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Quality, reliability & packaging data download

TLE2022AMFKB ACTIVE

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Rating

Military
RoHS No
REACH Affected
Device Marking 5962-, MFKB, TLE2022A, 9088105Q2A
Lead finish/Ball material SnPb
MSL rating/Peak reflow Level-NC-NC-NC

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
1.08x108 9.3 55 60 0.7 125 1000 1262 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Aluminum and Its Alloys
Aluminum
7429-90-5
0.080447
99.131260
991313
0.022806
228
Copper and Its Alloys
Copper
7440-50-8
0.000001
0.001232
12
0.000000
0
Copper and Its Alloys
Iron
7439-89-6
0.000002
0.002465
25
0.000001
0
Other Inorganic Materials
Silicon
7440-21-3
0.0007
0.862579
8626
0.000198
2
Precious Metals
Silver
7440-22-4
0.000002
0.002465
25
0.000001
0
Sub-total
— —
0.081152
100
1000000
0.023006
230
Die Attach Adhesive
Other Nonferrous Metals and Alloys
Lead Borate Glass
65997-18-4
0.03845
14.999902
149999
0.010900
109
Other Plastics and Rubber
Other Filler
—
0.012817
5.000098
50001
0.003633
36
Precious Metals
Silver
7440-22-4
0.205068
80.000000
800000
0.058135
581
Sub-total
— —
0.256335
100
1000000
0.072668
727
Header - Ceramic
Magnesium and Its Alloys
Magnesium Oxide
1309-48-4
1.20135
0.500000
5000
0.340571
3406
Other Inorganic Materials
Aluminum Oxide
1344-28-1
217.44435
90.500000
905000
61.643301
616433
Other Inorganic Materials
Silicon Dioxide
7631-86-9
8.457504
3.520000
35200
2.397618
23976
Other Nonferrous Metals and Alloys
Calcium Oxide
1305-78-8
1.465647
0.610000
6100
0.415496
4155
Other Nonferrous Metals and Alloys
Chromium Oxide
1308-38-9
9.298449
3.870000
38700
2.636017
26360
Other Nonferrous Metals and Alloys
Titanium Dioxide
13463-67-7
2.4027
1.000000
10000
0.681141
6811
Sub-total
— —
240.270000
100
1000000
68.114145
681141
Header - Lead Frame
Other Nonferrous Metals and Alloys
Tungsten
7440-33-7
3.237
100.000000
1000000
0.917657
9177
Sub-total
— —
3.237
100
1000000
0.917657
9177
Header - Plating
Nickel and Its Alloys
Nickel
7440-02-0
0.85
35.714286
357143
0.240967
2410
Other Nonferrous Metals and Alloys
Cobalt
7440-48-4
0.15
6.302521
63025
0.042524
425
Other Nonferrous Metals and Alloys
Thallium
7440-28-0
0.000028
0.001176
12
0.000008
0
Precious Metals
Gold
7440-57-5
1.379972
57.982017
579820
0.391208
3912
Sub-total
— —
2.380000
100
1000000
0.674706
6747
Header - Routing
Other Nonferrous Metals and Alloys
Tungsten
7440-33-7
7.553
100.000000
1000000
2.141200
21412
Sub-total
— —
7.553
100
1000000
2.141200
21412
Lead Frame Plating
Other Nonferrous Metals and Alloys
Lead
7439-92-1
0.017965
36.999279
369993
0.005093
51
Other Nonferrous Metals and Alloys
Tin
7440-31-5
0.03059
63.000721
630007
0.008672
87
Sub-total
— —
0.048555
100
1000000
0.013765
138
Lid
Copper and Its Alloys
Ferric Oxide
1309-37-1
0.72633
1.100000
11000
0.205907
2059
Other Inorganic Materials
Aluminum Oxide
1344-28-1
59.69112
90.400000
904000
16.921836
169218
Other Inorganic Materials
Silicon Dioxide
7631-86-9
1.45266
2.200000
22000
0.411815
4118
Other Inorganic Materials
Titanium Oxide
13463-67-7
1.05648
1.600000
16000
0.299502
2995
Other Nonferrous Metals and Alloys
Chromium Oxide
1308-38-9
0.72633
1.100000
11000
0.205907
2059
Other Nonferrous Metals and Alloys
Manganese Dioxide
1313-13-9
2.37708
3.600000
36000
0.673878
6739
Sub-total
— —
66.03000
100
1000000
18.718845
187188
Lid - Plating
Nickel and Its Alloys
Nickel
7440-02-0
1.153
100.000000
1000000
0.326864
3269
Sub-total
— —
1.153
100
1000000
0.326864
3269
Lid - Seal
Glass Frit
Iron Cobalt Chromite Black Spinel
68186-97-0
0.1449
0.500000
5000
0.041078
411
Glass Frit
Other (Glass w/out Declarable Substance)
NA
1.3041
4.500000
45000
0.369699
3697
Glass Frit
Silicate Acid, Zinc Salt (4:3)
96906-37-5
4.347
15.000000
150000
1.232331
12323
Glass Frit
Zinc Stannate
12036-37-2
7.245
25.000000
250000
2.053885
20539
Other Nonferrous Metals and Alloys
Boron Oxide
1303-86-2
1.449
5.000000
50000
0.410777
4108
Other Nonferrous Metals and Alloys
Lead Monoxide
1317-36-8
14.49
50.000000
500000
4.107770
41078
Sub-total
— —
28.9800
100
1000000
8.215540
82155
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
2.757074
100.000000
1000000
0.781603
7816
Sub-total
— —
2.757074
100
1000000
0.781603
7816
Total
— —
352.746116
— —
100
1000000

Qualification summary

No results found

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (3Q2025 - 2Q2026) Sample Size Cumulative Sample Size Disposition
BIPOLAR Life test 125C, 1000 Hours or Equivalent JEDEC Condition 770 24846 Pass
Assembly process reliability data
Package Family Reliability Test Cumulative Sample Size Disposition
LCCC Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 312 Pass
LCCC High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 1333 Pass
LCCC Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 1886 Pass
LCCC Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 788 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.