAST 130C / 85% RH 96 hours Pass Or equivalent JEDEC condition
THB/HAST JESD22-A101/JESD22-A110 3 25 HAST 130C/85%RH 96 hours Pass Or equivalent JEDEC condition
TC JESD22-A104 3 25 Temperature cycle -65/150C 500 cycles Pass Or equivalent JEDEC condition
SD J-STD-002 3 22 Per specification >95% lead coverage Pass —
HBM JS-001 1 3 ESD - HBM Classification See data sheet —
CDM JS-002 1 3 ESD - CDM Classification See data sheet —
LU JESD78 1 3 Latch-up Per JESD78 Pass As applicable per JESD78
MSL J-STD-020 — — Per J-STD-020 Classification See data sheet —

Ongoing reliability monitoring

No results found

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.