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Quality, reliability & packaging data download

TLE2425CD ACTIVE

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Rating

Automotive, Catalog
RoHS Yes
REACH Yes
Device Marking 2425C
Lead finish/Ball material NiPdAu
MSL rating/Peak reflow Level-1-260C-UNLIM

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
1.08x108 9.3 55 60 0.7 125 1000 1262 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.049863
99.997995
999980
0.051368
514
Precious Metals
Silver
7440-22-4
0.000001
0.002005
20
0.000001
0
Sub-total
— —
0.049864
100
1000000
0.051369
514
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.65706
80.000000
800000
0.676891
6769
Thermoplastics
Epoxy
85954-11-6
0.164265
20.000000
200000
0.169223
1692
Sub-total
— —
0.821325
100
1000000
0.846114
8461
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
33.9675
97.050000
970500
34.992713
349927
Copper and Its Alloys
Iron
7439-89-6
0.91
2.600000
26000
0.937466
9375
Copper and Its Alloys
Phosphorus
7723-14-0
0.0525
0.150000
1500
0.054085
541
Zinc and Its Alloys
Zinc
7440-66-6
0.07
0.200000
2000
0.072113
721
Sub-total
— —
35.0000
100
1000000
36.056376
360564
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
0.09512
95.120000
951200
0.097991
980
Precious Metals
Gold
7440-57-5
0.00078
0.780000
7800
0.000804
8
Precious Metals
Palladium
7440-05-3
0.0041
4.100000
41000
0.004224
42
Sub-total
— —
0.10000
100
1000000
0.103018
1030
Mold Compound
Not Categorized
Phenolic Resin
9003-35-4
2.044489
3.500000
35000
2.106196
21062
Other Inorganic Materials
Fused Silica
60676-86-0
49.943939
85.500000
855000
51.451355
514514
Other Organic Materials
Carbon Black
1333-86-4
0.29207
0.500000
5000
0.300885
3009
Thermoplastics
Epoxy
85954-11-6
6.133466
10.500000
105000
6.318587
63186
Sub-total
— —
58.413964
100
1000000
60.177024
601770
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
2.685058
100.000000
1000000
2.766099
27661
Sub-total
— —
2.685058
100
1000000
2.766099
27661
Total
— —
97.070211
— —
100
1000000

Qualification summary

Stress Reference Min lot qty SS / lot Condition Duration Result Notes
HTOL JESD22-A108 3 77 Life test, 125C 1000 hours Pass Or equivalent JEDEC condition
HTSL JESD22-A103 3 25 High temp storage bake, 150C 1000 hours Pass Or equivalent JEDEC condition
AC/UHAST JESD22-A102/JESD22-A118 3 25 Unbiased HAST 130C / 85% RH 96 hours Pass Or equivalent JEDEC condition
THB/HAST JESD22-A101/JESD22-A110 3 25 HAST 130C/85%RH 96 hours Pass Or equivalent JEDEC condition
TC JESD22-A104 3 25 Temperature cycle -65/150C 500 cycles Pass Or equivalent JEDEC condition
SD J-STD-002 3 22 Per specification >95% lead coverage Pass —
HBM JS-001 1 3 ESD - HBM Classification See data sheet —
CDM JS-002 1 3 ESD - CDM Classification See data sheet —
LU JESD78 1 3 Latch-up Per JESD78 Pass As applicable per JESD78
MSL J-STD-020 — — Per J-STD-020 Classification See data sheet —

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
BIPOLAR Life test 125C, 1000 Hours or Equivalent JEDEC Condition 693 24846 Pass
Assembly process reliability data
Package Family Reliability Test Rolling Year (4Q2025 - 3Q2026) Sample Size Cumulative Sample Size Disposition
SOIC Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 5061 85479 Pass
SOIC High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 5627 74925 Pass
SOIC Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 13223 189952 Pass
SOIC Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 7777 139298 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.