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Quality, reliability & packaging data download

TMP6331DECR ACTIVE

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Quality data will change based on assembly site

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Rating

Catalog
RoHS Yes
REACH Yes
Device Marking HC
Lead finish/Ball material NiPdAu
MSL rating/Peak reflow Level-1-260C-UNLIM

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
7.47x109 0.1 55 60 0.7 125 1000 87285 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Precious Metals
Gold
7440-57-5
0.002958
100.000000
1000000
0.334649
3346
Sub-total
— —
0.002958
100
1000000
0.334649
3346
Die Attach Adhesive
Other Inorganic Materials
Aluminum Oxide
1344-28-1
0.003285
30.000000
300000
0.371644
3716
Other Inorganic Materials
Silica
7631-86-9
0.000493
4.502283
45023
0.055775
558
Other Organic Materials
Chlorine
7782-50-5
0.000004
0.036530
365
0.000453
5
Thermoplastics
Epoxy
85954-11-6
0.007168
65.461187
654612
0.810941
8109
Sub-total
— —
0.010950
100
1000000
1.238813
12388
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
0.432608
98.320000
983200
48.942484
489425
Magnesium and Its Alloys
Magnesium
7439-95-4
0.00066
0.150000
1500
0.074668
747
Nickel and Its Alloys
Nickel
7440-02-0
0.003916
0.890000
8900
0.443031
4430
Other Inorganic Materials
Silicon
7440-21-3
0.002816
0.640000
6400
0.318584
3186
Sub-total
— —
0.440000
100
1000000
49.778767
497788
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
0.04756
95.120000
951200
5.380632
53806
Precious Metals
Gold
7440-57-5
0.00039
0.780000
7800
0.044122
441
Precious Metals
Palladium
7440-05-3
0.00205
4.100000
41000
0.231924
2319
Sub-total
— —
0.05000
100
1000000
5.656678
56567
Mold Compound
Other Inorganic Materials
Fused Silica
60676-86-0
0.296478
90.500000
905000
33.541612
335416
Other Organic Materials
Carbon Black
1333-86-4
0.001638
0.500000
5000
0.185313
1853
Thermoplastics
Epoxy
85954-11-6
0.029484
9.000000
90000
3.335630
33356
Sub-total
— —
0.327600
100
1000000
37.062555
370626
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
0.052403
100.000000
1000000
5.928538
59285
Sub-total
— —
0.052403
100
1000000
5.928538
59285
Total
— —
0.883911
— —
100
1000000

Qualification summary

Stress Reference Min lot qty SS / lot Condition Duration Result Notes
HTOL JESD22-A108 3 77 Life test, 125C 1000 hours Pass Or equivalent JEDEC condition
HTSL JESD22-A103 3 25 High temp storage bake, 150C 1000 hours Pass Or equivalent JEDEC condition
AC/UHAST JESD22-A102/JESD22-A118 3 25 Unbiased HAST 130C / 85% RH 96 hours Pass Or equivalent JEDEC condition
THB/HAST JESD22-A101/JESD22-A110 3 25 HAST 130C/85%RH 96 hours Pass Or equivalent JEDEC condition
TC JESD22-A104 3 25 Temperature cycle -65/150C 500 cycles Pass Or equivalent JEDEC condition
SD J-STD-002 3 22 Per specification >95% lead coverage Pass —
HBM JS-001 1 3 ESD - HBM Classification See data sheet —
CDM JS-002 1 3 ESD - CDM Classification See data sheet —
LU JESD78 1 3 Latch-up Per JESD78 Pass As applicable per JESD78
MSL J-STD-020 — — Per J-STD-020 Classification See data sheet —

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (2Q2025 - 1Q2026) Sample Size Cumulative Sample Size Disposition
Power BICMOS High temperature gate bias 150C, 1000 Hours or Equivalent JEDEC Condition 0 924 Pass
Power BICMOS High temperature reverse bias 125C, 1000 Hours or Equivalent JEDEC Condition 462 1386 Pass
Power BICMOS Life test 125C, 1000 Hours or Equivalent JEDEC Condition 26863 452952 Pass
Assembly process reliability data
Package Family Reliability Test Rolling Year (2Q2025 - 1Q2026) Sample Size Cumulative Sample Size Disposition
SON Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 4172 79099 Pass
SON High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 3548 59238 Pass
SON Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 11412 144442 Pass
SON Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 6933 117757 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.