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TLE2074AMFKB ACTIVE

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Rating

Military
RoHS No
REACH Affected
Device Marking 5962-, AMFKB, TLE2074, 9460206Q2A
Lead finish/Ball material SnPb
MSL rating/Peak reflow Level-NC-NC-NC

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
1.08x108 9.3 55 60 0.7 125 1000 1262 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Aluminum and Its Alloys
Aluminum
7429-90-5
0.033034
99.129756
991298
0.007028
70
Copper and Its Alloys
Copper
7440-50-8
0.000001
0.003001
30
0.000000
0
Copper and Its Alloys
Iron
7439-89-6
0.000001
0.003001
30
0.000000
0
Other Inorganic Materials
Silicon
7440-21-3
0.000287
0.861241
8612
0.000061
1
Precious Metals
Silver
7440-22-4
0.000001
0.003001
30
0.000000
0
Sub-total
— —
0.033324
100
1000000
0.007090
71
Die Attach Adhesive
Other Plastics and Rubber
Other Filler
—
0.010219
0.500000
5000
0.002174
22
Precious Metals
Silver
7440-22-4
1.635042
80.000020
800000
0.347854
3479
Thermoplastics
Epoxy
85954-11-6
0.398541
19.499981
195000
0.084789
848
Sub-total
— —
2.043802
100
1000000
0.434818
4348
Header - Ceramic
Magnesium and Its Alloys
Magnesium Oxide
1309-48-4
1.3511
0.500000
5000
0.287446
2874
Other Inorganic Materials
Aluminum Oxide
1344-28-1
244.5491
90.500000
905000
52.027680
520277
Other Inorganic Materials
Silicon Dioxide
7631-86-9
9.511744
3.520000
35200
2.023618
20236
Other Nonferrous Metals and Alloys
Calcium Oxide
1305-78-8
1.648342
0.610000
6100
0.350684
3507
Other Nonferrous Metals and Alloys
Chromium Oxide
1308-38-9
10.457514
3.870000
38700
2.224830
22248
Other Nonferrous Metals and Alloys
Titanium Dioxide
13463-67-7
2.7022
1.000000
10000
0.574891
5749
Sub-total
— —
270.220000
100
1000000
57.489149
574891
Header - Lead Frame
Other Nonferrous Metals and Alloys
Tungsten
7440-33-7
7.446
100.000000
1000000
1.584132
15841
Sub-total
— —
7.446
100
1000000
1.584132
15841
Header - Plating
Nickel and Its Alloys
Nickel
7440-02-0
2.482
36.824926
368249
0.528044
5280
Other Nonferrous Metals and Alloys
Cobalt
7440-48-4
0.438
6.498516
64985
0.093184
932
Other Nonferrous Metals and Alloys
Thallium
7440-28-0
0.000076
0.001128
11
0.000016
0
Precious Metals
Gold
7440-57-5
3.819924
56.675430
566754
0.812687
8127
Sub-total
— —
6.740000
100
1000000
1.433931
14339
Header - Routing
Other Nonferrous Metals and Alloys
Tungsten
7440-33-7
17.374
100.000000
1000000
3.696308
36963
Sub-total
— —
17.374
100
1000000
3.696308
36963
Lead Frame Plating
Other Nonferrous Metals and Alloys
Lead
7439-92-1
0.041325
36.999731
369997
0.008792
88
Other Nonferrous Metals and Alloys
Tin
7440-31-5
0.070365
63.000269
630003
0.014970
150
Sub-total
— —
0.111690
100
1000000
0.023762
238
Lid
Aluminum and Its Alloys
Aluminum
7429-90-5
0.01083
0.008000
80
0.002304
23
Copper and Its Alloys
Copper
7440-50-8
0.13537
0.099997
1000
0.028800
288
Copper and Its Alloys
Iron
7439-89-6
72.274043
53.388398
533884
15.376261
153763
Magnesium and Its Alloys
Magnesium
7439-95-4
0.351962
0.259992
2600
0.074880
749
Nickel and Its Alloys
Nickel
7440-02-0
40.231964
29.719108
297191
8.559327
85593
Other Inorganic Materials
Silicon
7440-21-3
0.001354
0.001000
10
0.000288
3
Other Nonferrous Metals and Alloys
Chromium
7440-47-3
0.013537
0.010000
100
0.002880
29
Other Nonferrous Metals and Alloys
Cobalt
7440-48-4
22.322513
16.489505
164895
4.749102
47491
Other Nonferrous Metals and Alloys
Manganese
7439-96-5
0.001354
0.001000
10
0.000288
3
Other Nonferrous Metals and Alloys
Molybdenum
7439-98-7
0.013537
0.010000
100
0.002880
29
Other Nonferrous Metals and Alloys
Titanium
7440-32-6
0.002707
0.002000
20
0.000576
6
Other Nonferrous Metals and Alloys
Zirconium
7440-67-7
0.013537
0.010000
100
0.002880
29
Other Plastics and Rubber
Carbon
7440-44-0
0.001354
0.001000
10
0.000288
3
Sub-total
— —
135.374062
100
1000000
28.800753
288008
Lid - Plating
Nickel and Its Alloys
Nickel
7440-02-0
5.87136
48.000000
480000
1.249128
12491
Precious Metals
Gold
7440-57-5
6.36064
52.000000
520000
1.353222
13532
Sub-total
— —
12.23200
100
1000000
2.602351
26024
Lid - Seal
Other Nonferrous Metals and Alloys
Tin
7440-31-5
2.426
20.000000
200000
0.516130
5161
Precious Metals
Gold
7440-57-5
9.704
80.000000
800000
2.064520
20645
Sub-total
— —
12.130
100
1000000
2.580650
25807
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
6.331652
100.000000
1000000
1.347055
13471
Sub-total
— —
6.331652
100
1000000
1.347055
13471
Total
— —
470.036530
— —
100
1000000

Qualification summary

No results found

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (3Q2025 - 2Q2026) Sample Size Cumulative Sample Size Disposition
BIPOLAR Life test 125C, 1000 Hours or Equivalent JEDEC Condition 770 24846 Pass
Assembly process reliability data
Package Family Reliability Test Cumulative Sample Size Disposition
LCCC Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 312 Pass
LCCC High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 1333 Pass
LCCC Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 1886 Pass
LCCC Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 788 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.