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Quality, reliability & packaging data download

TLV6001UIDBVT ACTIVE

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Rating

Catalog
RoHS Yes
RoHS Yes
RoHS Yes
REACH Yes
REACH Yes
REACH Yes
Device Marking 16P2
Lead finish/Ball material NiPdAu
Lead finish/Ball material Sn
Lead finish/Ball material Sn
MSL rating/Peak reflow Level-1-260C-UNLIM
MSL rating/Peak reflow Level-1-260C-UNLIM
MSL rating/Peak reflow Level-1-260C-UNLIM

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
8.71x109 0.1 55 60 0.7 125 1000 101758 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.013154
96.543119
965431
0.073725
737
Not Categorized
Proprietary Materials
—
0.000002
0.014679
147
0.000011
0
Precious Metals
Gold
7440-57-5
0.00008
0.587156
5872
0.000448
4
Precious Metals
Palladium
7440-05-3
0.000389
2.855046
28550
0.002180
22
Sub-total
— —
0.013625
100
1000000
0.076365
764
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.027735
75.000000
750000
0.155449
1554
Thermoplastics
Epoxy
85954-11-6
0.009245
25.000000
250000
0.051816
518
Sub-total
— —
0.036980
100
1000000
0.207265
2073
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
5.31834
97.050000
970500
29.808142
298081
Copper and Its Alloys
Iron
7439-89-6
0.14248
2.600000
26000
0.798569
7986
Copper and Its Alloys
Phosphorus
7723-14-0
0.00822
0.150000
1500
0.046071
461
Zinc and Its Alloys
Zinc
7440-66-6
0.01096
0.200000
2000
0.061428
614
Sub-total
— —
5.48000
100
1000000
30.714211
307142
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
0.038048
95.120000
951200
0.213251
2133
Precious Metals
Gold
7440-57-5
0.000312
0.780000
7800
0.001749
17
Precious Metals
Palladium
7440-05-3
0.00164
4.100000
41000
0.009192
92
Sub-total
— —
0.040000
100
1000000
0.224191
2242
Mold Compound
Other Inorganic Materials
Fused Silica
60676-86-0
10.721815
87.999998
880000
60.093446
600934
Other Organic Materials
Carbon Black
1333-86-4
0.036552
0.300003
3000
0.204866
2049
Other Organic Materials
Chlorine
7782-50-5
0.000122
0.001001
10
0.000684
7
Thermoplastics
Epoxy
85954-11-6
1.425392
11.698998
116990
7.989013
79890
Sub-total
— —
12.183881
100
1000000
68.288009
682880
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
0.087418
100.000000
1000000
0.489959
4900
Sub-total
— —
0.087418
100
1000000
0.489959
4900
Total
— —
17.841904
— —
100
1000000
Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.013154
96.543119
965431
0.072232
722
Not Categorized
Proprietary Materials
—
0.000002
0.014679
147
0.000011
0
Precious Metals
Gold
7440-57-5
0.00008
0.587156
5872
0.000439
4
Precious Metals
Palladium
7440-05-3
0.000389
2.855046
28550
0.002136
21
Sub-total
— —
0.013625
100
1000000
0.074818
748
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.027735
75.000000
750000
0.152300
1523
Thermoplastics
Epoxy
85954-11-6
0.009245
25.000000
250000
0.050767
508
Sub-total
— —
0.036980
100
1000000
0.203066
2031
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
5.301681
96.745986
967460
29.112798
291128
Copper and Its Alloys
Iron
7439-89-6
0.12604
2.300000
23000
0.692116
6921
Copper and Its Alloys
Phosphorus
7723-14-0
0.001699
0.031004
310
0.009330
93
Other Nonferrous Metals and Alloys
Lead
7439-92-1
0.000055
0.001004
10
0.000302
3
Precious Metals
Silver
7440-22-4
0.04384
0.800000
8000
0.240736
2407
Zinc and Its Alloys
Zinc
7440-66-6
0.006686
0.122007
1220
0.036714
367
Sub-total
— —
5.480001
100
1000000
30.091996
300920
Lead Frame Plating
Other Nonferrous Metals and Alloys
Tin
7440-31-5
0.412
100.000000
1000000
2.262391
22624
Sub-total
— —
0.412
100
1000000
2.262391
22624
Mold Compound
Other Inorganic Materials
Fused Silica
60676-86-0
10.738281
88.000000
880000
58.966469
589665
Other Organic Materials
Carbon Black
1333-86-4
0.036608
0.300002
3000
0.201023
2010
Other Organic Materials
Chlorine
7782-50-5
0.000122
0.001000
10
0.000670
7
Thermoplastics
Epoxy
85954-11-6
1.427581
11.698998
116990
7.839189
78392
Sub-total
— —
12.202592
100
1000000
67.007350
670074
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
0.065628
100.000000
1000000
0.360379
3604
Sub-total
— —
0.065628
100
1000000
0.360379
3604
Total
— —
18.210826
— —
100
1000000
Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.013998
97.540241
975402
0.078422
784
Not Categorized
Proprietary Materials
—
0.000002
0.013936
139
0.000011
0
Precious Metals
Gold
7440-57-5
0.000007
0.048777
488
0.000039
0
Precious Metals
Palladium
7440-05-3
0.000344
2.397046
23970
0.001927
19
Sub-total
— —
0.014351
100
1000000
0.080400
804
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.029584
80.000000
800000
0.165741
1657
Thermoplastics
Epoxy
85954-11-6
0.007396
20.000000
200000
0.041435
414
Sub-total
— —
0.036980
100
1000000
0.207176
2072
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
5.31834
97.050000
970500
29.795410
297954
Copper and Its Alloys
Iron
7439-89-6
0.14248
2.600000
26000
0.798228
7982
Copper and Its Alloys
Phosphorus
7723-14-0
0.00822
0.150000
1500
0.046052
461
Zinc and Its Alloys
Zinc
7440-66-6
0.01096
0.200000
2000
0.061402
614
Sub-total
— —
5.48000
100
1000000
30.701092
307011
Lead Frame Plating
Other Nonferrous Metals and Alloys
Tin
7440-31-5
0.05
100.000000
1000000
0.280119
2801
Sub-total
— —
0.05
100
1000000
0.280119
2801
Mold Compound
Other Inorganic Materials
Fused Silica
60676-86-0
10.738412
87.999999
880000
60.160762
601608
Other Organic Materials
Carbon Black
1333-86-4
0.036608
0.299998
3000
0.205092
2051
Other Organic Materials
Chlorine
7782-50-5
0.000122
0.001000
10
0.000683
7
Thermoplastics
Epoxy
85954-11-6
1.427599
11.699003
116990
7.997965
79980
Sub-total
— —
12.202741
100
1000000
68.364502
683645
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
0.065456
100.000000
1000000
0.366710
3667
Sub-total
— —
0.065456
100
1000000
0.366710
3667
Total
— —
17.849528
— —
100
1000000

Qualification summary

Stress Reference Min lot qty SS / lot Condition Duration Result Notes
HTOL JESD22-A108 3 77 Life test, 125C 1000 hours Pass Or equivalent JEDEC condition
HTSL JESD22-A103 3 25 High temp storage bake, 150C 1000 hours Pass Or equivalent JEDEC condition
AC/UHAST JESD22-A102/JESD22-A118 3 25 Unbiased HAST 130C / 85% RH 96 hours Pass Or equivalent JEDEC condition
THB/HAST JESD22-A101/JESD22-A110 3 25 HAST 130C/85%RH 96 hours Pass Or equivalent JEDEC condition
TC JESD22-A104 3 25 Temperature cycle -65/150C 500 cycles Pass Or equivalent JEDEC condition
SD J-STD-002 3 22 Per specification >95% lead coverage Pass —
HBM JS-001 1 3 ESD - HBM Classification See data sheet —
CDM JS-002 1 3 ESD - CDM Classification See data sheet —
LU JESD78 1 3 Latch-up Per JESD78 Pass As applicable per JESD78
MSL J-STD-020 — — Per J-STD-020 Classification See data sheet —

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (2Q2025 - 1Q2026) Sample Size Cumulative Sample Size Disposition
Power BICMOS High temperature reverse bias 125C, 1000 Hours or Equivalent JEDEC Condition 462 462 Pass
Power BICMOS Life test 125C, 1000 Hours or Equivalent JEDEC Condition 26863 447408 Pass
Assembly process reliability data
Package Family Reliability Test Rolling Year (2Q2025 - 1Q2026) Sample Size Cumulative Sample Size Disposition
SOP/SOT Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 8070 116121 Pass
SOP/SOT High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 6141 91401 Pass
SOP/SOT Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 18991 217285 Pass
SOP/SOT Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 11781 174463 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.