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TAS3208IPZP ACTIVE

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Rating

Catalog
RoHS Yes
REACH Yes
Device Marking TAS3208IPZP
Lead finish/Ball material NiPdAu
MSL rating/Peak reflow Level-3-260C-168 HR

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
9.54x109 1 55 60 0.7 125 1000 11141 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Aluminum and Its Alloys
Aluminum
7429-90-5
0.000001
0.000112
1
0.000000
0
Copper and Its Alloys
Copper
7440-50-8
0.888939
99.997188
999972
0.190358
1904
Copper and Its Alloys
Iron
7439-89-6
0.000004
0.000450
4
0.000001
0
Other Inorganic Materials
Sulfur
7704-34-9
0.000001
0.000112
1
0.000000
0
Other Nonferrous Metals and Alloys
Calcium
7440-70-2
0.000003
0.000337
3
0.000001
0
Precious Metals
Silver
7440-22-4
0.000016
0.001800
18
0.000003
0
Sub-total
— —
0.888964
100
1000000
0.190363
1904
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
2.614703
70.000000
700000
0.559913
5599
Thermoplastics
Epoxy
85954-11-6
1.120587
30.000000
300000
0.239963
2400
Sub-total
— —
3.735290
100
1000000
0.799876
7999
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
143.224493
97.425000
974250
30.670127
306701
Copper and Its Alloys
Iron
7439-89-6
3.52824
2.400000
24000
0.755538
7555
Copper and Its Alloys
Phosphorus
7723-14-0
0.022052
0.015000
150
0.004722
47
Other Nonferrous Metals and Alloys
Lead
7439-92-1
0.044103
0.030000
300
0.009444
94
Other Nonferrous Metals and Alloys
Tin
7440-31-5
0.044103
0.030000
300
0.009444
94
Zinc and Its Alloys
Zinc
7440-66-6
0.14701
0.100000
1000
0.031481
315
Sub-total
— —
147.010001
100
1000000
31.480756
314808
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
2.14272
90.000000
900000
0.458843
4588
Precious Metals
Gold
7440-57-5
0.05952
2.500000
25000
0.012746
127
Precious Metals
Palladium
7440-05-3
0.17856
7.500000
75000
0.038237
382
Sub-total
— —
2.38080
100
1000000
0.509825
5098
Mold Compound
Not Categorized
Phenolic Resin
9003-35-4
8.727898
3.000000
30000
1.868994
18690
Other Inorganic Materials
Fused Silica
60676-86-0
258.927647
89.000000
890000
55.446827
554468
Other Organic Materials
Carbon Black
1333-86-4
1.45465
0.500000
5000
0.311499
3115
Thermoplastics
Epoxy
85954-11-6
21.819746
7.500000
75000
4.672486
46725
Sub-total
— —
290.929941
100
1000000
62.299806
622998
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
22.038706
100.000000
1000000
4.719374
47194
Sub-total
— —
22.038706
100
1000000
4.719374
47194
Total
— —
466.983702
— —
100
1000000

Qualification summary

Stress Reference Min lot qty SS / lot Condition Duration Result Notes
HTOL JESD22-A108 3 77 Life test, 125C 1000 hours Pass Or equivalent JEDEC condition
HTSL JESD22-A103 3 25 High temp storage bake, 150C 1000 hours Pass Or equivalent JEDEC condition
AC/UHAST JESD22-A102/JESD22-A118 3 25 Unbiased HAST 130C / 85% RH 96 hours Pass Or equivalent JEDEC condition
THB/HAST JESD22-A101/JESD22-A110 3 25 HAST 130C/85%RH 96 hours Pass Or equivalent JEDEC condition
TC JESD22-A104 3 25 Temperature cycle -65/150C 500 cycles Pass Or equivalent JEDEC condition
SD J-STD-002 3 22 Per specification >95% lead coverage Pass —
HBM JS-001 1 3 ESD - HBM Classification See data sheet —
CDM JS-002 1 3 ESD - CDM Classification See data sheet —
LU JESD78 1 3 Latch-up Per JESD78 Pass As applicable per JESD78
MSL J-STD-020 — — Per J-STD-020 Classification See data sheet —

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Cumulative Sample Size Disposition
180nm CMOS Life test 125C, 1000 Hours or Equivalent JEDEC Condition 10040 Pass
Assembly process reliability data
Package Family Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
QFP (with Thermal Pad) Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 1694 38563 Pass
QFP (with Thermal Pad) High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 1926 33083 Pass
QFP (with Thermal Pad) Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 4468 76478 Pass
QFP (with Thermal Pad) Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 2482 57109 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.