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Quality, reliability & packaging data download

TLV117118DCYR ACTIVE

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Quality data will change based on assembly site

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Rating

Catalog
RoHS Yes
REACH Yes
Device Marking WF
Lead finish/Ball material Sn
MSL rating/Peak reflow Level-1-260C-UNLIM

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
1x1010 0.1 55 60 0.7 125 1000 183306 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.067471
97.388857
973889
0.061733
617
Precious Metals
Gold
7440-57-5
0.000148
0.213626
2136
0.000135
1
Precious Metals
Palladium
7440-05-3
0.001661
2.397517
23975
0.001520
15
Sub-total
— —
0.069280
100
1000000
0.063388
634
Die Attach Adhesive
Other Inorganic Materials
Aluminum Oxide
1344-28-1
0.015593
30.000385
300004
0.014267
143
Other Inorganic Materials
Silica
7631-86-9
0.002339
4.500154
45002
0.002140
21
Other Organic Materials
Chlorine
7782-50-5
0.000018
0.034631
346
0.000016
0
Thermoplastics
Epoxy
85954-11-6
0.034026
65.464830
654648
0.031132
311
Sub-total
— —
0.051976
100
1000000
0.047556
476
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
38.780125
97.437500
974375
35.482067
354821
Copper and Its Alloys
Iron
7439-89-6
0.9353
2.350000
23500
0.855757
8558
Copper and Its Alloys
Phosphorus
7723-14-0
0.032835
0.082500
825
0.030043
300
Other Nonferrous Metals and Alloys
Lead
7439-92-1
0.00199
0.005000
50
0.001821
18
Zinc and Its Alloys
Zinc
7440-66-6
0.04975
0.125000
1250
0.045519
455
Sub-total
— —
39.800000
100
1000000
36.415207
364152
Lead Frame Plating
Other Nonferrous Metals and Alloys
Tin
7440-31-5
0.004
100.000000
1000000
0.003660
37
Sub-total
— —
0.004
100
1000000
0.003660
37
Mold Compound
Not Categorized
Phenolic Resin
9003-35-4
3.44635
5.000001
50000
3.153255
31533
Other Inorganic Materials
Silica
7631-86-9
59.863093
86.850001
868500
54.772033
547720
Other Organic Materials
Carbon Black
1333-86-4
0.10339
0.149999
1500
0.094597
946
Thermoplastics
Epoxy
85954-11-6
5.514159
7.999999
80000
5.045207
50452
Sub-total
— —
68.926992
100
1000000
63.065092
630651
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
0.442752
100.000000
1000000
0.405098
4051
Sub-total
— —
0.442752
100
1000000
0.405098
4051
Total
— —
109.295000
— —
100
1000000

Qualification summary

Stress Reference Min lot qty SS / lot Condition Duration Result Notes
HTOL JESD22-A108 3 77 Life test, 125C 1000 hours Pass Or equivalent JEDEC condition
HTSL JESD22-A103 3 25 High temp storage bake, 150C 1000 hours Pass Or equivalent JEDEC condition
AC/UHAST JESD22-A102/JESD22-A118 3 25 Unbiased HAST 130C / 85% RH 96 hours Pass Or equivalent JEDEC condition
THB/HAST JESD22-A101/JESD22-A110 3 25 HAST 130C/85%RH 96 hours Pass Or equivalent JEDEC condition
TC JESD22-A104 3 25 Temperature cycle -65/150C 500 cycles Pass Or equivalent JEDEC condition
SD J-STD-002 3 22 Per specification >95% lead coverage Pass —
HBM JS-001 1 3 ESD - HBM Classification See data sheet —
CDM JS-002 1 3 ESD - CDM Classification See data sheet —
LU JESD78 1 3 Latch-up Per JESD78 Pass As applicable per JESD78
MSL J-STD-020 — — Per J-STD-020 Classification See data sheet —

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (3Q2025 - 2Q2026) Sample Size Cumulative Sample Size Disposition
Power BICMOS High temperature gate bias 150C, 1000 Hours or Equivalent JEDEC Condition 924 924 Pass
Power BICMOS High temperature reverse bias 125C, 1000 Hours or Equivalent JEDEC Condition 1386 1386 Pass
Power BICMOS Life test 125C, 1000 Hours or Equivalent JEDEC Condition 28776 456997 Pass
Assembly process reliability data
Package Family Reliability Test Rolling Year (3Q2025 - 2Q2026) Sample Size Cumulative Sample Size Disposition
SOP/SOT Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 6997 118051 Pass
SOP/SOT High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 5697 91846 Pass
SOP/SOT Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 14164 219521 Pass
SOP/SOT Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 9936 175701 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.