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Quality, reliability & packaging data download

TL034CPWR ACTIVE

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Quality data will change based on assembly site

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Rating

Catalog
RoHS Yes
REACH Yes
Device Marking T034
Lead finish/Ball material NiPdAu
MSL rating/Peak reflow Level-1-260C-UNLIM

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
8.71x109 0.1 55 60 0.7 125 1000 101758 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Other Nonferrous Metals and Alloys
Yttrium
7440-65-5
0.000001
0.001187
12
0.000001
0
Precious Metals
Gold
7440-57-5
0.084276
99.997627
999976
0.111778
1118
Precious Metals
Silver
7440-22-4
0.000001
0.001187
12
0.000001
0
Sub-total
— —
0.084278
100
1000000
0.111781
1118
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.585869
80.000027
800000
0.777059
7771
Thermoplastics
Epoxy
85954-11-6
0.146467
19.999973
200000
0.194265
1943
Sub-total
— —
0.732336
100
1000000
0.971324
9713
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
28.67088
97.520000
975200
38.027235
380272
Copper and Its Alloys
Iron
7439-89-6
0.6762
2.300000
23000
0.896869
8969
Copper and Its Alloys
Phosphorus
7723-14-0
0.00882
0.030000
300
0.011698
117
Zinc and Its Alloys
Zinc
7440-66-6
0.0441
0.150000
1500
0.058491
585
Sub-total
— —
29.40000
100
1000000
38.994293
389943
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
0.113954
95.120200
951202
0.151141
1511
Precious Metals
Gold
7440-57-5
0.000934
0.779633
7796
0.001239
12
Precious Metals
Palladium
7440-05-3
0.004912
4.100167
41002
0.006515
65
Sub-total
— —
0.119800
100
1000000
0.158895
1589
Mold Compound
Other Inorganic Materials
Fused Silica
60676-86-0
36.263042
85.000001
850000
48.096996
480970
Other Organic Materials
Carbon Black
1333-86-4
0.213312
0.500000
5000
0.282923
2829
Thermoplastics
Epoxy
85954-11-6
6.186048
14.499999
145000
8.204781
82048
Sub-total
— —
42.662402
100
1000000
56.584701
565847
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
2.396832
100.000000
1000000
3.179006
31790
Sub-total
— —
2.396832
100
1000000
3.179006
31790
Total
— —
75.395648
— —
100
1000000

Qualification summary

Stress Reference Min lot qty SS / lot Condition Duration Result Notes
HTOL JESD22-A108 3 77 Life test, 125C 1000 hours Pass Or equivalent JEDEC condition
HTSL JESD22-A103 3 25 High temp storage bake, 150C 1000 hours Pass Or equivalent JEDEC condition
AC/UHAST JESD22-A102/JESD22-A118 3 25 Unbiased HAST 130C / 85% RH 96 hours Pass Or equivalent JEDEC condition
THB/HAST JESD22-A101/JESD22-A110 3 25 HAST 130C/85%RH 96 hours Pass Or equivalent JEDEC condition
TC JESD22-A104 3 25 Temperature cycle -65/150C 500 cycles Pass Or equivalent JEDEC condition
SD J-STD-002 3 22 Per specification >95% lead coverage Pass —
HBM JS-001 1 3 ESD - HBM Classification See data sheet —
CDM JS-002 1 3 ESD - CDM Classification See data sheet —
LU JESD78 1 3 Latch-up Per JESD78 Pass As applicable per JESD78
MSL J-STD-020 — — Per J-STD-020 Classification See data sheet —

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (3Q2025 - 2Q2026) Sample Size Cumulative Sample Size Disposition
Power BICMOS High temperature gate bias 150C, 1000 Hours or Equivalent JEDEC Condition 924 924 Pass
Power BICMOS High temperature reverse bias 125C, 1000 Hours or Equivalent JEDEC Condition 1386 1386 Pass
Power BICMOS Life test 125C, 1000 Hours or Equivalent JEDEC Condition 28776 454456 Pass
Assembly process reliability data
Package Family Reliability Test Rolling Year (3Q2025 - 2Q2026) Sample Size Cumulative Sample Size Disposition
TSSOP Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 2541 48571 Pass
TSSOP High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 2277 38315 Pass
TSSOP Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 6083 105076 Pass
TSSOP Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 4697 85185 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.