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Quality, reliability & packaging data download

TLE2142ACDR ACTIVE

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Rating

Catalog
RoHS Yes
RoHS Yes
REACH Yes
REACH Yes
Device Marking 2142AC
Lead finish/Ball material NiPdAu
Lead finish/Ball material NiPdAu
MSL rating/Peak reflow Level-1-260C-UNLIM
MSL rating/Peak reflow Level-1-260C-UNLIM

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
1.25x108 8.0 55 60 0.7 125 1000 1463 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.032946
99.996965
999970
0.043193
432
Precious Metals
Silver
7440-22-4
0.000001
0.003035
30
0.000001
0
Sub-total
— —
0.032947
100
1000000
0.043194
432
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.706063
79.999977
800000
0.925661
9257
Thermoplastics
Epoxy
85954-11-6
0.176516
20.000023
200000
0.231416
2314
Sub-total
— —
0.882579
100
1000000
1.157077
11571
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
13.80808
97.240000
972400
18.102639
181026
Copper and Its Alloys
Iron
7439-89-6
0.3692
2.600000
26000
0.484028
4840
Copper and Its Alloys
Phosphorus
7723-14-0
0.0213
0.150000
1500
0.027925
279
Other Nonferrous Metals and Alloys
Lead
7439-92-1
0.00142
0.010000
100
0.001862
19
Sub-total
— —
14.20000
100
1000000
18.616453
186165
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
0.13507
95.119718
951197
0.177079
1771
Precious Metals
Gold
7440-57-5
0.001108
0.780282
7803
0.001453
15
Precious Metals
Palladium
7440-05-3
0.005822
4.100000
41000
0.007633
76
Sub-total
— —
0.142000
100
1000000
0.186165
1862
Mold Compound
Not Categorized
Phenolic Resin
9003-35-4
2.034569
3.500001
35000
2.667356
26674
Other Inorganic Materials
Fused Silica
60676-86-0
49.701606
85.499999
855000
65.159690
651597
Other Organic Materials
Carbon Black
1333-86-4
0.290653
0.500001
5000
0.381051
3811
Thermoplastics
Epoxy
85954-11-6
6.103706
10.500000
105000
8.002067
80021
Sub-total
— —
58.130534
100
1000000
76.210165
762102
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
2.888555
100.000000
1000000
3.786947
37869
Sub-total
— —
2.888555
100
1000000
3.786947
37869
Total
— —
76.276615
— —
100
1000000
Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.026862
97.534585
975346
0.035981
360
Not Categorized
Proprietary Materials
—
0.000003
0.010893
109
0.000004
0
Precious Metals
Gold
7440-57-5
0.000014
0.050833
508
0.000019
0
Precious Metals
Palladium
7440-05-3
0.000661
2.400058
24001
0.000885
9
Precious Metals
Silver
7440-22-4
0.000001
0.003631
36
0.000001
0
Sub-total
— —
0.027541
100
1000000
0.036891
369
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.174984
80.000000
800000
0.234389
2344
Thermoplastics
Epoxy
85954-11-6
0.043746
20.000000
200000
0.058597
586
Sub-total
— —
0.218730
100
1000000
0.292986
2930
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
12.8106
97.050000
970500
17.159622
171596
Copper and Its Alloys
Iron
7439-89-6
0.3432
2.600000
26000
0.459712
4597
Copper and Its Alloys
Phosphorus
7723-14-0
0.0198
0.150000
1500
0.026522
265
Zinc and Its Alloys
Zinc
7440-66-6
0.0264
0.200000
2000
0.035362
354
Sub-total
— —
13.2000
100
1000000
17.681218
176812
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
0.09512
95.120000
951200
0.127412
1274
Precious Metals
Gold
7440-57-5
0.00078
0.780000
7800
0.001045
10
Precious Metals
Palladium
7440-05-3
0.0041
4.100000
41000
0.005492
55
Sub-total
— —
0.10000
100
1000000
0.133949
1339
Mold Compound
Not Categorized
Phenolic Resin
9003-35-4
2.120899
3.500000
35000
2.840915
28409
Other Inorganic Materials
Fused Silica
60676-86-0
51.810536
85.500000
855000
69.399498
693995
Other Organic Materials
Carbon Black
1333-86-4
0.302986
0.500001
5000
0.405846
4058
Thermoplastics
Epoxy
85954-11-6
6.362697
10.499999
105000
8.522745
85227
Sub-total
— —
60.597118
100
1000000
81.169003
811690
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
0.512102
100.000000
1000000
0.685954
6860
Sub-total
— —
0.512102
100
1000000
0.685954
6860
Total
— —
74.655491
— —
100
1000000

Qualification summary

Stress Reference Min lot qty SS / lot Condition Duration Result Notes
HTOL JESD22-A108 3 77 Life test, 125C 1000 hours Pass Or equivalent JEDEC condition
HTSL JESD22-A103 3 25 High temp storage bake, 150C 1000 hours Pass Or equivalent JEDEC condition
AC/UHAST JESD22-A102/JESD22-A118 3 25 Unbiased HAST 130C / 85% RH 96 hours Pass Or equivalent JEDEC condition
THB/HAST JESD22-A101/JESD22-A110 3 25 HAST 130C/85%RH 96 hours Pass Or equivalent JEDEC condition
TC JESD22-A104 3 25 Temperature cycle -65/150C 500 cycles Pass Or equivalent JEDEC condition
SD J-STD-002 3 22 Per specification >95% lead coverage Pass —
HBM JS-001 1 3 ESD - HBM Classification See data sheet —
CDM JS-002 1 3 ESD - CDM Classification See data sheet —
LU JESD78 1 3 Latch-up Per JESD78 Pass As applicable per JESD78
MSL J-STD-020 — — Per J-STD-020 Classification See data sheet —

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (3Q2025 - 2Q2026) Sample Size Cumulative Sample Size Disposition
BIPOLAR Life test 125C, 1000 Hours or Equivalent JEDEC Condition 770 24846 Pass
Assembly process reliability data
Package Family Reliability Test Rolling Year (3Q2025 - 2Q2026) Sample Size Cumulative Sample Size Disposition
SOIC Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 4522 84940 Pass
SOIC High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 3452 73518 Pass
SOIC Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 10913 189105 Pass
SOIC Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 6930 138759 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.