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Rating

Catalog
RoHS Yes
REACH Yes
Device Marking REF, C, 102U
Lead finish/Ball material NiPdAu
MSL rating/Peak reflow Level-2-260C-1 YEAR

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
4.71x109 0.2 55 60 0.7 125 1000 55055 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Other Nonferrous Metals and Alloys
Yttrium
7440-65-5
0.000001
0.000955
10
0.000001
0
Precious Metals
Gold
7440-57-5
0.104747
99.998091
999981
0.093825
938
Precious Metals
Silver
7440-22-4
0.000001
0.000955
10
0.000001
0
Sub-total
— —
0.104749
100
1000000
0.093826
938
Die Attach Adhesive
Other Inorganic Materials
Silica
7631-86-9
0.010113
2.000024
20000
0.009058
91
Precious Metals
Silver
7440-22-4
0.348894
68.999929
689999
0.312513
3125
Thermoplastics
Epoxy
85954-11-6
0.146637
29.000047
290000
0.131347
1313
Sub-total
— —
0.505644
100
1000000
0.452919
4529
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
49.93
99.860000
998600
44.723602
447236
Copper and Its Alloys
Iron
7439-89-6
0.05
0.100000
1000
0.044786
448
Copper and Its Alloys
Phosphorus
7723-14-0
0.02
0.040000
400
0.017915
179
Sub-total
— —
50.00
100
1000000
44.786303
447863
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
0.38048
95.120000
951200
0.340806
3408
Precious Metals
Gold
7440-57-5
0.00312
0.780000
7800
0.002795
28
Precious Metals
Palladium
7440-05-3
0.0164
4.100000
41000
0.014690
147
Sub-total
— —
0.40000
100
1000000
0.358290
3583
Mold Compound
Other Inorganic Materials
Fused Silica
60676-86-0
50.111678
86.000000
860000
44.886336
448863
Other Organic Materials
Carbon Black
1333-86-4
0.174808
0.300000
3000
0.156580
1566
Other Organic Materials
Organic Phosphorus
1330-78-5
0.320482
0.550001
5500
0.287064
2871
Thermoplastics
Epoxy
85954-11-6
7.662425
13.150000
131500
6.863434
68634
Sub-total
— —
58.269393
100
1000000
52.193414
521934
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
2.361489
100.000000
1000000
2.115247
21152
Sub-total
— —
2.361489
100
1000000
2.115247
21152
Total
— —
111.641275
— —
100
1000000

Qualification summary

Stress Reference Min lot qty SS / lot Condition Duration Result Notes
HTOL JESD22-A108 3 77 Life test, 125C 1000 hours Pass Or equivalent JEDEC condition
HTSL JESD22-A103 3 25 High temp storage bake, 150C 1000 hours Pass Or equivalent JEDEC condition
AC/UHAST JESD22-A102/JESD22-A118 3 25 Unbiased HAST 130C / 85% RH 96 hours Pass Or equivalent JEDEC condition
THB/HAST JESD22-A101/JESD22-A110 3 25 HAST 130C/85%RH 96 hours Pass Or equivalent JEDEC condition
TC JESD22-A104 3 25 Temperature cycle -65/150C 500 cycles Pass Or equivalent JEDEC condition
SD J-STD-002 3 22 Per specification >95% lead coverage Pass —
HBM JS-001 1 3 ESD - HBM Classification See data sheet —
CDM JS-002 1 3 ESD - CDM Classification See data sheet —
LU JESD78 1 3 Latch-up Per JESD78 Pass As applicable per JESD78
MSL J-STD-020 — — Per J-STD-020 Classification See data sheet —

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
BIPOLAR Life test 125C, 1000 Hours or Equivalent JEDEC Condition 693 24846 Pass
Assembly process reliability data
Package Family Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
SOIC Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 5061 85659 Pass
SOIC High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 5627 75195 Pass
SOIC Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 13223 189952 Pass
SOIC Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 7777 139298 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.