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Quality, reliability & packaging data download

TL084CPWR ACTIVE

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Rating

Catalog
RoHS Yes
RoHS Yes
REACH Yes
REACH Yes
Device Marking T084
Lead finish/Ball material NiPdAu
Lead finish/Ball material Sn
MSL rating/Peak reflow Level-1-260C-UNLIM
MSL rating/Peak reflow Level-1-260C-UNLIM

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
8.71x109 0.1 55 60 0.7 125 1000 101758 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.051222
99.990240
999902
0.065204
652
Not Categorized
Proprietary Materials
—
0.000004
0.007808
78
0.000005
0
Precious Metals
Silver
7440-22-4
0.000001
0.001952
20
0.000001
0
Sub-total
— —
0.051227
100
1000000
0.065210
652
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.638646
80.000050
800001
0.812976
8130
Thermoplastics
Epoxy
85954-11-6
0.159661
19.999950
199999
0.203243
2032
Sub-total
— —
0.798307
100
1000000
1.016220
10162
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
31.910295
97.585000
975850
40.620795
406208
Copper and Its Alloys
Iron
7439-89-6
0.7521
2.300000
23000
0.957399
9574
Copper and Its Alloys
Phosphorus
7723-14-0
0.004905
0.015000
150
0.006244
62
Zinc and Its Alloys
Zinc
7440-66-6
0.0327
0.100000
1000
0.041626
416
Sub-total
— —
32.700000
100
1000000
41.626064
416261
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
0.030724
95.120743
951207
0.039111
391
Precious Metals
Gold
7440-57-5
0.000252
0.780186
7802
0.000321
3
Precious Metals
Palladium
7440-05-3
0.001324
4.099071
40991
0.001685
17
Sub-total
— —
0.032300
100
1000000
0.041117
411
Mold Compound
Other Inorganic Materials
Silica
7631-86-9
36.007675
84.999999
850000
45.836630
458366
Other Organic Materials
Carbon Black
1333-86-4
0.21181
0.500000
5000
0.269627
2696
Thermoplastics
Epoxy
85954-11-6
6.142486
14.500000
145000
7.819190
78192
Sub-total
— —
42.361971
100
1000000
53.925447
539254
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
2.612745
100.000000
1000000
3.325942
33259
Sub-total
— —
2.612745
100
1000000
3.325942
33259
Total
— —
78.556550
— —
100
1000000
Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.055502
94.964497
949645
0.072353
724
Copper and Its Alloys
Iron
7439-89-6
0.000001
0.001711
17
0.000001
0
Not Categorized
Proprietary Materials
—
0.000006
0.010266
103
0.000008
0
Precious Metals
Gold
7440-57-5
0.00062
1.060826
10608
0.000808
8
Precious Metals
Palladium
7440-05-3
0.002315
3.960989
39610
0.003018
30
Precious Metals
Silver
7440-22-4
0.000001
0.001711
17
0.000001
0
Sub-total
— —
0.058445
100
1000000
0.076189
762
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.084949
75.000221
750002
0.110740
1107
Thermoplastics
Epoxy
85954-11-6
0.028316
24.999779
249998
0.036913
369
Sub-total
— —
0.113265
100
1000000
0.147652
1477
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
29.052905
97.702798
977028
37.873417
378734
Copper and Its Alloys
Iron
7439-89-6
0.661626
2.225000
22250
0.862497
8625
Copper and Its Alloys
Phosphorus
7723-14-0
0.001963
0.006601
66
0.002559
26
Zinc and Its Alloys
Zinc
7440-66-6
0.019507
0.065601
656
0.025429
254
Sub-total
— —
29.736001
100
1000000
38.763902
387639
Lead Frame Plating
Other Nonferrous Metals and Alloys
Tin
7440-31-5
0.699
100.000000
1000000
0.911218
9112
Sub-total
— —
0.699
100
1000000
0.911218
9112
Mold Compound
Not Categorized
Phenolic Resin
9003-35-4
1.3707
3.000001
30000
1.786847
17868
Other Inorganic Materials
Silica
7631-86-9
37.237341
81.500000
815000
48.542662
485427
Other Organic Materials
Carbon Black
1333-86-4
0.22845
0.500000
5000
0.297808
2978
Other Plastics and Rubber
Silicone
218163-11-2
3.426749
7.500000
75000
4.467116
44671
Thermoplastics
Epoxy
85954-11-6
3.426749
7.500000
75000
4.467116
44671
Sub-total
— —
45.689989
100
1000000
59.561548
595615
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
0.413846
100.000000
1000000
0.539490
5395
Sub-total
— —
0.413846
100
1000000
0.539490
5395
Total
— —
76.710546
— —
100
1000000

Qualification summary

Stress Reference Min lot qty SS / lot Condition Duration Result Notes
HTOL JESD22-A108 3 77 Life test, 125C 1000 hours Pass Or equivalent JEDEC condition
HTSL JESD22-A103 3 25 High temp storage bake, 150C 1000 hours Pass Or equivalent JEDEC condition
AC/UHAST JESD22-A102/JESD22-A118 3 25 Unbiased HAST 130C / 85% RH 96 hours Pass Or equivalent JEDEC condition
THB/HAST JESD22-A101/JESD22-A110 3 25 HAST 130C/85%RH 96 hours Pass Or equivalent JEDEC condition
TC JESD22-A104 3 25 Temperature cycle -65/150C 500 cycles Pass Or equivalent JEDEC condition
SD J-STD-002 3 22 Per specification >95% lead coverage Pass —
HBM JS-001 1 3 ESD - HBM Classification See data sheet —
CDM JS-002 1 3 ESD - CDM Classification See data sheet —
LU JESD78 1 3 Latch-up Per JESD78 Pass As applicable per JESD78
MSL J-STD-020 — — Per J-STD-020 Classification See data sheet —

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
Power BICMOS High temperature gate bias 150C, 1000 Hours or Equivalent JEDEC Condition 924 924 Pass
Power BICMOS High temperature reverse bias 125C, 1000 Hours or Equivalent JEDEC Condition 1386 1386 Pass
Power BICMOS Life test 125C, 1000 Hours or Equivalent JEDEC Condition 28135 458152 Pass
Assembly process reliability data
Package Family Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
TSSOP Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 2387 48648 Pass
TSSOP High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 2187 38360 Pass
TSSOP Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 5852 105153 Pass
TSSOP Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 4389 85262 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.