Home  >  Quality & reliability  >  Quality, reliability & packaging data download

Quality, reliability & packaging data download

TL3016CPWR ACTIVE

By using this tool to “search” or “download”, you agree to TI’s terms of use, privacy policy (including cookie policy), and important notice.

Search more parts

Filter between the data types to view or download

Quality data will change based on assembly site

Download .xls Download PDF

Rating

Catalog
RoHS Yes
REACH Yes
Device Marking T3016
Lead finish/Ball material NiPdAu
MSL rating/Peak reflow Level-1-260C-UNLIM

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
4.85x108 2.1 55 60 0.7 125 1000 12490 1 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.041677
99.997601
999976
0.105135
1051
Precious Metals
Silver
7440-22-4
0.000001
0.002399
24
0.000003
0
Sub-total
— —
0.041678
100
1000000
0.105138
1051
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.339793
80.000047
800000
0.857169
8572
Thermoplastics
Epoxy
85954-11-6
0.084948
19.999953
200000
0.214292
2143
Sub-total
— —
0.424741
100
1000000
1.071461
10715
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
12.6633
97.410000
974100
31.944724
319447
Copper and Its Alloys
Iron
7439-89-6
0.312
2.400000
24000
0.787058
7871
Copper and Its Alloys
Phosphorus
7723-14-0
0.0039
0.030000
300
0.009838
98
Other Nonferrous Metals and Alloys
Lead
7439-92-1
0.0039
0.030000
300
0.009838
98
Other Nonferrous Metals and Alloys
Tin
7440-31-5
0.0039
0.030000
300
0.009838
98
Zinc and Its Alloys
Zinc
7440-66-6
0.013
0.100000
1000
0.032794
328
Sub-total
— —
13.0000
100
1000000
32.794091
327941
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
0.247312
95.120000
951200
0.623875
6239
Precious Metals
Gold
7440-57-5
0.002028
0.780000
7800
0.005116
51
Precious Metals
Palladium
7440-05-3
0.01066
4.100000
41000
0.026891
269
Sub-total
— —
0.260000
100
1000000
0.655882
6559
Mold Compound
Other Inorganic Materials
Fused Silica
60676-86-0
21.091287
86.000001
860000
53.205352
532054
Other Organic Materials
Carbon Black
1333-86-4
0.073574
0.299999
3000
0.185599
1856
Thermoplastics
Epoxy
85954-11-6
3.359891
13.700000
137000
8.475736
84757
Sub-total
— —
24.524752
100
1000000
61.866688
618667
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
1.390117
100.000000
1000000
3.506740
35067
Sub-total
— —
1.390117
100
1000000
3.506740
35067
Total
— —
39.641288
— —
100
1000000

Qualification summary

Stress Reference Min lot qty SS / lot Condition Duration Result Notes
HTOL JESD22-A108 3 77 Life test, 125C 1000 hours Pass Or equivalent JEDEC condition
HTSL JESD22-A103 3 25 High temp storage bake, 150C 1000 hours Pass Or equivalent JEDEC condition
AC/UHAST JESD22-A102/JESD22-A118 3 25 Unbiased HAST 130C / 85% RH 96 hours Pass Or equivalent JEDEC condition
THB/HAST JESD22-A101/JESD22-A110 3 25 HAST 130C/85%RH 96 hours Pass Or equivalent JEDEC condition
TC JESD22-A104 3 25 Temperature cycle -65/150C 500 cycles Pass Or equivalent JEDEC condition
SD J-STD-002 3 22 Per specification >95% lead coverage Pass —
HBM JS-001 1 3 ESD - HBM Classification See data sheet —
CDM JS-002 1 3 ESD - CDM Classification See data sheet —
LU JESD78 1 3 Latch-up Per JESD78 Pass As applicable per JESD78
MSL J-STD-020 — — Per J-STD-020 Classification See data sheet —

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (3Q2025 - 2Q2026) Sample Size Cumulative Sample Size Disposition
Power BICMOS High temperature gate bias 150C, 1000 Hours or Equivalent JEDEC Condition 924 924 Pass
Power BICMOS High temperature reverse bias 125C, 1000 Hours or Equivalent JEDEC Condition 1386 1386 Pass
Power BICMOS Life test 125C, 1000 Hours or Equivalent JEDEC Condition 28776 456689 Pass
Assembly process reliability data
Package Family Reliability Test Rolling Year (3Q2025 - 2Q2026) Sample Size Cumulative Sample Size Disposition
TSSOP Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 2541 48571 Pass
TSSOP High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 2277 38315 Pass
TSSOP Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 6083 105076 Pass
TSSOP Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 4697 85185 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

Close

Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.