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Quality, reliability & packaging data download

TMUX1102DBVR ACTIVE

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Rating

Catalog
RoHS Yes
REACH Yes
Device Marking 1W3F
Lead finish/Ball material NiPdAu
MSL rating/Peak reflow Level-1-260C-UNLIM

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
1x1010 0.1 55 60 0.7 125 1000 183306 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.021501
96.668465
966685
0.102169
1022
Precious Metals
Gold
7440-57-5
0.000121
0.544016
5440
0.000575
6
Precious Metals
Palladium
7440-05-3
0.00062
2.787519
27875
0.002946
29
Sub-total
— —
0.022242
100
1000000
0.105690
1057
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.027735
75.000000
750000
0.131792
1318
Thermoplastics
Epoxy
85954-11-6
0.009245
25.000000
250000
0.043931
439
Sub-total
— —
0.036980
100
1000000
0.175723
1757
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
8.318842
97.707787
977078
39.529727
395297
Copper and Its Alloys
Iron
7439-89-6
0.189437
2.225006
22250
0.900173
9002
Copper and Its Alloys
Phosphorus
7723-14-0
0.005245
0.061604
616
0.024923
249
Zinc and Its Alloys
Zinc
7440-66-6
0.000477
0.005603
56
0.002267
23
Sub-total
— —
8.514001
100
1000000
40.457089
404571
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
0.19024
95.120000
951200
0.903988
9040
Precious Metals
Gold
7440-57-5
0.00156
0.780000
7800
0.007413
74
Precious Metals
Palladium
7440-05-3
0.0082
4.100000
41000
0.038965
390
Sub-total
— —
0.20000
100
1000000
0.950366
9504
Mold Compound
Other Inorganic Materials
Fused Silica
60676-86-0
10.721815
87.999998
880000
50.948247
509482
Other Organic Materials
Carbon Black
1333-86-4
0.036552
0.300003
3000
0.173689
1737
Other Organic Materials
Chlorine
7782-50-5
0.000122
0.001001
10
0.000580
6
Thermoplastics
Epoxy
85954-11-6
1.425392
11.698998
116990
6.773221
67732
Sub-total
— —
12.183881
100
1000000
57.895736
578957
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
0.087418
100.000000
1000000
0.415396
4154
Sub-total
— —
0.087418
100
1000000
0.415396
4154
Total
— —
21.044522
— —
100
1000000

Qualification summary

Stress Reference Min lot qty SS / lot Condition Duration Result Notes
HTOL JESD22-A108 3 77 Life test, 125C 1000 hours Pass Or equivalent JEDEC condition
HTSL JESD22-A103 3 25 High temp storage bake, 150C 1000 hours Pass Or equivalent JEDEC condition
AC/UHAST JESD22-A102/JESD22-A118 3 25 Unbiased HAST 130C / 85% RH 96 hours Pass Or equivalent JEDEC condition
THB/HAST JESD22-A101/JESD22-A110 3 25 HAST 130C/85%RH 96 hours Pass Or equivalent JEDEC condition
TC JESD22-A104 3 25 Temperature cycle -65/150C 500 cycles Pass Or equivalent JEDEC condition
SD J-STD-002 3 22 Per specification >95% lead coverage Pass —
HBM JS-001 1 3 ESD - HBM Classification See data sheet —
CDM JS-002 1 3 ESD - CDM Classification See data sheet —
LU JESD78 1 3 Latch-up Per JESD78 Pass As applicable per JESD78
MSL J-STD-020 — — Per J-STD-020 Classification See data sheet —

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (3Q2025 - 2Q2026) Sample Size Cumulative Sample Size Disposition
Power BICMOS High temperature gate bias 150C, 1000 Hours or Equivalent JEDEC Condition 924 924 Pass
Power BICMOS High temperature reverse bias 125C, 1000 Hours or Equivalent JEDEC Condition 1386 1386 Pass
Power BICMOS Life test 125C, 1000 Hours or Equivalent JEDEC Condition 28776 456997 Pass
Assembly process reliability data
Package Family Reliability Test Rolling Year (3Q2025 - 2Q2026) Sample Size Cumulative Sample Size Disposition
SOP/SOT Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 6997 118051 Pass
SOP/SOT High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 5697 91846 Pass
SOP/SOT Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 14164 219521 Pass
SOP/SOT Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 9936 175701 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.