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Quality, reliability & packaging data download

TLV9041UIDBVR ACTIVE

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Rating

Catalog
RoHS Yes
RoHS Yes
REACH Yes
REACH Yes
Device Marking U041
Lead finish/Ball material NiPdAu
Lead finish/Ball material Sn
MSL rating/Peak reflow Level-1-260C-UNLIM
MSL rating/Peak reflow Level-1-260C-UNLIM

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
8.71x109 0.1 55 60 0.7 125 1000 101758 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.01519
97.584479
975845
0.085144
851
Not Categorized
Proprietary Materials
—
0.000002
0.012849
128
0.000011
0
Precious Metals
Palladium
7440-05-3
0.000374
2.402672
24027
0.002096
21
Sub-total
— —
0.015566
100
1000000
0.087252
873
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.0252
75.000000
750000
0.141253
1413
Thermoplastics
Epoxy
85954-11-6
0.0084
25.000000
250000
0.047084
471
Sub-total
— —
0.0336
100
1000000
0.188337
1883
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
5.31834
97.050000
970500
29.810763
298108
Copper and Its Alloys
Iron
7439-89-6
0.14248
2.600000
26000
0.798640
7986
Copper and Its Alloys
Phosphorus
7723-14-0
0.00822
0.150000
1500
0.046075
461
Zinc and Its Alloys
Zinc
7440-66-6
0.01096
0.200000
2000
0.061434
614
Sub-total
— —
5.48000
100
1000000
30.716912
307169
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
0.038048
95.120000
951200
0.213270
2133
Precious Metals
Gold
7440-57-5
0.000312
0.780000
7800
0.001749
17
Precious Metals
Palladium
7440-05-3
0.00164
4.100000
41000
0.009193
92
Sub-total
— —
0.040000
100
1000000
0.224211
2242
Mold Compound
Other Inorganic Materials
Fused Silica
60676-86-0
10.733036
87.999999
880000
60.161628
601616
Other Organic Materials
Carbon Black
1333-86-4
0.03659
0.300001
3000
0.205097
2051
Other Organic Materials
Chlorine
7782-50-5
0.000122
0.001000
10
0.000684
7
Thermoplastics
Epoxy
85954-11-6
1.426884
11.699000
116990
7.998079
79981
Sub-total
— —
12.196632
100
1000000
68.365488
683655
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
0.074537
100.000000
1000000
0.417800
4178
Sub-total
— —
0.074537
100
1000000
0.417800
4178
Total
— —
17.840335
— —
100
1000000
Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.01519
97.584479
975845
0.083415
834
Not Categorized
Proprietary Materials
—
0.000002
0.012849
128
0.000011
0
Precious Metals
Palladium
7440-05-3
0.000374
2.402672
24027
0.002054
21
Sub-total
— —
0.015566
100
1000000
0.085479
855
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.0252
75.000000
750000
0.138384
1384
Thermoplastics
Epoxy
85954-11-6
0.0084
25.000000
250000
0.046128
461
Sub-total
— —
0.0336
100
1000000
0.184512
1845
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
5.301681
96.745986
967460
29.113749
291137
Copper and Its Alloys
Iron
7439-89-6
0.12604
2.300000
23000
0.692138
6921
Copper and Its Alloys
Phosphorus
7723-14-0
0.001699
0.031004
310
0.009330
93
Other Nonferrous Metals and Alloys
Lead
7439-92-1
0.000055
0.001004
10
0.000302
3
Precious Metals
Silver
7440-22-4
0.04384
0.800000
8000
0.240744
2407
Zinc and Its Alloys
Zinc
7440-66-6
0.006686
0.122007
1220
0.036716
367
Sub-total
— —
5.480001
100
1000000
30.092979
300930
Lead Frame Plating
Other Nonferrous Metals and Alloys
Tin
7440-31-5
0.412
100.000000
1000000
2.262464
22625
Sub-total
— —
0.412
100
1000000
2.262464
22625
Mold Compound
Other Inorganic Materials
Fused Silica
60676-86-0
10.744302
88.000001
880000
59.001459
590015
Other Organic Materials
Carbon Black
1333-86-4
0.036628
0.299998
3000
0.201140
2011
Other Organic Materials
Chlorine
7782-50-5
0.000122
0.000999
10
0.000670
7
Thermoplastics
Epoxy
85954-11-6
1.428382
11.699003
116990
7.843843
78438
Sub-total
— —
12.209434
100
1000000
67.047112
670471
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
0.05963
100.000000
1000000
0.327453
3275
Sub-total
— —
0.05963
100
1000000
0.327453
3275
Total
— —
18.210231
— —
100
1000000

Qualification summary

Stress Reference Min lot qty SS / lot Condition Duration Result Notes
HTOL JESD22-A108 3 77 Life test, 125C 1000 hours Pass Or equivalent JEDEC condition
HTSL JESD22-A103 3 25 High temp storage bake, 150C 1000 hours Pass Or equivalent JEDEC condition
AC/UHAST JESD22-A102/JESD22-A118 3 25 Unbiased HAST 130C / 85% RH 96 hours Pass Or equivalent JEDEC condition
THB/HAST JESD22-A101/JESD22-A110 3 25 HAST 130C/85%RH 96 hours Pass Or equivalent JEDEC condition
TC JESD22-A104 3 25 Temperature cycle -65/150C 500 cycles Pass Or equivalent JEDEC condition
SD J-STD-002 3 22 Per specification >95% lead coverage Pass —
HBM JS-001 1 3 ESD - HBM Classification See data sheet —
CDM JS-002 1 3 ESD - CDM Classification See data sheet —
LU JESD78 1 3 Latch-up Per JESD78 Pass As applicable per JESD78
MSL J-STD-020 — — Per J-STD-020 Classification See data sheet —

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (2Q2025 - 1Q2026) Sample Size Cumulative Sample Size Disposition
Power BICMOS High temperature reverse bias 125C, 1000 Hours or Equivalent JEDEC Condition 462 462 Pass
Power BICMOS Life test 125C, 1000 Hours or Equivalent JEDEC Condition 26863 448101 Pass
Assembly process reliability data
Package Family Reliability Test Rolling Year (2Q2025 - 1Q2026) Sample Size Cumulative Sample Size Disposition
SOP/SOT Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 8070 116429 Pass
SOP/SOT High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 6141 91581 Pass
SOP/SOT Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 18991 217593 Pass
SOP/SOT Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 11781 174771 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.