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Quality, reliability & packaging data download

TLE2027AMFKB ACTIVE

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Rating

Military
RoHS No
REACH Affected
Device Marking 5962-, TLE2027AMFKB, 9089603Q2A
Lead finish/Ball material SnPb
MSL rating/Peak reflow Level-NC-NC-NC

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
1.08x108 9.3 55 60 0.7 125 1000 1262 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Aluminum and Its Alloys
Aluminum
7429-90-5
0.023862
99.131735
991317
0.006768
68
Copper and Its Alloys
Iron
7439-89-6
0.000001
0.004154
42
0.000000
0
Other Inorganic Materials
Silicon
7440-21-3
0.000208
0.864110
8641
0.000059
1
Sub-total
— —
0.024071
100
1000000
0.006828
68
Die Attach Adhesive
Other Nonferrous Metals and Alloys
Lead Borate Glass
65997-18-4
0.036718
15.000102
150001
0.010415
104
Other Plastics and Rubber
Other Filler
—
0.012239
4.999898
49999
0.003472
35
Precious Metals
Silver
7440-22-4
0.195828
80.000000
800000
0.055546
555
Sub-total
— —
0.244785
100
1000000
0.069432
694
Header - Ceramic
Magnesium and Its Alloys
Magnesium Oxide
1309-48-4
1.20135
0.500000
5000
0.340757
3408
Other Inorganic Materials
Aluminum Oxide
1344-28-1
217.44435
90.500000
905000
61.677022
616770
Other Inorganic Materials
Silicon Dioxide
7631-86-9
8.457504
3.520000
35200
2.398929
23989
Other Nonferrous Metals and Alloys
Calcium Oxide
1305-78-8
1.465647
0.610000
6100
0.415724
4157
Other Nonferrous Metals and Alloys
Chromium Oxide
1308-38-9
9.298449
3.870000
38700
2.637459
26375
Other Nonferrous Metals and Alloys
Titanium Dioxide
13463-67-7
2.4027
1.000000
10000
0.681514
6815
Sub-total
— —
240.270000
100
1000000
68.151406
681514
Header - Lead Frame
Other Nonferrous Metals and Alloys
Tungsten
7440-33-7
3.237
100.000000
1000000
0.918159
9182
Sub-total
— —
3.237
100
1000000
0.918159
9182
Header - Plating
Nickel and Its Alloys
Nickel
7440-02-0
0.85
35.714286
357143
0.241098
2411
Other Nonferrous Metals and Alloys
Cobalt
7440-48-4
0.15
6.302521
63025
0.042547
425
Other Nonferrous Metals and Alloys
Thallium
7440-28-0
0.000028
0.001176
12
0.000008
0
Precious Metals
Gold
7440-57-5
1.379972
57.982017
579820
0.391422
3914
Sub-total
— —
2.380000
100
1000000
0.675075
6751
Header - Routing
Other Nonferrous Metals and Alloys
Tungsten
7440-33-7
7.553
100.000000
1000000
2.142371
21424
Sub-total
— —
7.553
100
1000000
2.142371
21424
Lead Frame Plating
Other Nonferrous Metals and Alloys
Lead
7439-92-1
0.017965
36.999279
369993
0.005096
51
Other Nonferrous Metals and Alloys
Tin
7440-31-5
0.03059
63.000721
630007
0.008677
87
Sub-total
— —
0.048555
100
1000000
0.013772
138
Lid
Copper and Its Alloys
Ferric Oxide
1309-37-1
0.72633
1.100000
11000
0.206020
2060
Other Inorganic Materials
Aluminum Oxide
1344-28-1
59.69112
90.400000
904000
16.931093
169311
Other Inorganic Materials
Silicon Dioxide
7631-86-9
1.45266
2.200000
22000
0.412040
4120
Other Inorganic Materials
Titanium Oxide
13463-67-7
1.05648
1.600000
16000
0.299665
2997
Other Nonferrous Metals and Alloys
Chromium Oxide
1308-38-9
0.72633
1.100000
11000
0.206020
2060
Other Nonferrous Metals and Alloys
Manganese Dioxide
1313-13-9
2.37708
3.600000
36000
0.674247
6742
Sub-total
— —
66.03000
100
1000000
18.729085
187291
Lid - Plating
Nickel and Its Alloys
Nickel
7440-02-0
1.153
100.000000
1000000
0.327043
3270
Sub-total
— —
1.153
100
1000000
0.327043
3270
Lid - Seal
Glass Frit
Iron Cobalt Chromite Black Spinel
68186-97-0
0.1449
0.500000
5000
0.041100
411
Glass Frit
Other (Glass w/out Declarable Substance)
NA
1.3041
4.500000
45000
0.369902
3699
Glass Frit
Silicate Acid, Zinc Salt (4:3)
96906-37-5
4.347
15.000000
150000
1.233005
12330
Glass Frit
Zinc Stannate
12036-37-2
7.245
25.000000
250000
2.055009
20550
Other Nonferrous Metals and Alloys
Boron Oxide
1303-86-2
1.449
5.000000
50000
0.411002
4110
Other Nonferrous Metals and Alloys
Lead Monoxide
1317-36-8
14.49
50.000000
500000
4.110017
41100
Sub-total
— —
28.9800
100
1000000
8.220035
82200
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
2.632845
100.000000
1000000
0.746794
7468
Sub-total
— —
2.632845
100
1000000
0.746794
7468
Total
— —
352.553256
— —
100
1000000

Qualification summary

No results found

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
BIPOLAR Life test 125C, 1000 Hours or Equivalent JEDEC Condition 693 24846 Pass
Assembly process reliability data
Package Family Reliability Test Cumulative Sample Size Disposition
LCCC Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 312 Pass
LCCC High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 1333 Pass
LCCC Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 1886 Pass
LCCC Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 788 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.