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Quality, reliability & packaging data download

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Rating

Catalog
RoHS Yes
RoHS Yes
REACH Yes
REACH Yes
Device Marking 062AC
Lead finish/Ball material NiPdAu
Lead finish/Ball material NiPdAu
MSL rating/Peak reflow Level-1-260C-UNLIM
MSL rating/Peak reflow Level-1-260C-UNLIM

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
8.71x109 0.1 55 60 0.7 125 1000 101758 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Precious Metals
Gold
7440-57-5
0.093657
100.000000
1000000
0.147112
1471
Sub-total
— —
0.093657
100
1000000
0.147112
1471
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.323535
79.999951
800000
0.508194
5082
Thermoplastics
Epoxy
85954-11-6
0.080884
20.000049
200000
0.127049
1270
Sub-total
— —
0.404419
100
1000000
0.635243
6352
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
13.80808
97.240000
972400
21.689101
216891
Copper and Its Alloys
Iron
7439-89-6
0.3692
2.600000
26000
0.579922
5799
Copper and Its Alloys
Phosphorus
7723-14-0
0.0213
0.150000
1500
0.033457
335
Other Nonferrous Metals and Alloys
Lead
7439-92-1
0.00142
0.010000
100
0.002230
22
Sub-total
— —
14.20000
100
1000000
22.304711
223047
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
0.13507
95.119718
951197
0.212162
2122
Precious Metals
Gold
7440-57-5
0.001108
0.780282
7803
0.001740
17
Precious Metals
Palladium
7440-05-3
0.005822
4.100000
41000
0.009145
91
Sub-total
— —
0.142000
100
1000000
0.223047
2230
Mold Compound
Other Inorganic Materials
Fused Silica
60676-86-0
36.1
76.000000
760000
56.704230
567042
Other Organic Materials
Carbon Black
1333-86-4
0.1425
0.300000
3000
0.223832
2238
Thermoplastics
Epoxy
85954-11-6
9.595
20.200000
202000
15.071387
150714
Thermoplastics
Proprietary Non Halide Flame Retardant
—
1.6625
3.500000
35000
2.611379
26114
Sub-total
— —
47.5000
100
1000000
74.610829
746108
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
1.323605
100.000000
1000000
2.079058
20791
Sub-total
— —
1.323605
100
1000000
2.079058
20791
Total
— —
63.663681
— —
100
1000000
Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.030161
97.535815
975358
0.040425
404
Not Categorized
Proprietary Materials
—
0.000003
0.009702
97
0.000004
0
Precious Metals
Gold
7440-57-5
0.000016
0.051741
517
0.000021
0
Precious Metals
Palladium
7440-05-3
0.000742
2.399508
23995
0.000994
10
Precious Metals
Silver
7440-22-4
0.000001
0.003234
32
0.000001
0
Sub-total
— —
0.030923
100
1000000
0.041446
414
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.108954
80.000294
800003
0.146031
1460
Thermoplastics
Epoxy
85954-11-6
0.027238
19.999706
199997
0.036507
365
Sub-total
— —
0.136192
100
1000000
0.182538
1825
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
12.8106
97.050000
970500
17.169992
171700
Copper and Its Alloys
Iron
7439-89-6
0.3432
2.600000
26000
0.459989
4600
Copper and Its Alloys
Phosphorus
7723-14-0
0.0198
0.150000
1500
0.026538
265
Zinc and Its Alloys
Zinc
7440-66-6
0.0264
0.200000
2000
0.035384
354
Sub-total
— —
13.2000
100
1000000
17.691903
176919
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
0.09512
95.120000
951200
0.127489
1275
Precious Metals
Gold
7440-57-5
0.00078
0.780000
7800
0.001045
10
Precious Metals
Palladium
7440-05-3
0.0041
4.100000
41000
0.005495
55
Sub-total
— —
0.10000
100
1000000
0.134030
1340
Mold Compound
Not Categorized
Phenolic Resin
9003-35-4
2.124414
3.500000
35000
2.847343
28473
Other Inorganic Materials
Fused Silica
60676-86-0
51.896404
85.499999
855000
69.556527
695565
Other Organic Materials
Carbon Black
1333-86-4
0.303488
0.500000
5000
0.406764
4068
Thermoplastics
Epoxy
85954-11-6
6.373243
10.500001
105000
8.542030
85420
Sub-total
— —
60.697549
100
1000000
81.352664
813527
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
0.445737
100.000000
1000000
0.597419
5974
Sub-total
— —
0.445737
100
1000000
0.597419
5974
Total
— —
74.610401
— —
100
1000000

Qualification summary

Stress Reference Min lot qty SS / lot Condition Duration Result Notes
HTOL JESD22-A108 3 77 Life test, 125C 1000 hours Pass Or equivalent JEDEC condition
HTSL JESD22-A103 3 25 High temp storage bake, 150C 1000 hours Pass Or equivalent JEDEC condition
AC/UHAST JESD22-A102/JESD22-A118 3 25 Unbiased HAST 130C / 85% RH 96 hours Pass Or equivalent JEDEC condition
THB/HAST JESD22-A101/JESD22-A110 3 25 HAST 130C/85%RH 96 hours Pass Or equivalent JEDEC condition
TC JESD22-A104 3 25 Temperature cycle -65/150C 500 cycles Pass Or equivalent JEDEC condition
SD J-STD-002 3 22 Per specification >95% lead coverage Pass —
HBM JS-001 1 3 ESD - HBM Classification See data sheet —
CDM JS-002 1 3 ESD - CDM Classification See data sheet —
LU JESD78 1 3 Latch-up Per JESD78 Pass As applicable per JESD78
MSL J-STD-020 — — Per J-STD-020 Classification See data sheet —

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
Power BICMOS High temperature gate bias 150C, 1000 Hours or Equivalent JEDEC Condition 924 924 Pass
Power BICMOS High temperature reverse bias 125C, 1000 Hours or Equivalent JEDEC Condition 1386 1386 Pass
Power BICMOS Life test 125C, 1000 Hours or Equivalent JEDEC Condition 28135 458152 Pass
Assembly process reliability data
Package Family Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
SOIC Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 5061 85659 Pass
SOIC High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 5627 75195 Pass
SOIC Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 13223 189952 Pass
SOIC Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 7777 139298 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.