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Quality, reliability & packaging data download

TLE2024AMFKB ACTIVE

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Rating

Military
RoHS No
REACH Affected
Device Marking 5962-, MFKB, TLE2024A, 9088106Q2A
Lead finish/Ball material SnPb
MSL rating/Peak reflow Level-NC-NC-NC

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
1.08x108 9.3 55 60 0.7 125 1000 1262 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Aluminum and Its Alloys
Aluminum
7429-90-5
0.033034
99.129756
991298
0.007042
70
Copper and Its Alloys
Copper
7440-50-8
0.000001
0.003001
30
0.000000
0
Copper and Its Alloys
Iron
7439-89-6
0.000001
0.003001
30
0.000000
0
Other Inorganic Materials
Silicon
7440-21-3
0.000287
0.861241
8612
0.000061
1
Precious Metals
Silver
7440-22-4
0.000001
0.003001
30
0.000000
0
Sub-total
— —
0.033324
100
1000000
0.007104
71
Die Attach Adhesive
Other Plastics and Rubber
Other Filler
—
0.009055
0.500010
5000
0.001930
19
Precious Metals
Silver
7440-22-4
1.448771
79.999989
800000
0.308852
3089
Thermoplastics
Epoxy
85954-11-6
0.353138
19.500001
195000
0.075283
753
Sub-total
— —
1.810964
100
1000000
0.386065
3861
Header - Ceramic
Magnesium and Its Alloys
Magnesium Oxide
1309-48-4
1.3511
0.500000
5000
0.288030
2880
Other Inorganic Materials
Aluminum Oxide
1344-28-1
244.5491
90.500000
905000
52.133510
521335
Other Inorganic Materials
Silicon Dioxide
7631-86-9
9.511744
3.520000
35200
2.027734
20277
Other Nonferrous Metals and Alloys
Calcium Oxide
1305-78-8
1.648342
0.610000
6100
0.351397
3514
Other Nonferrous Metals and Alloys
Chromium Oxide
1308-38-9
10.457514
3.870000
38700
2.229356
22294
Other Nonferrous Metals and Alloys
Titanium Dioxide
13463-67-7
2.7022
1.000000
10000
0.576061
5761
Sub-total
— —
270.220000
100
1000000
57.606088
576061
Header - Lead Frame
Other Nonferrous Metals and Alloys
Tungsten
7440-33-7
7.446
100.000000
1000000
1.587354
15874
Sub-total
— —
7.446
100
1000000
1.587354
15874
Header - Plating
Nickel and Its Alloys
Nickel
7440-02-0
2.482
36.824926
368249
0.529118
5291
Other Nonferrous Metals and Alloys
Cobalt
7440-48-4
0.438
6.498516
64985
0.093374
934
Other Nonferrous Metals and Alloys
Thallium
7440-28-0
0.000076
0.001128
11
0.000016
0
Precious Metals
Gold
7440-57-5
3.819924
56.675430
566754
0.814340
8143
Sub-total
— —
6.740000
100
1000000
1.436848
14368
Header - Routing
Other Nonferrous Metals and Alloys
Tungsten
7440-33-7
17.374
100.000000
1000000
3.703827
37038
Sub-total
— —
17.374
100
1000000
3.703827
37038
Lead Frame Plating
Other Nonferrous Metals and Alloys
Lead
7439-92-1
0.041325
36.999731
369997
0.008810
88
Other Nonferrous Metals and Alloys
Tin
7440-31-5
0.070365
63.000269
630003
0.015001
150
Sub-total
— —
0.111690
100
1000000
0.023810
238
Lid
Aluminum and Its Alloys
Aluminum
7429-90-5
0.01083
0.008000
80
0.002309
23
Copper and Its Alloys
Copper
7440-50-8
0.13537
0.099997
1000
0.028858
289
Copper and Its Alloys
Iron
7439-89-6
72.274043
53.388398
533884
15.407538
154075
Magnesium and Its Alloys
Magnesium
7439-95-4
0.351962
0.259992
2600
0.075032
750
Nickel and Its Alloys
Nickel
7440-02-0
40.231964
29.719108
297191
8.576738
85767
Other Inorganic Materials
Silicon
7440-21-3
0.001354
0.001000
10
0.000289
3
Other Nonferrous Metals and Alloys
Chromium
7440-47-3
0.013537
0.010000
100
0.002886
29
Other Nonferrous Metals and Alloys
Cobalt
7440-48-4
22.322513
16.489505
164895
4.758762
47588
Other Nonferrous Metals and Alloys
Manganese
7439-96-5
0.001354
0.001000
10
0.000289
3
Other Nonferrous Metals and Alloys
Molybdenum
7439-98-7
0.013537
0.010000
100
0.002886
29
Other Nonferrous Metals and Alloys
Titanium
7440-32-6
0.002707
0.002000
20
0.000577
6
Other Nonferrous Metals and Alloys
Zirconium
7440-67-7
0.013537
0.010000
100
0.002886
29
Other Plastics and Rubber
Carbon
7440-44-0
0.001354
0.001000
10
0.000289
3
Sub-total
— —
135.374062
100
1000000
28.859337
288593
Lid - Plating
Nickel and Its Alloys
Nickel
7440-02-0
5.87136
48.000000
480000
1.251669
12517
Precious Metals
Gold
7440-57-5
6.36064
52.000000
520000
1.355975
13560
Sub-total
— —
12.23200
100
1000000
2.607644
26076
Lid - Seal
Other Nonferrous Metals and Alloys
Tin
7440-31-5
2.426
20.000000
200000
0.517180
5172
Precious Metals
Gold
7440-57-5
9.704
80.000000
800000
2.068720
20687
Sub-total
— —
12.130
100
1000000
2.585900
25859
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
5.610324
100.000000
1000000
1.196021
11960
Sub-total
— —
5.610324
100
1000000
1.196021
11960
Total
— —
469.082364
— —
100
1000000

Qualification summary

No results found

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
BIPOLAR Life test 125C, 1000 Hours or Equivalent JEDEC Condition 693 24846 Pass
Assembly process reliability data
Package Family Reliability Test Cumulative Sample Size Disposition
LCCC Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 312 Pass
LCCC High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 1333 Pass
LCCC Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 1886 Pass
LCCC Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 788 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.