Home  >  Quality & reliability  >  Quality, reliability & packaging data download

Quality, reliability & packaging data download

TLV70233DBVT ACTIVE

By using this tool to “search” or “download”, you agree to TI’s terms of use, privacy policy (including cookie policy), and important notice.

Search more parts

Filter between the data types to view or download

Quality data will change based on assembly site

Download .xls Download PDF

Rating

Catalog
RoHS Yes
RoHS Yes
RoHS Yes
REACH Yes
REACH Yes
REACH Yes
Device Marking QVD
Lead finish/Ball material NiPdAu
Lead finish/Ball material NiPdAu
Lead finish/Ball material NiPdAu
MSL rating/Peak reflow Level-1-260C-UNLIM
MSL rating/Peak reflow Level-1-260C-UNLIM
MSL rating/Peak reflow Level-1-260C-UNLIM

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
1x1010 0.1 55 60 0.7 125 1000 183306 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Not Categorized
Proprietary Materials
—
0.000002
0.004336
43
0.000011
0
Precious Metals
Gold
7440-57-5
0.046124
99.995664
999957
0.253502
2535
Sub-total
— —
0.046126
100
1000000
0.253513
2535
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.064754
73.000090
730001
0.355894
3559
Thermoplastics
Epoxy
85954-11-6
0.02395
26.999910
269999
0.131632
1316
Sub-total
— —
0.088704
100
1000000
0.487526
4875
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
6.305
97.000000
970000
34.652895
346529
Copper and Its Alloys
Iron
7439-89-6
0.156
2.400000
24000
0.857391
8574
Copper and Its Alloys
Phosphorus
7723-14-0
0.000975
0.015000
150
0.005359
54
Other Nonferrous Metals and Alloys
Lead
7439-92-1
0.00065
0.010000
100
0.003572
36
Zinc and Its Alloys
Zinc
7440-66-6
0.037375
0.575000
5750
0.205417
2054
Sub-total
— —
6.500000
100
1000000
35.724634
357246
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
0.123656
95.120000
951200
0.679625
6796
Precious Metals
Gold
7440-57-5
0.001014
0.780000
7800
0.005573
56
Precious Metals
Palladium
7440-05-3
0.00533
4.100000
41000
0.029294
293
Sub-total
— —
0.130000
100
1000000
0.714493
7145
Mold Compound
Other Inorganic Materials
Fused Silica
60676-86-0
9.553645
84.999995
850000
52.507765
525078
Other Organic Materials
Carbon Black
1333-86-4
0.033719
0.300002
3000
0.185323
1853
Thermoplastics
Epoxy
85954-11-6
1.652219
14.700003
147000
9.080757
90808
Sub-total
— —
11.239583
100
1000000
61.773845
617738
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
0.190315
100.000000
1000000
1.045990
10460
Sub-total
— —
0.190315
100
1000000
1.045990
10460
Total
— —
18.194728
— —
100
1000000
Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Precious Metals
Gold
7440-57-5
0.045745
100.000000
1000000
0.250215
2502
Sub-total
— —
0.045745
100
1000000
0.250215
2502
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.088166
79.999637
799996
0.482248
4822
Thermoplastics
Epoxy
85954-11-6
0.022042
20.000363
200004
0.120565
1206
Sub-total
— —
0.110208
100
1000000
0.602813
6028
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
6.292686
97.410000
974100
34.419595
344196
Copper and Its Alloys
Iron
7439-89-6
0.153748
2.380000
23800
0.840967
8410
Copper and Its Alloys
Phosphorus
7723-14-0
0.005426
0.083994
840
0.029679
297
Zinc and Its Alloys
Zinc
7440-66-6
0.00814
0.126006
1260
0.044524
445
Sub-total
— —
6.460000
100
1000000
35.334765
353348
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
0.110339
95.119828
951198
0.603530
6035
Precious Metals
Gold
7440-57-5
0.000905
0.780172
7802
0.004950
50
Precious Metals
Palladium
7440-05-3
0.004756
4.100000
41000
0.026014
260
Sub-total
— —
0.116000
100
1000000
0.634494
6345
Mold Compound
Other Inorganic Materials
Fused Silica
60676-86-0
9.727615
86.000002
860000
53.207893
532079
Other Organic Materials
Carbon Black
1333-86-4
0.056556
0.500001
5000
0.309349
3093
Thermoplastics
Epoxy
85954-11-6
1.527009
13.499997
135000
8.352400
83524
Sub-total
— —
11.311180
100
1000000
61.869642
618696
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
0.239145
100.000000
1000000
1.308070
13081
Sub-total
— —
0.239145
100
1000000
1.308070
13081
Total
— —
18.282278
— —
100
1000000
Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.020583
96.665571
966656
0.114903
1149
Precious Metals
Gold
7440-57-5
0.000116
0.544780
5448
0.000648
6
Precious Metals
Palladium
7440-05-3
0.000594
2.789649
27896
0.003316
33
Sub-total
— —
0.021293
100
1000000
0.118866
1189
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.08064
75.000000
750000
0.450166
4502
Thermoplastics
Epoxy
85954-11-6
0.02688
25.000000
250000
0.150055
1501
Sub-total
— —
0.10752
100
1000000
0.600221
6002
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
5.334588
97.346496
973465
29.779879
297799
Copper and Its Alloys
Iron
7439-89-6
0.133767
2.441004
24410
0.746743
7467
Copper and Its Alloys
Phosphorus
7723-14-0
0.004521
0.082500
825
0.025238
252
Zinc and Its Alloys
Zinc
7440-66-6
0.007124
0.130000
1300
0.039769
398
Sub-total
— —
5.480000
100
1000000
30.591629
305916
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
0.042804
95.120000
951200
0.238950
2389
Precious Metals
Gold
7440-57-5
0.000351
0.780000
7800
0.001959
20
Precious Metals
Palladium
7440-05-3
0.001845
4.100000
41000
0.010300
103
Sub-total
— —
0.045000
100
1000000
0.251209
2512
Mold Compound
Other Inorganic Materials
Fused Silica
60676-86-0
10.564765
88.000006
880000
58.976893
589769
Other Organic Materials
Carbon Black
1333-86-4
0.036016
0.299998
3000
0.201056
2011
Other Organic Materials
Chlorine
7782-50-5
0.00012
0.001000
10
0.000670
7
Thermoplastics
Epoxy
85954-11-6
1.404513
11.698997
116990
7.840573
78406
Sub-total
— —
12.005414
100
1000000
67.019192
670192
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
0.25417
100.000000
1000000
1.418882
14189
Sub-total
— —
0.25417
100
1000000
1.418882
14189
Total
— —
17.913397
— —
100
1000000

Qualification summary

Stress Reference Min lot qty SS / lot Condition Duration Result Notes
HTOL JESD22-A108 3 77 Life test, 125C 1000 hours Pass Or equivalent JEDEC condition
HTSL JESD22-A103 3 25 High temp storage bake, 150C 1000 hours Pass Or equivalent JEDEC condition
AC/UHAST JESD22-A102/JESD22-A118 3 25 Unbiased HAST 130C / 85% RH 96 hours Pass Or equivalent JEDEC condition
THB/HAST JESD22-A101/JESD22-A110 3 25 HAST 130C/85%RH 96 hours Pass Or equivalent JEDEC condition
TC JESD22-A104 3 25 Temperature cycle -65/150C 500 cycles Pass Or equivalent JEDEC condition
SD J-STD-002 3 22 Per specification >95% lead coverage Pass —
HBM JS-001 1 3 ESD - HBM Classification See data sheet —
CDM JS-002 1 3 ESD - CDM Classification See data sheet —
LU JESD78 1 3 Latch-up Per JESD78 Pass As applicable per JESD78
MSL J-STD-020 — — Per J-STD-020 Classification See data sheet —

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (3Q2025 - 2Q2026) Sample Size Cumulative Sample Size Disposition
Power BICMOS High temperature gate bias 150C, 1000 Hours or Equivalent JEDEC Condition 924 924 Pass
Power BICMOS High temperature reverse bias 125C, 1000 Hours or Equivalent JEDEC Condition 1386 1386 Pass
Power BICMOS Life test 125C, 1000 Hours or Equivalent JEDEC Condition 28776 456227 Pass
Assembly process reliability data
Package Family Reliability Test Rolling Year (3Q2025 - 2Q2026) Sample Size Cumulative Sample Size Disposition
SOP/SOT Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 6997 117358 Pass
SOP/SOT High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 5697 91801 Pass
SOP/SOT Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 14164 218982 Pass
SOP/SOT Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 9936 175624 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

Close

Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.