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TLE2072AMFKB ACTIVE

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Rating

Military
RoHS No
REACH Affected
Device Marking 5962-, AMFKB, TLE2072, 9460205Q2A
Lead finish/Ball material SnPb
MSL rating/Peak reflow Level-NC-NC-NC

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
1.08x108 9.3 55 60 0.7 125 1000 1262 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Aluminum and Its Alloys
Aluminum
7429-90-5
0.080447
99.131260
991313
0.022797
228
Copper and Its Alloys
Copper
7440-50-8
0.000001
0.001232
12
0.000000
0
Copper and Its Alloys
Iron
7439-89-6
0.000002
0.002465
25
0.000001
0
Other Inorganic Materials
Silicon
7440-21-3
0.0007
0.862579
8626
0.000198
2
Precious Metals
Silver
7440-22-4
0.000002
0.002465
25
0.000001
0
Sub-total
— —
0.081152
100
1000000
0.022997
230
Die Attach Adhesive
Other Nonferrous Metals and Alloys
Lead Borate Glass
65997-18-4
0.040239
15.000112
150001
0.011403
114
Other Plastics and Rubber
Other Filler
—
0.013413
5.000037
50000
0.003801
38
Precious Metals
Silver
7440-22-4
0.214606
79.999851
799999
0.060814
608
Sub-total
— —
0.268258
100
1000000
0.076018
760
Header - Ceramic
Magnesium and Its Alloys
Magnesium Oxide
1309-48-4
1.20135
0.500000
5000
0.340435
3404
Other Inorganic Materials
Aluminum Oxide
1344-28-1
217.44435
90.500000
905000
61.618818
616188
Other Inorganic Materials
Silicon Dioxide
7631-86-9
8.457504
3.520000
35200
2.396666
23967
Other Nonferrous Metals and Alloys
Calcium Oxide
1305-78-8
1.465647
0.610000
6100
0.415331
4153
Other Nonferrous Metals and Alloys
Chromium Oxide
1308-38-9
9.298449
3.870000
38700
2.634970
26350
Other Nonferrous Metals and Alloys
Titanium Dioxide
13463-67-7
2.4027
1.000000
10000
0.680871
6809
Sub-total
— —
240.270000
100
1000000
68.087091
680871
Header - Lead Frame
Other Nonferrous Metals and Alloys
Tungsten
7440-33-7
3.237
100.000000
1000000
0.917293
9173
Sub-total
— —
3.237
100
1000000
0.917293
9173
Header - Plating
Nickel and Its Alloys
Nickel
7440-02-0
0.85
35.714286
357143
0.240871
2409
Other Nonferrous Metals and Alloys
Cobalt
7440-48-4
0.15
6.302521
63025
0.042507
425
Other Nonferrous Metals and Alloys
Thallium
7440-28-0
0.000028
0.001176
12
0.000008
0
Precious Metals
Gold
7440-57-5
1.379972
57.982017
579820
0.391053
3911
Sub-total
— —
2.380000
100
1000000
0.674438
6744
Header - Routing
Other Nonferrous Metals and Alloys
Tungsten
7440-33-7
7.553
100.000000
1000000
2.140350
21403
Sub-total
— —
7.553
100
1000000
2.140350
21403
Lead Frame Plating
Other Nonferrous Metals and Alloys
Lead
7439-92-1
0.017965
36.999279
369993
0.005091
51
Other Nonferrous Metals and Alloys
Tin
7440-31-5
0.03059
63.000721
630007
0.008669
87
Sub-total
— —
0.048555
100
1000000
0.013759
138
Lid
Copper and Its Alloys
Ferric Oxide
1309-37-1
0.72633
1.100000
11000
0.205826
2058
Other Inorganic Materials
Aluminum Oxide
1344-28-1
59.69112
90.400000
904000
16.915115
169151
Other Inorganic Materials
Silicon Dioxide
7631-86-9
1.45266
2.200000
22000
0.411651
4117
Other Inorganic Materials
Titanium Oxide
13463-67-7
1.05648
1.600000
16000
0.299383
2994
Other Nonferrous Metals and Alloys
Chromium Oxide
1308-38-9
0.72633
1.100000
11000
0.205826
2058
Other Nonferrous Metals and Alloys
Manganese Dioxide
1313-13-9
2.37708
3.600000
36000
0.673611
6736
Sub-total
— —
66.03000
100
1000000
18.711411
187114
Lid - Plating
Nickel and Its Alloys
Nickel
7440-02-0
1.153
100.000000
1000000
0.326734
3267
Sub-total
— —
1.153
100
1000000
0.326734
3267
Lid - Seal
Glass Frit
Iron Cobalt Chromite Black Spinel
68186-97-0
0.1449
0.500000
5000
0.041061
411
Glass Frit
Other (Glass w/out Declarable Substance)
NA
1.3041
4.500000
45000
0.369552
3696
Glass Frit
Silicate Acid, Zinc Salt (4:3)
96906-37-5
4.347
15.000000
150000
1.231842
12318
Glass Frit
Zinc Stannate
12036-37-2
7.245
25.000000
250000
2.053069
20531
Other Nonferrous Metals and Alloys
Boron Oxide
1303-86-2
1.449
5.000000
50000
0.410614
4106
Other Nonferrous Metals and Alloys
Lead Monoxide
1317-36-8
14.49
50.000000
500000
4.106139
41061
Sub-total
— —
28.9800
100
1000000
8.212277
82123
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
2.88531
100.000000
1000000
0.817632
8176
Sub-total
— —
2.88531
100
1000000
0.817632
8176
Total
— —
352.886275
— —
100
1000000

Qualification summary

No results found

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (3Q2025 - 2Q2026) Sample Size Cumulative Sample Size Disposition
BIPOLAR Life test 125C, 1000 Hours or Equivalent JEDEC Condition 770 24846 Pass
Assembly process reliability data
Package Family Reliability Test Cumulative Sample Size Disposition
LCCC Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 312 Pass
LCCC High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 1333 Pass
LCCC Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 1886 Pass
LCCC Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 788 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.