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Quality, reliability & packaging data download

TL082CPWR ACTIVE

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Quality data will change based on assembly site

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Rating

Catalog
RoHS Yes
REACH Yes
Device Marking T082
Lead finish/Ball material NiPdAu
MSL rating/Peak reflow Level-1-260C-UNLIM

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
8.71x109 0.1 55 60 0.7 125 1000 101758 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.025125
99.992040
999920
0.054584
546
Not Categorized
Proprietary Materials
—
0.000002
0.007960
80
0.000004
0
Sub-total
— —
0.025127
100
1000000
0.054588
546
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.365077
80.000044
800000
0.793131
7931
Thermoplastics
Epoxy
85954-11-6
0.091269
19.999956
200000
0.198282
1983
Sub-total
— —
0.456346
100
1000000
0.991413
9914
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
18.024088
97.427497
974275
39.157378
391574
Copper and Its Alloys
Iron
7439-89-6
0.43475
2.350000
23500
0.944496
9445
Copper and Its Alloys
Phosphorus
7723-14-0
0.015263
0.082503
825
0.033159
332
Other Nonferrous Metals and Alloys
Lead
7439-92-1
0.002775
0.015000
150
0.006029
60
Zinc and Its Alloys
Zinc
7440-66-6
0.023125
0.125000
1250
0.050239
502
Sub-total
— —
18.500001
100
1000000
40.191301
401913
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
0.060877
95.120313
951203
0.132255
1323
Precious Metals
Gold
7440-57-5
0.000499
0.779688
7797
0.001084
11
Precious Metals
Palladium
7440-05-3
0.002624
4.100000
41000
0.005701
57
Sub-total
— —
0.064000
100
1000000
0.139040
1390
Mold Compound
Other Inorganic Materials
Silica
7631-86-9
21.667208
85.000000
850000
47.072066
470721
Other Organic Materials
Carbon Black
1333-86-4
0.127454
0.499999
5000
0.276894
2769
Thermoplastics
Epoxy
85954-11-6
3.696171
14.500001
145000
8.029941
80299
Sub-total
— —
25.490833
100
1000000
55.378901
553789
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
1.493557
100.000000
1000000
3.244756
32448
Sub-total
— —
1.493557
100
1000000
3.244756
32448
Total
— —
46.029864
— —
100
1000000

Qualification summary

Stress Reference Min lot qty SS / lot Condition Duration Result Notes
HTOL JESD22-A108 3 77 Life test, 125C 1000 hours Pass Or equivalent JEDEC condition
HTSL JESD22-A103 3 25 High temp storage bake, 150C 1000 hours Pass Or equivalent JEDEC condition
AC/UHAST JESD22-A102/JESD22-A118 3 25 Unbiased HAST 130C / 85% RH 96 hours Pass Or equivalent JEDEC condition
THB/HAST JESD22-A101/JESD22-A110 3 25 HAST 130C/85%RH 96 hours Pass Or equivalent JEDEC condition
TC JESD22-A104 3 25 Temperature cycle -65/150C 500 cycles Pass Or equivalent JEDEC condition
SD J-STD-002 3 22 Per specification >95% lead coverage Pass —
HBM JS-001 1 3 ESD - HBM Classification See data sheet —
CDM JS-002 1 3 ESD - CDM Classification See data sheet —
LU JESD78 1 3 Latch-up Per JESD78 Pass As applicable per JESD78
MSL J-STD-020 — — Per J-STD-020 Classification See data sheet —

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (3Q2025 - 2Q2026) Sample Size Cumulative Sample Size Disposition
Power BICMOS High temperature gate bias 150C, 1000 Hours or Equivalent JEDEC Condition 924 924 Pass
Power BICMOS High temperature reverse bias 125C, 1000 Hours or Equivalent JEDEC Condition 1386 1386 Pass
Power BICMOS Life test 125C, 1000 Hours or Equivalent JEDEC Condition 28776 456227 Pass
Assembly process reliability data
Package Family Reliability Test Rolling Year (3Q2025 - 2Q2026) Sample Size Cumulative Sample Size Disposition
TSSOP Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 2541 48571 Pass
TSSOP High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 2277 38315 Pass
TSSOP Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 6083 105076 Pass
TSSOP Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 4697 85185 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.