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TNETE2201BPJD ACTIVE

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Rating

Catalog
RoHS Yes
REACH Yes
Device Marking TNETE2201B
Lead finish/Ball material NiPdAu
MSL rating/Peak reflow Level-3-260C-168 HR

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
3.49x108 2.9 55 60 0.7 125 1000 4079 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Iron
7439-89-6
0.000002
0.000175
2
0.000001
0
Magnesium and Its Alloys
Magnesium
7439-95-4
0.000001
0.000087
1
0.000000
0
Other Nonferrous Metals and Alloys
Beryllium
7440-41-7
0.000001
0.000087
1
0.000000
0
Other Nonferrous Metals and Alloys
Calcium
7440-70-2
0.000003
0.000262
3
0.000001
0
Other Nonferrous Metals and Alloys
Yttrium
7440-65-5
0.000008
0.000700
7
0.000003
0
Precious Metals
Gold
7440-57-5
1.143389
99.997639
999976
0.455703
4557
Precious Metals
Silver
7440-22-4
0.000012
0.001049
10
0.000005
0
Sub-total
— —
1.143416
100
1000000
0.455714
4557
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
1.327739
70.000000
700000
0.529176
5292
Thermoplastics
Epoxy
85954-11-6
0.569031
30.000000
300000
0.226790
2268
Sub-total
— —
1.896770
100
1000000
0.755966
7560
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
84.389535
97.425000
974250
33.633827
336338
Copper and Its Alloys
Iron
7439-89-6
2.07888
2.400000
24000
0.828547
8285
Copper and Its Alloys
Phosphorus
7723-14-0
0.012993
0.015000
150
0.005178
52
Other Nonferrous Metals and Alloys
Lead
7439-92-1
0.025986
0.030000
300
0.010357
104
Other Nonferrous Metals and Alloys
Tin
7440-31-5
0.025986
0.030000
300
0.010357
104
Zinc and Its Alloys
Zinc
7440-66-6
0.08662
0.100000
1000
0.034523
345
Sub-total
— —
86.620000
100
1000000
34.522789
345228
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
1.489579
95.119987
951200
0.593678
5937
Precious Metals
Gold
7440-57-5
0.012215
0.780013
7800
0.004868
49
Precious Metals
Palladium
7440-05-3
0.064206
4.100000
41000
0.025590
256
Sub-total
— —
1.566000
100
1000000
0.624136
6241
Mold Compound
Not Categorized
Phenolic Resin
9003-35-4
4.453797
3.000000
30000
1.775081
17751
Other Inorganic Materials
Fused Silica
60676-86-0
132.129305
89.000000
890000
52.660726
526607
Other Organic Materials
Carbon Black
1333-86-4
0.742299
0.500000
5000
0.295847
2958
Thermoplastics
Epoxy
85954-11-6
11.134492
7.500000
75000
4.437702
44377
Sub-total
— —
148.459893
100
1000000
59.169355
591694
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
11.220649
100.000000
1000000
4.472040
44720
Sub-total
— —
11.220649
100
1000000
4.472040
44720
Total
— —
250.906728
— —
100
1000000

Qualification summary

Stress Reference Min lot qty SS / lot Condition Duration Result Notes
HTOL JESD22-A108 3 77 Life test, 125C 1000 hours Pass Or equivalent JEDEC condition
HTSL JESD22-A103 3 25 High temp storage bake, 150C 1000 hours Pass Or equivalent JEDEC condition
AC/UHAST JESD22-A102/JESD22-A118 3 25 Unbiased HAST 130C / 85% RH 96 hours Pass Or equivalent JEDEC condition
THB/HAST JESD22-A101/JESD22-A110 3 25 HAST 130C/85%RH 96 hours Pass Or equivalent JEDEC condition
TC JESD22-A104 3 25 Temperature cycle -65/150C 500 cycles Pass Or equivalent JEDEC condition
SD J-STD-002 3 22 Per specification >95% lead coverage Pass —
HBM JS-001 1 3 ESD - HBM Classification See data sheet —
CDM JS-002 1 3 ESD - CDM Classification See data sheet —
LU JESD78 1 3 Latch-up Per JESD78 Pass As applicable per JESD78
MSL J-STD-020 — — Per J-STD-020 Classification See data sheet —

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Cumulative Sample Size Disposition
BICMOS Life test 125C, 1000 Hours or Equivalent JEDEC Condition 6549 Pass
Assembly process reliability data
Package Family Reliability Test Rolling Year (2Q2025 - 1Q2026) Sample Size Cumulative Sample Size Disposition
QFP (with Thermal Pad) Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 2541 38024 Pass
QFP (with Thermal Pad) High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 1994 32037 Pass
QFP (with Thermal Pad) Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 3850 75323 Pass
QFP (with Thermal Pad) Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 2772 56262 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.