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Quality, reliability & packaging data download

TL331MDBVTEP ACTIVE

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Rating

HiRel Enhanced Product
RoHS Yes
REACH Yes
Device Marking TEPU
Lead finish/Ball material NiPdAu
MSL rating/Peak reflow Level-1-260C-UNLIM

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
1.6x109 0.6 55 60 0.7 125 1000 41301 1 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Precious Metals
Gold
7440-57-5
0.044091
100.000000
1000000
0.218640
2186
Sub-total
— —
0.044091
100
1000000
0.218640
2186
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.083196
75.000000
750000
0.412555
4126
Thermoplastics
Epoxy
85954-11-6
0.027732
25.000000
250000
0.137518
1375
Sub-total
— —
0.110928
100
1000000
0.550074
5501
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
7.80776
97.597000
975970
38.717401
387174
Copper and Its Alloys
Iron
7439-89-6
0.1784
2.230000
22300
0.884656
8847
Copper and Its Alloys
Phosphorus
7723-14-0
0.0028
0.035000
350
0.013885
139
Zinc and Its Alloys
Zinc
7440-66-6
0.01104
0.138000
1380
0.054746
547
Sub-total
— —
8.00000
100
1000000
39.670688
396707
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
0.085608
95.120000
951200
0.424516
4245
Precious Metals
Gold
7440-57-5
0.000702
0.780000
7800
0.003481
35
Precious Metals
Palladium
7440-05-3
0.00369
4.100000
41000
0.018298
183
Sub-total
— —
0.090000
100
1000000
0.446295
4463
Mold Compound
Other Inorganic Materials
Fused Silica
60676-86-0
10.007972
87.000001
870000
49.627891
496279
Other Organic Materials
Carbon Black
1333-86-4
0.011503
0.099996
1000
0.057041
570
Thermoplastics
Epoxy
85954-11-6
1.483941
12.900003
129000
7.358620
73586
Sub-total
— —
11.503416
100
1000000
57.043553
570436
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
0.417588
100.000000
1000000
2.070750
20708
Sub-total
— —
0.417588
100
1000000
2.070750
20708
Total
— —
20.166023
— —
100
1000000

Qualification summary

Stress Reference Min lot qty SS / lot Condition Duration Result
HTOL JESD22-A108 3 77 Life test, 125C 1000 hours Pass
HTSL JESD22-A103 3 25 High temp storage bake 150C 1000 hours Pass
AC/UHAST JESD22-A102/JESD22-A118 3 25 Autoclave 121C or unbiased HAST 130C / 85% RH 96 hours Pass
THB/HAST JESD22-A101/JESD22-A110 3 25 THB 85C/85%RH or HAST 130C/110C/85%RH 1000 hours or 96 hours Pass
TC JESD22-A104 3 25 Temperature cycle -65/150C 500 cycles Pass
SD J-STD-002 3 22 Per specification >95% lead coverage Pass
HBM JS-001 1 3 ESD - HBM Classification See data sheet
CDM JESD22-C101 1 3 ESD - CDM Classification See data sheet
LU JESD78 1 3 Latch-up Per JESD78 Pass
MSL J-STD-020 — — Per J-STD-020 Classification See data sheet

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (2Q2025 - 1Q2026) Sample Size Cumulative Sample Size Disposition
BIPOLAR Life test 125C, 1000 Hours or Equivalent JEDEC Condition 1540 24692 Pass
Assembly process reliability data
Package Family Reliability Test Rolling Year (2Q2025 - 1Q2026) Sample Size Cumulative Sample Size Disposition
SOP/SOT Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 8070 115656 Pass
SOP/SOT High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 6141 91311 Pass
SOP/SOT Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 18991 216669 Pass
SOP/SOT Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 11781 174001 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.