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Quality, reliability & packaging data download

SN74LVTH574IPWREP ACTIVE

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Quality data will change based on assembly site

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Rating

HiRel Enhanced Product
RoHS Yes
REACH Yes
Device Marking LH574EP
Lead finish/Ball material NiPdAu
MSL rating/Peak reflow Level-1-260C-UNLIM

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
2.21x109 0.5 55 60 0.7 125 1000 25789 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Other Nonferrous Metals and Alloys
Calcium
7440-70-2
0.000001
0.000504
5
0.000001
0
Other Nonferrous Metals and Alloys
Yttrium
7440-65-5
0.000001
0.000504
5
0.000001
0
Precious Metals
Gold
7440-57-5
0.198457
99.997984
999980
0.266310
2663
Precious Metals
Silver
7440-22-4
0.000002
0.001008
10
0.000003
0
Sub-total
— —
0.198461
100
1000000
0.266315
2663
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.281322
75.000000
750000
0.377507
3775
Thermoplastics
Epoxy
85954-11-6
0.093774
25.000000
250000
0.125836
1258
Sub-total
— —
0.375096
100
1000000
0.503343
5033
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
27.85926
97.410000
974100
37.384431
373844
Copper and Its Alloys
Iron
7439-89-6
0.6864
2.400000
24000
0.921082
9211
Copper and Its Alloys
Phosphorus
7723-14-0
0.00858
0.030000
300
0.011514
115
Other Nonferrous Metals and Alloys
Lead
7439-92-1
0.00858
0.030000
300
0.011514
115
Other Nonferrous Metals and Alloys
Tin
7440-31-5
0.00858
0.030000
300
0.011514
115
Zinc and Its Alloys
Zinc
7440-66-6
0.0286
0.100000
1000
0.038378
384
Sub-total
— —
28.60000
100
1000000
38.378432
383784
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
0.437552
95.120000
951200
0.587152
5872
Precious Metals
Gold
7440-57-5
0.003588
0.780000
7800
0.004815
48
Precious Metals
Palladium
7440-05-3
0.01886
4.100000
41000
0.025308
253
Sub-total
— —
0.460000
100
1000000
0.617275
6173
Mold Compound
Other Inorganic Materials
Fused Silica
60676-86-0
37.423245
86.000000
860000
50.218373
502184
Other Organic Materials
Carbon Black
1333-86-4
0.130546
0.300000
3000
0.175180
1752
Thermoplastics
Epoxy
85954-11-6
5.96161
13.700000
137000
7.999904
79999
Sub-total
— —
43.515401
100
1000000
58.393457
583935
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
1.372064
100.000000
1000000
1.841177
18412
Sub-total
— —
1.372064
100
1000000
1.841177
18412
Total
— —
74.521022
— —
100
1000000

Qualification summary

Stress Reference Min Lot Qty Sample Size / Lot Condition Duration Result
TC JESD22-A104 3 25 Temperature Cycle -65/150C 500 Cycles PASS
AC/UHAST JESD22-A102/JESD22-A118 3 25 Autoclave 121C or Unbiased HAST 130C / 85% RH 96 Hours PASS
HTSL JESD22-A103 3 25 High Temp Storage Bake 150C 1000 Hours PASS
THB/HAST JESD22-A101/JESD22-A110 3 25 THB 85C/85%RH or HAST 130C/110C/85%RH 1000 Hours or 96 Hours PASS
CDM JESD22-C101 1 3 ESD - CDM Classification See datasheet
HBM JS-001 1 3 ESD - HBM Classification See datasheet
HTOL JESD22-A108 3 77 Life Test, 125C 1000 Hours PASS
LU JESD78 1 3 Latch-up Per JESD78 PASS
MSL JEDEC J-STD-020E — — Per JEDEC J-STD-020E Classification See datasheet

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
CMOS Life test 125C, 1000 Hours or Equivalent JEDEC Condition 1232 54768 Pass
Assembly process reliability data
Package Family Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
TSSOP Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 2387 48648 Pass
TSSOP High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 2187 38360 Pass
TSSOP Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 5852 105153 Pass
TSSOP Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 4389 85262 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.