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SN74HCS393DYYR ACTIVE

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Rating

Catalog
RoHS Yes
REACH Yes
Device Marking HCS393
Lead finish/Ball material NiPdAu
MSL rating/Peak reflow Level-1-260C-UNLIM

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
8.71x109 0.1 55 60 0.7 125 1000 101758 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.035317
97.533830
975338
0.091170
912
Not Categorized
Proprietary Materials
—
0.000004
0.011047
110
0.000010
0
Precious Metals
Gold
7440-57-5
0.000019
0.052472
525
0.000049
0
Precious Metals
Palladium
7440-05-3
0.000869
2.399890
23999
0.002243
22
Precious Metals
Silver
7440-22-4
0.000001
0.002762
28
0.000003
0
Sub-total
— —
0.036210
100
1000000
0.093475
935
Die Attach Adhesive
Other Inorganic Materials
Silica
7631-86-9
0.01556
44.999711
449997
0.040168
402
Other Plastics and Rubber
Imidazole Derivative
288-32-4
0.000346
1.000636
10006
0.000893
9
Thermoplastics
Epoxy
85954-11-6
0.018672
53.999653
539997
0.048201
482
Sub-total
— —
0.034578
100
1000000
0.089262
893
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
20.988
95.400000
954000
54.180146
541801
Copper and Its Alloys
Iron
7439-89-6
0.572
2.600000
26000
1.476608
14766
Copper and Its Alloys
Phosphorus
7723-14-0
0.033
0.150000
1500
0.085189
852
Other Nonferrous Metals and Alloys
Lead
7439-92-1
0.0022
0.010000
100
0.005679
57
Precious Metals
Silver
7440-22-4
0.4048
1.840000
18400
1.044984
10450
Sub-total
— —
22.0000
100
1000000
56.792606
567926
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
0.294872
95.120000
951200
0.761207
7612
Precious Metals
Gold
7440-57-5
0.002418
0.780000
7800
0.006242
62
Precious Metals
Palladium
7440-05-3
0.01271
4.100000
41000
0.032811
328
Sub-total
— —
0.310000
100
1000000
0.800259
8003
Mold Compound
Other Inorganic Materials
Fused Silica
60676-86-0
14.252114
88.000000
880000
36.791577
367916
Other Organic Materials
Carbon Black
1333-86-4
0.048587
0.300002
3000
0.125426
1254
Other Organic Materials
Chlorine
7782-50-5
0.000162
0.001000
10
0.000418
4
Thermoplastics
Epoxy
85954-11-6
1.894721
11.698998
116990
4.891188
48912
Sub-total
— —
16.195584
100
1000000
41.808610
418086
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
0.161065
100.000000
1000000
0.415786
4158
Sub-total
— —
0.161065
100
1000000
0.415786
4158
Total
— —
38.737437
— —
100
1000000

Qualification summary

Stress Reference Min lot qty SS / lot Condition Duration Result Notes
HTOL JESD22-A108 3 77 Life test, 125C 1000 hours Pass Or equivalent JEDEC condition
HTSL JESD22-A103 3 25 High temp storage bake, 150C 1000 hours Pass Or equivalent JEDEC condition
AC/UHAST JESD22-A102/JESD22-A118 3 25 Unbiased HAST 130C / 85% RH 96 hours Pass Or equivalent JEDEC condition
THB/HAST JESD22-A101/JESD22-A110 3 25 HAST 130C/85%RH 96 hours Pass Or equivalent JEDEC condition
TC JESD22-A104 3 25 Temperature cycle -65/150C 500 cycles Pass Or equivalent JEDEC condition
SD J-STD-002 3 22 Per specification >95% lead coverage Pass —
HBM JS-001 1 3 ESD - HBM Classification See data sheet —
CDM JS-002 1 3 ESD - CDM Classification See data sheet —
LU JESD78 1 3 Latch-up Per JESD78 Pass As applicable per JESD78
MSL J-STD-020 — — Per J-STD-020 Classification See data sheet —

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
Power BICMOS High temperature gate bias 150C, 1000 Hours or Equivalent JEDEC Condition 924 924 Pass
Power BICMOS High temperature reverse bias 125C, 1000 Hours or Equivalent JEDEC Condition 1386 1386 Pass
Power BICMOS Life test 125C, 1000 Hours or Equivalent JEDEC Condition 28135 458306 Pass
Assembly process reliability data
Package Family Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
SOP/SOT Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 6691 118821 Pass
SOP/SOT High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 4501 92225 Pass
SOP/SOT Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 11931 222678 Pass
SOP/SOT Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 8091 177857 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.