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Quality, reliability & packaging data download

REF5040MDREP ACTIVE

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Quality data will change based on assembly site

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Rating

HiRel Enhanced Product
RoHS Yes
REACH Yes
Device Marking 5040EP
Lead finish/Ball material NiPdAu
MSL rating/Peak reflow Level-2-260C-1 YEAR

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
6.16x109 0.2 55 60 0.7 125 1000 71906 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Other Nonferrous Metals and Alloys
Yttrium
7440-65-5
0.000001
0.001087
11
0.000001
0
Precious Metals
Gold
7440-57-5
0.092001
99.997826
999978
0.082349
823
Precious Metals
Silver
7440-22-4
0.000001
0.001087
11
0.000001
0
Sub-total
— —
0.092003
100
1000000
0.082351
824
Die Attach Adhesive
Other Inorganic Materials
Silica
7631-86-9
0.014194
2.000000
20000
0.012705
127
Precious Metals
Silver
7440-22-4
0.489693
69.000000
690000
0.438320
4383
Thermoplastics
Epoxy
85954-11-6
0.205813
29.000000
290000
0.184221
1842
Sub-total
— —
0.709700
100
1000000
0.635246
6352
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
49.93
99.860000
998600
44.691905
446919
Copper and Its Alloys
Iron
7439-89-6
0.05
0.100000
1000
0.044755
448
Copper and Its Alloys
Phosphorus
7723-14-0
0.02
0.040000
400
0.017902
179
Sub-total
— —
50.00
100
1000000
44.754561
447546
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
0.38048
95.120000
951200
0.340564
3406
Precious Metals
Gold
7440-57-5
0.00312
0.780000
7800
0.002793
28
Precious Metals
Palladium
7440-05-3
0.0164
4.100000
41000
0.014679
147
Sub-total
— —
0.40000
100
1000000
0.358036
3580
Mold Compound
Other Inorganic Materials
Fused Silica
60676-86-0
50.048564
85.999999
860000
44.798031
447980
Other Organic Materials
Carbon Black
1333-86-4
0.174588
0.300000
3000
0.156272
1563
Other Organic Materials
Organic Phosphorus
1330-78-5
0.320078
0.550000
5500
0.286499
2865
Thermoplastics
Epoxy
85954-11-6
7.652775
13.150001
131500
6.849932
68499
Sub-total
— —
58.196005
100
1000000
52.090734
520907
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
2.322748
100.000000
1000000
2.079071
20791
Sub-total
— —
2.322748
100
1000000
2.079071
20791
Total
— —
111.720456
— —
100
1000000

Qualification summary

Stress Reference Min lot qty SS / lot Condition Duration Result
HTOL JESD22-A108 3 77 Life test, 125C 1000 hours Pass
HTSL JESD22-A103 3 25 High temp storage bake 150C 1000 hours Pass
AC/UHAST JESD22-A102/JESD22-A118 3 25 Autoclave 121C or unbiased HAST 130C / 85% RH 96 hours Pass
THB/HAST JESD22-A101/JESD22-A110 3 25 THB 85C/85%RH or HAST 130C/110C/85%RH 1000 hours or 96 hours Pass
TC JESD22-A104 3 25 Temperature cycle -65/150C 500 cycles Pass
SD J-STD-002 3 22 Per specification >95% lead coverage Pass
HBM JS-001 1 3 ESD - HBM Classification See data sheet
CDM JESD22-C101 1 3 ESD - CDM Classification See data sheet
LU JESD78 1 3 Latch-up Per JESD78 Pass
MSL J-STD-020 — — Per J-STD-020 Classification See data sheet

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
High-Precision CMOS Life test 125C, 1000 Hours or Equivalent JEDEC Condition 2926 64039 Pass
Assembly process reliability data
Package Family Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
SOIC Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 5061 85402 Pass
SOIC High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 5627 73980 Pass
SOIC Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 13223 189567 Pass
SOIC Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 7777 138759 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.