Home  >  Quality & reliability  >  Quality, reliability & packaging data download

Quality, reliability & packaging data download

TPS73233DBVT ACTIVE

By using this tool to “search” or “download”, you agree to TI’s terms of use, privacy policy (including cookie policy), and important notice.

Search more parts

Filter between the data types to view or download

Quality data will change based on assembly site

Download .xls Download PDF

Rating

Catalog
RoHS Yes
RoHS Yes
RoHS Yes
REACH Yes
REACH Yes
REACH Yes
Device Marking T40
Lead finish/Ball material NiPdAu
Lead finish/Ball material NiPdAu
Lead finish/Ball material Sn
MSL rating/Peak reflow Level-1-260C-UNLIM
MSL rating/Peak reflow Level-1-260C-UNLIM
MSL rating/Peak reflow Level-1-260C-UNLIM

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
8.71x109 0.1 55 60 0.7 125 1000 101758 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Precious Metals
Gold
7440-57-5
0.066987
99.998507
999985
0.330069
3301
Precious Metals
Silver
7440-22-4
0.000001
0.001493
15
0.000005
0
Sub-total
— —
0.066988
100
1000000
0.330074
3301
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.16559
74.999887
749999
0.815922
8159
Thermoplastics
Epoxy
85954-11-6
0.055197
25.000113
250001
0.271976
2720
Sub-total
— —
0.220787
100
1000000
1.087897
10879
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
7.80776
97.597000
975970
38.471659
384717
Copper and Its Alloys
Iron
7439-89-6
0.1784
2.230000
22300
0.879041
8790
Copper and Its Alloys
Phosphorus
7723-14-0
0.0028
0.035000
350
0.013797
138
Zinc and Its Alloys
Zinc
7440-66-6
0.01104
0.138000
1380
0.054398
544
Sub-total
— —
8.00000
100
1000000
39.418895
394189
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
0.085608
95.120000
951200
0.421822
4218
Precious Metals
Gold
7440-57-5
0.000702
0.780000
7800
0.003459
35
Precious Metals
Palladium
7440-05-3
0.00369
4.100000
41000
0.018182
182
Sub-total
— —
0.090000
100
1000000
0.443463
4435
Mold Compound
Other Inorganic Materials
Fused Silica
60676-86-0
9.644739
86.999999
870000
47.523119
475231
Other Organic Materials
Carbon Black
1333-86-4
0.011086
0.100001
1000
0.054625
546
Thermoplastics
Epoxy
85954-11-6
1.430082
12.900000
129000
7.046531
70465
Sub-total
— —
11.085907
100
1000000
54.624275
546243
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
0.831154
100.000000
1000000
4.095396
40954
Sub-total
— —
0.831154
100
1000000
4.095396
40954
Total
— —
20.294836
— —
100
1000000
Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Precious Metals
Gold
7440-57-5
0.066987
100.000000
1000000
0.362656
3627
Sub-total
— —
0.066987
100
1000000
0.362656
3627
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.219449
80.000073
800001
1.188060
11881
Thermoplastics
Epoxy
85954-11-6
0.054862
19.999927
199999
0.297014
2970
Sub-total
— —
0.274311
100
1000000
1.485074
14851
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
6.292686
97.410000
974100
34.067550
340676
Copper and Its Alloys
Iron
7439-89-6
0.153748
2.380000
23800
0.832366
8324
Copper and Its Alloys
Phosphorus
7723-14-0
0.005426
0.083994
840
0.029375
294
Zinc and Its Alloys
Zinc
7440-66-6
0.00814
0.126006
1260
0.044069
441
Sub-total
— —
6.460000
100
1000000
34.973360
349734
Lead Frame Plating
Nickel and Its Alloys
Nickel
7440-02-0
0.110339
95.119828
951198
0.597357
5974
Precious Metals
Gold
7440-57-5
0.000905
0.780172
7802
0.004900
49
Precious Metals
Palladium
7440-05-3
0.004756
4.100000
41000
0.025748
257
Sub-total
— —
0.116000
100
1000000
0.628005
6280
Mold Compound
Other Inorganic Materials
Fused Silica
60676-86-0
9.221565
86.000000
860000
49.924011
499240
Other Organic Materials
Carbon Black
1333-86-4
0.053614
0.500002
5000
0.290257
2903
Thermoplastics
Epoxy
85954-11-6
1.447571
13.499998
135000
7.836907
78369
Sub-total
— —
10.722750
100
1000000
58.051176
580512
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
0.831154
100.000000
1000000
4.499729
44997
Sub-total
— —
0.831154
100
1000000
4.499729
44997
Total
— —
18.471202
— —
100
1000000
Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys
Copper
7440-50-8
0.032276
97.534147
975341
0.179893
1799
Not Categorized
Proprietary Materials
—
0.000004
0.012088
121
0.000022
0
Precious Metals
Gold
7440-57-5
0.000017
0.051372
514
0.000095
1
Precious Metals
Palladium
7440-05-3
0.000794
2.399371
23994
0.004425
44
Precious Metals
Silver
7440-22-4
0.000001
0.003022
30
0.000006
0
Sub-total
— —
0.033092
100
1000000
0.184441
1844
Die Attach Adhesive
Precious Metals
Silver
7440-22-4
0.107944
80.000000
800000
0.601636
6016
Thermoplastics
Epoxy
85954-11-6
0.026986
20.000000
200000
0.150409
1504
Sub-total
— —
0.134930
100
1000000
0.752045
7520
Lead Frame
Copper and Its Alloys
Copper
7440-50-8
5.31834
97.050000
970500
29.642284
296423
Copper and Its Alloys
Iron
7439-89-6
0.14248
2.600000
26000
0.794126
7941
Copper and Its Alloys
Phosphorus
7723-14-0
0.00822
0.150000
1500
0.045815
458
Zinc and Its Alloys
Zinc
7440-66-6
0.01096
0.200000
2000
0.061087
611
Sub-total
— —
5.48000
100
1000000
30.543311
305433
Lead Frame Plating
Other Nonferrous Metals and Alloys
Tin
7440-31-5
0.05
100.000000
1000000
0.278680
2787
Sub-total
— —
0.05
100
1000000
0.278680
2787
Mold Compound
Other Inorganic Materials
Fused Silica
60676-86-0
10.564296
87.999999
880000
58.881128
588811
Other Organic Materials
Carbon Black
1333-86-4
0.036015
0.300003
3000
0.200733
2007
Other Organic Materials
Chlorine
7782-50-5
0.00012
0.001000
10
0.000669
7
Thermoplastics
Epoxy
85954-11-6
1.404451
11.698999
116990
7.827844
78278
Sub-total
— —
12.004882
100
1000000
66.910374
669104
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
0.238831
100.000000
1000000
1.331148
13311
Sub-total
— —
0.238831
100
1000000
1.331148
13311
Total
— —
17.941735
— —
100
1000000

Qualification summary

Stress Reference Min lot qty SS / lot Condition Duration Result Notes
HTOL JESD22-A108 3 77 Life test, 125C 1000 hours Pass Or equivalent JEDEC condition
HTSL JESD22-A103 3 25 High temp storage bake, 150C 1000 hours Pass Or equivalent JEDEC condition
AC/UHAST JESD22-A102/JESD22-A118 3 25 Unbiased HAST 130C / 85% RH 96 hours Pass Or equivalent JEDEC condition
THB/HAST JESD22-A101/JESD22-A110 3 25 HAST 130C/85%RH 96 hours Pass Or equivalent JEDEC condition
TC JESD22-A104 3 25 Temperature cycle -65/150C 500 cycles Pass Or equivalent JEDEC condition
SD J-STD-002 3 22 Per specification >95% lead coverage Pass —
HBM JS-001 1 3 ESD - HBM Classification See data sheet —
CDM JS-002 1 3 ESD - CDM Classification See data sheet —
LU JESD78 1 3 Latch-up Per JESD78 Pass As applicable per JESD78
MSL J-STD-020 — — Per J-STD-020 Classification See data sheet —

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (3Q2025 - 2Q2026) Sample Size Cumulative Sample Size Disposition
Power BICMOS High temperature gate bias 150C, 1000 Hours or Equivalent JEDEC Condition 924 924 Pass
Power BICMOS High temperature reverse bias 125C, 1000 Hours or Equivalent JEDEC Condition 1386 1386 Pass
Power BICMOS Life test 125C, 1000 Hours or Equivalent JEDEC Condition 28776 456227 Pass
Assembly process reliability data
Package Family Reliability Test Rolling Year (3Q2025 - 2Q2026) Sample Size Cumulative Sample Size Disposition
SOP/SOT Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 6997 117358 Pass
SOP/SOT High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 5697 91801 Pass
SOP/SOT Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 14164 218982 Pass
SOP/SOT Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 9936 175624 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

Close

Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.